- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Description
- Package Shape
- Package Style
- Part Life Cycle Code
- Reach Compliance Code
- Surface Mount
- Terminal Form
Attribute column
Manufacturer
RFMD Interface - Telecom
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Manufacturer Package Code | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Seated Height-Max | Telecom IC Type | Number of Transceivers | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 RF9810TR13 RF Micro Devices Inc | 10000 | - | Datasheet | YES | 23 | RF MICRO DEVICES INC | - | - | 85 °C | -30 °C | UNSPECIFIED | BCC | BCC, | - | RECTANGULAR | CHIP CARRIER | Transferred | - | - | 3.5 V | - | - | 5A991.G | - | 8517.62.00.50 | BOTTOM | BUTT | - | 1 | - | unknown | - | - | R-XBCC-B23 | - | OTHER | - | 1.05 mm | RF AND BASEBAND CIRCUIT | - | 6.63 mm | 5.24 mm | ||
 RFFM8200TR7 RF Micro Devices Inc | 2287 | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HQCCN | HQCCN, LCC16,.12SQ,20 | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | QFN | Yes | 3.3 V | - | - | 5A991.G | - | 8517.62.00.50 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 16 | S-XQCC-N16 | Not Qualified | INDUSTRIAL | 0.23 mA | 1.05 mm | TELECOM CIRCUIT | - | 3 mm | 3 mm | ||
 ML4667CQ RF Micro Devices Inc | In Stock | - | Datasheet | YES | 28 | MICRO LINEAR CORP | - | - | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC28,.5SQ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | No | 5 V | e0 | - | - | TIN LEAD | 8542.39.00.01 | QUAD | J BEND | - | 1 | 1.27 mm | unknown | - | 28 | S-PQCC-J28 | Not Qualified | COMMERCIAL | 120 mA | 4.57 mm | ETHERNET TRANSCEIVER | 1 | 11.505 mm | 11.505 mm | ||
RFDA0047 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 32 | RF MICRO DEVICES INC | - | - | - | - | UNSPECIFIED | QCCN | QCCN, | - | SQUARE | CHIP CARRIER | Transferred | MCM | Yes | 5 V | - | Yes | - | - | 8542.39.00.01 | QUAD | NO LEAD | NOT SPECIFIED | 1 | - | compliant | NOT SPECIFIED | 32 | S-XQCC-N32 | - | - | - | - | RF AND BASEBAND CIRCUIT | - | - | - | ||
 RF5725 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | 2 | 70 °C | -10 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.6 V | e3 | - | 5A991.G | Matte Tin (Sn) - annealed | 8517.70.00.00 | QUAD | NO LEAD | 260 | 1 | 0.5 mm | unknown | 30 | 16 | S-XQCC-N16 | Not Qualified | COMMERCIAL | - | 0.55 mm | RF AND BASEBAND CIRCUIT | - | 3 mm | 3 mm | ||
RFDA0045SR RF Micro Devices Inc | In Stock | - | Datasheet | YES | 32 | RF MICRO DEVICES INC | - | 3 | 85 °C | -40 °C | UNSPECIFIED | HQCCN | HQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | MCM | Yes | 5 V | - | Yes | 5A991.G | - | 8542.33.00.01 | QUAD | NO LEAD | - | 1 | 0.5 mm | compliant | - | 32 | S-XQCC-N32 | - | INDUSTRIAL | - | 1.215 mm | RF AND BASEBAND CIRCUIT | - | 5.2 mm | 5.2 mm | ||
 RF7173 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 23 | RF MICRO DEVICES INC | - | 5A | 85 °C | -30 °C | UNSPECIFIED | QCCN | QCCN, LCC22(UNSPEC) | LCC22(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Transferred | MODULE | Yes | 3.6 V | - | Yes | 5A991.G | - | 8517.62.00.50 | UNSPECIFIED | NO LEAD | - | 1 | - | compliant | - | 23 | R-XXMA-N23 | Not Qualified | OTHER | 0.00008 mA | 1.015 mm | RF AND BASEBAND CIRCUIT | - | 6.63 mm | 5.24 mm | ||
 RF9904 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.25 | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | - | - | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | - | 1 | 1.27 mm | unknown | - | 16 | R-PDSO-G16 | Not Qualified | INDUSTRIAL | 0.035 mA | 1.905 mm | TELECOM CIRCUIT | - | 9.9 mm | 3.9 mm | ||
 RF5722 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 8 | RF MICRO DEVICES INC | - | 2 | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | 2.2 X 2.2 MM, 0.45 PITCH, GREEN, QFN-8 | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | e3 | - | 5A991.G | MATTE TIN | 8517.70.00.00 | QUAD | NO LEAD | 260 | 1 | 0.65 mm | unknown | 30 | 8 | S-XQCC-N8 | Not Qualified | OTHER | - | 0.5 mm | TELECOM CIRCUIT | - | 2.2 mm | 2.2 mm | ||
SIW1711FIF RF Micro Devices Inc | In Stock | - | Datasheet | YES | 32 | RF MICRO DEVICES INC | MLF | 1 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | DFN | No | 1.8 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | - | 0.9 mm | TELECOM CIRCUIT | - | 5 mm | 5 mm | ||
RF8889A RF Micro Devices Inc | In Stock | - | Datasheet | YES | 26 | RF MICRO DEVICES INC | - | - | 90 °C | -30 °C | UNSPECIFIED | HQCCN | HQCCN, | - | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | Transferred | - | - | 2.75 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | - | unknown | - | - | R-XQCC-N26 | - | OTHER | - | 0.9 mm | RF AND BASEBAND CIRCUIT | - | 3.8 mm | 3 mm | ||
RFFM8200SQ RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QCCN | QCCN, LCC16,.12SQ,20 | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | Transferred | - | Yes | 3.3 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | - | 0.5 mm | unknown | - | - | S-PQCC-N16 | Not Qualified | INDUSTRIAL | 230 mA | - | - | - | - | - | ||
RFDA3016SR RF Micro Devices Inc | In Stock | - | Datasheet | YES | 28 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | - | , | - | SQUARE | MICROELECTRONIC ASSEMBLY | Transferred | - | - | 5 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | 0.7 mm | unknown | - | - | S-XQMA-N28 | - | INDUSTRIAL | - | 1.25 mm | TELECOM CIRCUIT | - | 6 mm | 6 mm | ||
RFPA5201ESB RF Micro Devices Inc | In Stock | - | Datasheet | YES | 14 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HTSON | HTSON, | - | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | Transferred | - | - | 5 V | - | - | 5A991.G | - | 8542.33.00.01 | DUAL | NO LEAD | - | 1 | - | unknown | - | - | S-XDSO-N14 | - | INDUSTRIAL | - | 1.05 mm | TELECOM CIRCUIT | - | 7 mm | 7 mm | ||
RF6549 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 20 | RF MICRO DEVICES INC | - | - | - | - | UNSPECIFIED | QCCN | QCCN, | - | SQUARE | CHIP CARRIER | Transferred | - | - | 4.2 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | - | unknown | - | - | S-XQCC-N20 | - | - | - | - | TELECOM CIRCUIT | - | - | - | ||
RFFC2071SB RF Micro Devices Inc | In Stock | - | Datasheet | YES | 32 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3 V | - | Yes | 5A991.G | - | 8517.70.00.00 | QUAD | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | - | 1 mm | TELECOM CIRCUIT | - | 5 mm | 5 mm | ||
 RFFC2072SB RF Micro Devices Inc | In Stock | - | Datasheet | YES | 32 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3 V | - | Yes | 5A991.G | - | 8517.70.00.00 | QUAD | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | - | 1 mm | TELECOM CIRCUIT | - | 5 mm | 5 mm | ||
RDA2032ZSR RF Micro Devices Inc | In Stock | - | Datasheet | YES | 32 | RF MICRO DEVICES INC | - | 3 | 85 °C | -40 °C | UNSPECIFIED | HQCCN | HQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | MCM | Yes | 5 V | - | - | 5A991.G | - | 8542.33.00.01 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | - | 1.36 mm | RF AND BASEBAND CIRCUIT | - | 5.2 mm | 5.2 mm | ||
RFFM4501SB RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | - | 70 °C | -10 °C | UNSPECIFIED | - | , | - | SQUARE | MICROELECTRONIC ASSEMBLY | Transferred | - | - | 5 V | - | - | 5A991.G | - | 8517.62.00.50 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | - | S-XQMA-N16 | - | COMMERCIAL | - | 1.05 mm | TELECOM CIRCUIT | - | 3 mm | 3 mm | ||
 RF6515 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 20 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, LCC20,.14SQ,20 | LCC20,.14SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | - | - | EAR99 | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 20 | S-XQCC-N20 | Not Qualified | INDUSTRIAL | - | 0.5 mm | TELECOM CIRCUIT | - | 3.5 mm | 3.5 mm |