- Analog IC - Other Type
- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Number of Channels
- Number of Functions
- Number of Terminals
- Off-state Isolation-Nom
- Operating Temperature-Max
- Package Body Material
- Package Code
- Package Description
Attribute column
Manufacturer
pSemi Interface - Analog Switches, Multiplexers, Demultiplexers
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Ihs Manufacturer | Manufacturer Package Code | Moisture Sensitivity Levels | On-state Resistance-Max (Ron) | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Output | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Channels | Number of Circuits | Analog IC - Other Type | Seated Height-Max | Supply Current-Max (Isup) | Neg Supply Voltage-Nom (Vsup) | -3db Bandwidth | On-State Resistance (Max) | Screening Level | Multiplexer/Demultiplexer Circuit | Off-state Isolation-Nom | Neg Supply Voltage-Max (Vsup) | Current - Leakage (IS(off)) (Max) | Channel Capacitance (CS(off), CD(off)) | On-state Resistance Match-Nom | Switch Circuit | Switch Time (Ton, Toff) (Max) | Channel-to-Channel Matching (ΔRon) | Switching | Switch-on Time-Max | Switch-off Time-Max | Voltage - Supply, Single (V+) | Normal Position | Signal Current-Max | Neg Supply Voltage-Min (Vsup) | Length | Width |
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 HEF4066 BT.653 pSemi | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
74HCT4052PW/S400 NXP Semiconductors | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 74LVC1G53GM NXP Semiconductors | In Stock | - | Datasheet | - | - | YES | - | 8 | - | NXP SEMICONDUCTORS | - | 1 | 195 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | VSON | VSON, LCC8,.06SQ,20 | LCC8,.06SQ,20 | SQUARE | SMALL OUTLINE, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 30 | - | 8 | S-PDSO-N8 | Not Qualified | 5.5 V | AUTOMOTIVE | 1.65 V | 2 | - | SINGLE-ENDED MULTIPLEXER | 0.5 mm | 0.04 mA | - | - | - | - | - | 40 dB | - | - | - | - | - | - | - | - | 12.9 ns | 12.5 ns | - | - | - | - | 1.6 mm | 1.6 mm | ||
 74HCT4053BQ NXP Semiconductors | In Stock | - | Datasheet | - | - | YES | - | 16 | - | NXP SEMICONDUCTORS | - | 1 | 180 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, LCC16,.1X.14,20 | LCC16,.1X.14,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 4.5 V | - | - | - | e4 | - | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 8542.39.00.01 | QUAD | NO LEAD | 260 | 3 | 0.5 mm | compliant | 30 | - | 16 | R-PQCC-N16 | Not Qualified | 5.5 V | AUTOMOTIVE | 4.5 V | 1 | - | SPDT | 1 mm | 0.16 mA | -5 V | - | - | - | - | 50 dB | - | - | - | 9 Ω | - | - | - | BREAK-BEFORE-MAKE | 48 ns | 44 ns | - | - | 0.025 A | - | 3.5 mm | 2.5 mm | ||
 74HC4352D NXP Semiconductors | In Stock | - | Datasheet | - | - | YES | - | 20 | - | NXP SEMICONDUCTORS | - | - | 160 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | - | 6 V | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | DUAL | GULL WING | - | 1 | - | unknown | - | - | 20 | R-PDSO-G20 | Not Qualified | 5 V | AUTOMOTIVE | 1 V | 4 | - | DIFFERENTIAL MULTIPLEXER | - | - | - | - | - | - | - | 50 dB | -5 V | - | - | 8 Ω | - | - | - | - | 55 ns | 34 ns | - | - | - | -1 V | - | - | ||
HEF4051BDB NXP Semiconductors | In Stock | - | Datasheet | - | - | NO | - | 16 | - | NXP SEMICONDUCTORS | - | - | 175 Ω | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | - | - | 15 V | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | - | - | R-GDIP-T16 | Not Qualified | - | INDUSTRIAL | - | 8 | - | SINGLE-ENDED MULTIPLEXER | 5.08 mm | 0.6 mA | - | - | - | - | - | 50 dB | - | - | - | 5 Ω | - | - | - | - | 80 ns | 230 ns | - | - | - | - | - | 7.62 mm | ||
 HEF4066BTD NXP Semiconductors | In Stock | - | Datasheet | - | - | YES | - | 14 | - | NXP SEMICONDUCTORS | - | - | 175 Ω | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 15 V | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | DUAL | GULL WING | 260 | 4 | 1.27 mm | compliant | 40 | - | 14 | R-PDSO-G14 | Not Qualified | - | INDUSTRIAL | - | 1 | - | SPST | 1.75 mm | - | - | - | - | - | - | 50 dB | - | - | - | 5 Ω | - | - | - | - | 30 ns | 140 ns | - | - | - | - | 8.65 mm | 3.9 mm | ||
74LVC2G3157GM NXP Semiconductors | In Stock | - | Datasheet | - | - | YES | - | 10 | - | NXP SEMICONDUCTORS | - | - | 195 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | VQCCN | VQCCN, | LCC10,.06X.08,20 | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | Transferred | - | - | 3.3 V | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 2 | 0.5 mm | unknown | - | - | - | R-PQCC-N10 | - | 5.5 V | AUTOMOTIVE | 1.65 V | 1 | - | SPDT | 0.5 mm | - | - | - | - | - | - | 42 dB | - | - | - | - | - | - | - | - | 26.5 ns | 14.5 ns | - | - | - | - | 2 mm | 1.55 mm | ||
 74HC4066DB NXP Semiconductors | In Stock | - | Datasheet | - | - | YES | - | 14 | - | NXP SEMICONDUCTORS | - | 1 | 142 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | SSOP | SSOP, SSOP14,.3 | SSOP14,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Transferred | SSOP | Yes | 4.5 V | - | - | - | e4 | Yes | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 8542.39.00.01 | DUAL | GULL WING | 260 | 4 | 0.65 mm | unknown | 30 | SEPARATE OUTPUT | 14 | R-PDSO-G14 | Not Qualified | 10 V | AUTOMOTIVE | 2 V | 1 | - | SPST | 2 mm | - | - | - | - | - | - | 50 dB | - | - | - | 5 Ω | - | - | - | MAKE-BEFORE-BREAK | 30 ns | 45 ns | - | NO | - | - | 6.2 mm | 5.3 mm | ||
74HC4051PW NXP Semiconductors | In Stock | - | - | - | - | YES | - | 16 | - | NXP SEMICONDUCTORS | - | 1 | 180 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | TSSOP | Yes | 5 V | - | - | - | e4 | Yes | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES ON VCC-VEE 2 V TO 10 V SUPPLY | 8542.39.00.01 | DUAL | GULL WING | 260 | 1 | 0.65 mm | unknown | 30 | - | 16 | R-PDSO-G16 | Not Qualified | 10 V | AUTOMOTIVE | 2 V | 8 | - | SINGLE-ENDED MULTIPLEXER | 1.1 mm | 0.32 mA | - | - | - | - | - | 50 dB | - | - | - | 9 Ω | - | - | - | BREAK-BEFORE-MAKE | 104 ns | 87 ns | - | - | 0.025 A | - | 5 mm | 4.4 mm | ||
 74HC4052D NXP Semiconductors | In Stock | - | Datasheet | - | - | YES | - | 16 | - | NXP SEMICONDUCTORS | - | 1 | 195 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | 3.90 MM, 1.47 MM THICKNESS, MS-012AC, SOT-109-3, PLASTIC, SO-16 | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | Yes | 5 V | - | - | - | e4 | Yes | - | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 8542.39.00.01 | DUAL | GULL WING | 260 | 1 | 1.27 mm | unknown | 30 | - | 16 | R-PDSO-G16 | Not Qualified | 10 V | AUTOMOTIVE | 2 V | 4 | - | DIFFERENTIAL MULTIPLEXER | 1.75 mm | - | -4.5 V | - | - | - | - | 50 dB | -5 V | - | - | 6 Ω | - | - | - | BREAK-BEFORE-MAKE | 69 ns | 57 ns | - | - | 0.025 A | -1 V | 9.9 mm | 3.9 mm | ||
 74HC4051PW-T NXP Semiconductors | In Stock | - | Datasheet | - | - | YES | - | 16 | - | NXP SEMICONDUCTORS | - | 1 | 180 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | Yes | 5 V | - | - | - | e4 | - | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES ON VCC-VEE 2 V TO 10 V SUPPLY | 8542.39.00.01 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | unknown | NOT SPECIFIED | - | 16 | R-PDSO-G16 | Not Qualified | 10 V | AUTOMOTIVE | 2 V | 8 | - | SINGLE-ENDED MULTIPLEXER | 1.1 mm | - | - | - | - | - | - | 50 dB | - | - | - | 9 Ω | - | - | - | - | 104 ns | 87 ns | - | - | - | - | 5 mm | 4.4 mm | ||
74LVC1G3157GW-Q100 NXP Semiconductors | In Stock | - | Datasheet | - | - | YES | - | 6 | - | NXP SEMICONDUCTORS | - | 1 | 195 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | SC-88, 6 PIN | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | - | Yes | 3.3 V | - | - | - | e3 | - | - | - | Tin (Sn) | - | 8542.39.00.01 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | unknown | NOT SPECIFIED | - | - | R-PDSO-G6 | - | 5.5 V | AUTOMOTIVE | 1.65 V | 2 | - | SINGLE-ENDED MULTIPLEXER | 1.1 mm | - | - | - | - | AEC-Q100 | - | 42 dB | - | - | - | - | - | - | - | - | 22 ns | 11.7 ns | - | - | - | - | 2 mm | 1.25 mm | ||
 TDA8440/C3 NXP Semiconductors | In Stock | - | Datasheet | - | - | NO | - | 18 | - | NXP SEMICONDUCTORS | - | - | - | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | - | 12 V | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | - | 18 | R-PDIP-T18 | Not Qualified | 13.2 V | COMMERCIAL | 10 V | 3 | - | CROSS POINT SWITCH | 4.7 mm | - | - | - | - | - | - | 90 dB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 21.6 mm | 7.62 mm | ||
 74HC4053DB NXP Semiconductors | In Stock | - | Datasheet | - | - | YES | - | 16 | - | NXP SEMICONDUCTORS | - | 1 | 160 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | SSOP | 5.30 MM, PLASTIC, MO-150, SOT338-1, SSOP-16 | SOP16,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Transferred | SSOP | Yes | 5 V | - | - | - | e4 | Yes | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 8542.39.00.01 | DUAL | GULL WING | 260 | 3 | 0.65 mm | unknown | 30 | - | 16 | R-PDSO-G16 | Not Qualified | 10 V | AUTOMOTIVE | 2 V | 1 | - | SINGLE-ENDED MULTIPLEXER | 2 mm | 0.16 mA | - | - | - | - | - | 50 dB | - | - | - | 8 Ω | - | - | - | BREAK-BEFORE-MAKE | 37 ns | 36 ns | - | - | 0.025 A | - | 6.2 mm | 5.3 mm | ||
74LVC1G3157GV NXP Semiconductors | In Stock | - | Datasheet | - | - | YES | - | 6 | - | NXP SEMICONDUCTORS | SOT457 | 1 | 38 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | PLASTIC, SC-74, SOT-457, 6 PIN | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | SC-74 | Yes | 2.7 V | - | - | - | e3 | Yes | - | - | Tin (Sn) | - | 8542.39.00.01 | DUAL | GULL WING | 260 | 1 | 0.95 mm | compliant | 30 | - | 6 | R-PDSO-G6 | Not Qualified | 5.5 V | AUTOMOTIVE | 1.65 V | 2 | - | SINGLE-ENDED MULTIPLEXER | 1.1 mm | 0.04 mA | - | - | - | - | - | 42 dB | - | - | - | - | - | - | - | BREAK-BEFORE-MAKE | 6 ns | 5 ns | - | - | 0.05 A | - | 2.9 mm | 1.5 mm | ||
 74HCT4051DB,118 NXP Semiconductors | In Stock | - | Datasheet | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | - | 16-SSOP | - | 74HCT4051 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C ~ 125°C (TA) | Bulk | 74HCT | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 | - | - | - | - | 180MHz | 120Ohm | - | 8:1 | - | - | 400nA | 3.5pF | - | SP8T - Open/Closed | 59ns, 49ns | 6Ohm | - | - | - | 2V ~ 10V | - | - | - | - | - |