- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Telecom IC Type
- Package Description
- JESD-30 Code
- Number of Functions
- Number of Terminals
- Package Body Material
- Package Code
- Package Shape
- Package Style
Attribute column
Manufacturer
pSemi Interface - Telecom
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Seated Height-Max | Screening Level | Telecom IC Type | Number of Transceivers | Make-break Ratio | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 TEA1067T/C2 NXP Semiconductors | In Stock | - | Datasheet | YES | 20 | NXP SEMICONDUCTORS | - | 75 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | - | 2.8 V | - | - | - | - | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 20 | R-PDSO-G20 | Not Qualified | COMMERCIAL EXTENDED | - | 2.65 mm | - | TELEPHONE SPEECH CIRCUIT | - | - | 12.8 mm | 7.5 mm | ||
 PCD3316T NXP Semiconductors | In Stock | - | Datasheet | YES | 16 | NXP SEMICONDUCTORS | - | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.4 | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.3 V | e4 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 16 | R-PDSO-G16 | Not Qualified | OTHER | 2.3 mA | 2.65 mm | - | TELECOM CIRCUIT | - | - | 10.3 mm | 7.5 mm | ||
 TEA1062/C4 NXP Semiconductors | In Stock | - | Datasheet | NO | 16 | NXP SEMICONDUCTORS | - | 75 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 2.7 V | e3 | - | TIN | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 16 | R-PDIP-T16 | Not Qualified | COMMERCIAL EXTENDED | - | 4.32 mm | - | TELEPHONE SPEECH CIRCUIT | - | - | 38.1 mm | 7.62 mm | ||
 NE5750N NXP Semiconductors | In Stock | - | Datasheet | NO | 24 | NXP SEMICONDUCTORS | - | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | - | - | 5 V | - | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | - | unknown | - | R-PDIP-T24 | Not Qualified | COMMERCIAL | - | - | - | TELECOM CIRCUIT | - | - | - | - | ||
CLRC66303HN/TRAYB NXP Semiconductors | In Stock | - | Datasheet | YES | 32 | NXP SEMICONDUCTORS | - | 85 °C | -25 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | - | - | 5 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | - | S-PQCC-N32 | - | OTHER | - | 1 mm | - | TELECOM CIRCUIT | - | - | 5 mm | 5 mm | ||
TJA1021T/10 NXP Semiconductors | In Stock | - | Datasheet | YES | 8 | NXP SEMICONDUCTORS | - | 150 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | - | 12 V | - | - | - | - | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | AUTOMOTIVE | 4 mA | 1.75 mm | AEC-Q100 | LIN TRANSCEIVER | 1 | - | 4.9 mm | 3.9 mm | ||
 PCA82C250U/N4 NXP Semiconductors | In Stock | - | Datasheet | YES | 8 | NXP SEMICONDUCTORS | - | 125 °C | -40 °C | UNSPECIFIED | DIE | DIE, | - | RECTANGULAR | UNCASED CHIP | Obsolete | DIE | - | 5 V | - | - | - | - | 8542.39.00.01 | UPPER | NO LEAD | 1 | - | unknown | 8 | R-XUUC-N8 | Not Qualified | AUTOMOTIVE | - | - | - | INTERFACE CIRCUIT | - | - | - | - | ||
 TEA1095T NXP Semiconductors | In Stock | - | Datasheet | YES | 24 | NXP SEMICONDUCTORS | - | 75 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, SOP24,.4 | SOP24,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e4 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 24 | R-PDSO-G24 | Not Qualified | COMMERCIAL EXTENDED | 3.8 mA | 2.65 mm | - | SPEAKER PHONE CIRCUIT | - | - | 15.4 mm | 7.5 mm | ||
TJA1043TK/1/T NXP Semiconductors | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
