- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Description
- Package Shape
- Package Style
- Part Life Cycle Code
- Reach Compliance Code
- Surface Mount
- Terminal Form
Attribute column
Manufacturer
RFMD Interface - Telecom
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Manufacturer Package Code | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Seated Height-Max | Telecom IC Type | Number of Transceivers | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 RF5516SB RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | - | 70 °C | -10 °C | PLASTIC/EPOXY | VQCCN | VQCCN, | - | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Transferred | QFN | - | 3.3 V | - | - | 5A991.G | - | 8517.70.00.00 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 16 | S-PQCC-N16 | - | COMMERCIAL | - | 0.5 mm | RF AND BASEBAND CIRCUIT | - | 3 mm | 3 mm | ||
 SIW1711FIF RF Micro Devices Inc | In Stock | - | Datasheet | YES | 32 | RF MICRO DEVICES INC | MLF | 1 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | DFN | No | 1.8 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | - | 0.9 mm | TELECOM CIRCUIT | - | 5 mm | 5 mm | ||
 RF9904 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.25 | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | - | - | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | - | 1 | 1.27 mm | unknown | - | 16 | R-PDSO-G16 | Not Qualified | INDUSTRIAL | 0.035 mA | 1.905 mm | TELECOM CIRCUIT | - | 9.9 mm | 3.9 mm | ||
 RF5722 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 8 | RF MICRO DEVICES INC | - | 2 | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | 2.2 X 2.2 MM, 0.45 PITCH, GREEN, QFN-8 | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | e3 | - | 5A991.G | MATTE TIN | 8517.70.00.00 | QUAD | NO LEAD | 260 | 1 | 0.65 mm | unknown | 30 | 8 | S-XQCC-N8 | Not Qualified | OTHER | - | 0.5 mm | TELECOM CIRCUIT | - | 2.2 mm | 2.2 mm | ||
 RF7170TR7 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 23 | RF MICRO DEVICES INC | - | 5A | - | - | UNSPECIFIED | BCC | BCC, LCC22,.2X.26,40/36 | LCC22,.2X.26,40/36 | RECTANGULAR | CHIP CARRIER | Transferred | QFN | Yes | 3.5 V | - | - | 5A991.G | - | 8517.62.00.50 | BOTTOM | BUTT | - | 1 | 0.91 mm | compliant | - | 22 | R-XBCC-B23 | Not Qualified | - | 0.00008 mA | 1.015 mm | RF AND BASEBAND CIRCUIT | - | 6.63 mm | 5.24 mm | ||
 RF6514SR RF Micro Devices Inc | In Stock | - | Datasheet | YES | 28 | RF MICRO DEVICES INC | - | - | 70 °C | -30 °C | UNSPECIFIED | HBCC | HBCC, | - | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | Transferred | LGA | - | 3.6 V | - | - | EAR99 | - | 8517.62.00.50 | BOTTOM | BUTT | - | 1 | - | unknown | - | 28 | R-XBCC-B28 | - | OTHER | - | 1.25 mm | TELECOM CIRCUIT | - | 5.5 mm | 5 mm | ||
RF5603 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | 2 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | 3 X 3 MM, 0.45 MM HEIGHT, GREEN, QFN-16 | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | e3 | - | - | MATTE TIN | 8542.39.00.01 | QUAD | NO LEAD | 260 | 1 | 0.5 mm | unknown | 30 | 16 | S-XQCC-N16 | Not Qualified | INDUSTRIAL | - | 0.58 mm | TELECOM CIRCUIT | - | 3 mm | 3 mm | ||
 ML4667CQ RF Micro Devices Inc | In Stock | - | Datasheet | YES | 28 | MICRO LINEAR CORP | - | - | 70 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC28,.5SQ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | No | 5 V | e0 | - | - | TIN LEAD | 8542.39.00.01 | QUAD | J BEND | - | 1 | 1.27 mm | unknown | - | 28 | S-PQCC-J28 | Not Qualified | COMMERCIAL | 120 mA | 4.57 mm | ETHERNET TRANSCEIVER | 1 | 11.505 mm | 11.505 mm | ||
RF5755 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | 2 | 70 °C | -10 °C | UNSPECIFIED | HVQCCN | 3 X 3 MM, 0.50 MM HEIGHT, GREEN, QFN-16 | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | e3 | - | - | MATTE TIN | 8542.39.00.01 | QUAD | NO LEAD | 260 | 1 | 0.5 mm | unknown | 30 | 16 | S-XQCC-N16 | Not Qualified | COMMERCIAL | 0.25 mA | 0.535 mm | TELECOM CIRCUIT | - | 3 mm | 3 mm | ||
RVA3007LTR13 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 8 | RF MICRO DEVICES INC | - | 3 | 85 °C | -40 °C | UNSPECIFIED | QCCN | QCCN, | - | SQUARE | CHIP CARRIER | Transferred | QFN | Yes | 5 V | - | Yes | 5A991.G | - | 8542.33.00.01 | QUAD | NO LEAD | - | 1 | - | compliant | - | 8 | S-XQCC-N8 | - | INDUSTRIAL | - | - | RF AND BASEBAND CIRCUIT | - | 7 mm | 7 mm | ||
 RF7169 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 23 | RF MICRO DEVICES INC | - | 3 | - | - | UNSPECIFIED | QCCN | QCCN, LCC22,.2X.26,40/36 | LCC22,.2X.26,40/36 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | MODULE | Yes | 3.5 V | e4 | Yes | 5A991.G | Nickel/Palladium/Gold (Ni/Pd/Au) | 8517.62.00.50 | UNSPECIFIED | NO LEAD | 260 | 1 | 0.91 mm | compliant | 30 | 23 | R-XXMA-N23 | Not Qualified | - | 0.00002 mA | 1 mm | RF AND BASEBAND CIRCUIT | - | 6.63 mm | 5.24 mm | ||
 ML2713CH RF Micro Devices Inc | In Stock | - | Datasheet | YES | 48 | MICRO LINEAR CORP | - | - | 70 °C | - | PLASTIC/EPOXY | TFQFP | TFQFP, | - | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | - | 3.3 V | - | - | - | - | 8542.39.00.01 | QUAD | GULL WING | - | 1 | 0.5 mm | unknown | - | 48 | S-PQFP-G48 | Not Qualified | COMMERCIAL | - | 1.2 mm | TELECOM CIRCUIT | - | 7 mm | 7 mm | ||
RFDA0045PCK-410 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 32 | RF MICRO DEVICES INC | - | 3 | 85 °C | -40 °C | UNSPECIFIED | HQCCN | HQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | MCM | Yes | 5 V | - | Yes | 5B991 | - | 9030.82.00.00 | QUAD | NO LEAD | - | 1 | 0.5 mm | compliant | - | 32 | S-XQCC-N32 | - | INDUSTRIAL | - | 1.215 mm | RF AND BASEBAND CIRCUIT | - | 5.2 mm | 5.2 mm | ||
RFDA3016SR RF Micro Devices Inc | In Stock | - | Datasheet | YES | 28 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | - | , | - | SQUARE | MICROELECTRONIC ASSEMBLY | Transferred | - | - | 5 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | 0.7 mm | unknown | - | - | S-XQMA-N28 | - | INDUSTRIAL | - | 1.25 mm | TELECOM CIRCUIT | - | 6 mm | 6 mm | ||
RFFM8209SR RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | - | - | 3.6 V | - | - | 5A991.G | - | 8517.62.00.50 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | - | S-XQCC-N16 | - | INDUSTRIAL | - | 0.4 mm | TELECOM CIRCUIT | - | 2.5 mm | 2.5 mm | ||
RF5184 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 24 | RF MICRO DEVICES INC | - | 2 | 110 °C | -30 °C | UNSPECIFIED | HVQCCN | 4 X 4 MM, QFN-24 | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.4 V | e3 | - | 5A991.G | MATTE TIN | 8517.70.00.00 | QUAD | NO LEAD | 260 | 1 | 0.5 mm | unknown | 30 | 24 | S-XQCC-N24 | Not Qualified | OTHER | - | 1 mm | RF AND BASEBAND CIRCUIT | - | 4 mm | 4 mm | ||
RF5924 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | 5A | - | - | UNSPECIFIED | QCCN | QCCN, LCC16,.14SQ,30 | LCC16,.14SQ,30 | SQUARE | MICROELECTRONIC ASSEMBLY | Transferred | QMA | Yes | 3.7 V | - | Yes | 5A991.G | - | 8517.62.00.50 | QUAD | NO LEAD | - | 1 | 0.75 mm | compliant | - | 16 | S-XQMA-N16 | Not Qualified | - | - | - | TELECOM CIRCUIT | - | - | - | ||
 RF6535 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 20 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, LCC20,.14SQ,20 | LCC20,.14SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 20 | S-XQCC-N20 | Not Qualified | INDUSTRIAL | 0.26 mA | 0.5 mm | TELECOM CIRCUIT | - | 3.5 mm | 3.5 mm | ||
 RFFC5071SQ RF Micro Devices Inc | In Stock | - | Datasheet | YES | 32 | RF MICRO DEVICES INC | - | - | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3 V | - | Yes | 5A991.G | - | 8517.70.00.00 | QUAD | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | - | 0.95 mm | TELECOM CIRCUIT | - | 5 mm | 5 mm | ||
 RFG1M20090 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 2 | RF MICRO DEVICES INC | - | - | 85 °C | -25 °C | CERAMIC, METAL-SEALED COFIRED | - | , | - | RECTANGULAR | FLANGE MOUNT | Transferred | DFM | Yes | - | - | Yes | - | - | 8542.39.00.01 | DUAL | FLAT | NOT SPECIFIED | 1 | - | compliant | NOT SPECIFIED | 2 | R-CDFM-F2 | Not Qualified | OTHER | - | - | TELECOM CIRCUIT | - | - | - |