PCD3327CP NXP Semiconductors | In Stock | - | Datasheet | NO | 18 | NXP SEMICONDUCTORS | - | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP, | - | RECTANGULAR | IN-LINE | Obsolete | - | - | 3 V | - | - | - | SELECTABLE MAKE/BREAK RATIO 1:2 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | - | R-PDIP-T18 | Not Qualified | OTHER | 0.4 mA | 4.7 mm | - | TELEPHONE DIALER CIRCUIT | - | 1:1.5 | 21.6 mm | 7.62 mm | ||
MC145425DW NXP Semiconductors | In Stock | - | Datasheet | - | - | NXP SEMICONDUCTORS | - | - | - | - | - | , | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | unknown | - | - | - | - | - | - | - | ISDN CONTROLLER | - | - | - | - | ||
SA5217D NXP Semiconductors | In Stock | - | Datasheet | YES | 20 | NXP SEMICONDUCTORS | - | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | PLASTIC, SOT-163-1, SOL-20 | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 5 V | e4 | - | NICKEL PALLADIUM GOLD | - | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 20 | R-PDSO-G20 | Not Qualified | INDUSTRIAL | 13.5 mA | 2.65 mm | - | TELECOM CIRCUIT | - | - | 12.8 mm | 7.5 mm | ||
 TEA1069H NXP Semiconductors | In Stock | - | Datasheet | YES | 44 | NXP SEMICONDUCTORS | 1 | 75 °C | -25 °C | PLASTIC/EPOXY | QFP | PLASTIC, QFP-44 | QFP44,.5SQ,32 | SQUARE | FLATPACK | Obsolete | QFP | No | 2.7 V | - | No | - | 3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | unknown | 44 | S-PQFP-G44 | Not Qualified | COMMERCIAL EXTENDED | 0.0018 mA | 2.1 mm | - | TELEPHONE MULTIFUNCTION CIRCUIT | - | 2:1 | 10 mm | 10 mm | ||
TFF11092HN NXP Semiconductors | In Stock | - | Datasheet | YES | 24 | NXP SEMICONDUCTORS | - | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-1, HVQFN-24 | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | - | - | 3.3 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | - | S-PQCC-N24 | - | INDUSTRIAL | - | 1 mm | - | TELECOM CIRCUIT | - | - | 4 mm | 4 mm | ||
TDA18275AHN/C1 NXP Semiconductors | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
PCF5073H NXP Semiconductors | In Stock | - | Datasheet | YES | 64 | NXP SEMICONDUCTORS | - | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | - | - | 3 V | - | - | - | - | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.4 mm | unknown | - | S-PQFP-G64 | Not Qualified | INDUSTRIAL | - | 1.6 mm | - | RF AND BASEBAND CIRCUIT | - | - | 7 mm | 7 mm | ||
 PN5120A0HN/C2 NXP Semiconductors | In Stock | - | Datasheet | YES | 40 | NXP SEMICONDUCTORS | - | - | - | PLASTIC/EPOXY | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER | Active | QFN | - | 3 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 40 | S-PQCC-N40 | Not Qualified | - | - | 1 mm | - | TELECOM CIRCUIT | - | - | 6 mm | 6 mm | ||
MRFIC1505R2 NXP Semiconductors | In Stock | - | Datasheet | - | - | NXP SEMICONDUCTORS | - | - | - | - | - | , | - | - | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | unknown | - | - | - | - | - | - | - | TELECOM CIRCUIT | - | - | - | - | ||
MC12311 NXP Semiconductors | In Stock | - | - | YES | 60 | NXP SEMICONDUCTORS | - | 85 °C | -40 °C | UNSPECIFIED | VFLGA | 8 X 8 MM, 0.50 MM PITCH, LGA-60 | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | - | - | 3.3 V | - | - | - | - | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.5 mm | unknown | - | S-XBGA-B60 | - | INDUSTRIAL | - | 0.98 mm | - | TELECOM CIRCUIT | - | - | 8 mm | 8 mm | ||
TJA1050 NXP Semiconductors | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |