- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Description
- Package Shape
- Package Style
- Part Life Cycle Code
- Reach Compliance Code
- Surface Mount
- Terminal Form
Attribute column
Manufacturer
RFMD Interface - Telecom
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Material | Number of Terminals | Capacitors series | Case - inch | Case - mm | Diameter after shrink | Diameter before shrink | Ihs Manufacturer | Kind of capacitor | Moisture Sensitivity Levels | Mounting | Nominal diameter | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | Type of capacitor | Wall thickness before shrink | Weight gross | Packaging | Tolerance | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Color | HTS Code | Capacitance | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Dielectric | Temperature Grade | Supply Current-Max | Seated Height-Max | Telecom IC Type | Saturation Current | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 RFFM6201 RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 24 | - | - | - | - | - | RF MICRO DEVICES INC | - | - | - | - | 85 °C | -40 °C | UNSPECIFIED | - | , | - | SQUARE | MICROELECTRONIC ASSEMBLY | Transferred | - | - | 3.3 V | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | QUAD | NO LEAD | - | 1 | 0.72 mm | unknown | - | - | S-XQMA-N24 | - | - | INDUSTRIAL | - | 1.05 mm | RF AND BASEBAND CIRCUIT | - | 5 mm | 5 mm | ||
RF6519 RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 20 | - | - | - | - | - | RF MICRO DEVICES INC | - | - | - | - | - | - | UNSPECIFIED | QCCN | QCCN, LCC28,.2X.24,25 | LCC28,.2X.24,25 | SQUARE | CHIP CARRIER | Transferred | - | Yes | 4.2 V | - | - | - | - | - | - | - | 5A991.G | - | - | - | 8517.70.00.00 | - | QUAD | NO LEAD | - | 1 | 0.635 mm | unknown | - | - | S-XQCC-N20 | Not Qualified | - | - | - | - | TELECOM CIRCUIT | - | - | - | ||
 RF5611 RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 12 | - | - | - | - | - | RF MICRO DEVICES INC | - | - | - | - | 75 °C | -10 °C | PLASTIC/EPOXY | VQCCN | VQCCN, | - | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | - | - | - | - | - | - | - | 5A991.G | - | - | - | 8517.70.00.00 | - | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 12 | S-PQCC-N12 | Not Qualified | - | COMMERCIAL EXTENDED | - | 0.5 mm | RF AND BASEBAND CIRCUIT | - | 2 mm | 2 mm | ||
RF5322 RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 8 | - | - | - | - | - | RF MICRO DEVICES INC | - | 2 | - | - | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | 2.20 X 2.20 MM, 0.40 MM HEIGHT, ROHS COMPLIANT, QFN-8 | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | - | - | - | - | - | e3 | Yes | 5A991.G | - | Matte Tin (Sn) - annealed | - | 8517.70.00.00 | - | QUAD | NO LEAD | 260 | 1 | 0.65 mm | unknown | 30 | 8 | S-XQCC-N8 | - | - | OTHER | - | 0.5 mm | RF AND BASEBAND CIRCUIT | - | 2.2 mm | 2.2 mm | ||
RFDA2046TR13 RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 28 | - | - | - | - | - | RF MICRO DEVICES INC | - | - | - | - | 85 °C | -40 °C | UNSPECIFIED | HQCCN | HQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | MCM | - | 5 V | - | - | - | - | - | - | - | 5A991.G | - | - | - | 8542.33.00.01 | - | QUAD | NO LEAD | - | 1 | 0.7 mm | unknown | - | 28 | S-XQCC-N28 | Not Qualified | - | INDUSTRIAL | - | 1.215 mm | BASEBAND CIRCUIT | - | 6 mm | 6 mm | ||
RFFM6401 RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 28 | - | - | - | - | - | RF MICRO DEVICES INC | - | 3 | - | - | 85 °C | -40 °C | UNSPECIFIED | HLGA | HLGA, | - | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | Transferred | - | Yes | 3.6 V | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | BOTTOM | BUTT | - | 1 | - | unknown | - | - | R-XBGA-B28 | - | - | INDUSTRIAL | - | 1.25 mm | TELECOM CIRCUIT | - | 5.5 mm | 5 mm | ||
RFDA2125SQ RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 32 | - | - | - | - | - | RF MICRO DEVICES INC | - | - | - | - | 85 °C | -40 °C | UNSPECIFIED | HBCC | HBCC, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | - | - | 5 V | - | - | - | - | - | - | - | 5B991 | - | - | - | 9030.82.00.00 | - | BOTTOM | BUTT | - | 1 | 0.5 mm | unknown | - | - | S-XBCC-B32 | - | - | INDUSTRIAL | - | 1.25 mm | RF AND BASEBAND CIRCUIT | - | 5.2 mm | 5.2 mm | ||
RFFM8500SQ RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 16 | - | - | - | - | - | RF MICRO DEVICES INC | - | - | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | QCCN | QCCN, LCC16,.12SQ,20 | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | Transferred | - | Yes | 3.3 V | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | QUAD | NO LEAD | - | - | 0.5 mm | unknown | - | - | S-PQCC-N16 | Not Qualified | - | INDUSTRIAL | 260 mA | - | - | - | - | - | ||
RF5345 RF Micro Devices Inc | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 RF7173 RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 23 | - | - | - | - | - | RF MICRO DEVICES INC | - | 5A | - | - | 85 °C | -30 °C | UNSPECIFIED | QCCN | QCCN, LCC22(UNSPEC) | LCC22(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Transferred | MODULE | Yes | 3.6 V | - | - | - | - | - | - | Yes | 5A991.G | - | - | - | 8517.62.00.50 | - | UNSPECIFIED | NO LEAD | - | 1 | - | compliant | - | 23 | R-XXMA-N23 | Not Qualified | - | OTHER | 0.00008 mA | 1.015 mm | RF AND BASEBAND CIRCUIT | - | 6.63 mm | 5.24 mm | ||
RF5722SR RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 8 | - | - | - | - | - | RF MICRO DEVICES INC | - | 2 | - | - | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | 2.20 X 2.20 MM, 0.45 MM HEIGHT, GREEN, QFN-8 | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | - | Yes | 3.3 V | - | - | - | - | - | e3 | - | 5A991.G | - | MATTE TIN | - | 8517.70.00.00 | - | QUAD | NO LEAD | 260 | 1 | 0.65 mm | unknown | 30 | - | S-XQCC-N8 | - | - | OTHER | - | 0.5 mm | TELECOM CIRCUIT | - | 2.2 mm | 2.2 mm | ||
RF5506SB RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 16 | - | - | - | - | - | RF MICRO DEVICES INC | - | - | - | - | 70 °C | -10 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | - | - | 3.3 V | - | - | - | - | - | - | - | 5A991.G | - | - | - | 8517.70.00.00 | - | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | - | S-XQCC-N16 | - | - | COMMERCIAL | - | 0.58 mm | TELECOM CIRCUIT | - | 3 mm | 3 mm | ||
RF3858 RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 32 | - | - | - | - | - | RF MICRO DEVICES INC | - | - | - | - | 85 °C | -40 °C | UNSPECIFIED | LGA | LGA, LCC32,.32SQ,40 | LCC32,.32SQ,40 | SQUARE | GRID ARRAY | Transferred | LGA | Yes | 3.6 V | - | - | - | - | - | - | Yes | 5A991.G | - | - | - | 8517.70.00.00 | - | BOTTOM | NO LEAD | NOT SPECIFIED | 1 | 1 mm | compliant | NOT SPECIFIED | 32 | S-XBGA-N32 | Not Qualified | - | INDUSTRIAL | 0.85 mA | 1.2 mm | RF FRONT END CIRCUIT | - | 8 mm | 8 mm | ||
RFAC3612TR7 RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 10 | - | - | - | - | - | RF MICRO DEVICES INC | - | - | - | - | 85 °C | -40 °C | PLASTIC/EPOXY | BCC | BCC, | - | RECTANGULAR | CHIP CARRIER | Obsolete | - | - | 2.85 V | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | BOTTOM | BUTT | - | 1 | 0.5 mm | unknown | - | - | R-PBCC-B10 | - | - | INDUSTRIAL | - | 1.195 mm | TELECOM CIRCUIT | - | 2.5 mm | 2 mm | ||
RF5765 RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 16 | - | - | - | - | - | RF MICRO DEVICES INC | - | 2 | - | - | 70 °C | -10 °C | UNSPECIFIED | HVQCCN | HVQCCN, LCC16,.12SQ,20 | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | - | - | - | - | - | - | - | 5A991.G | - | - | - | 8517.70.00.00 | - | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 16 | S-XQCC-N16 | Not Qualified | - | COMMERCIAL | 0.29 mA | 0.58 mm | RF AND BASEBAND CIRCUIT | - | 3 mm | 3 mm | ||
RF5325 RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 16 | - | - | - | - | - | RF MICRO DEVICES INC | - | 2 | - | - | 70 °C | -15 °C | UNSPECIFIED | HQCCN | HQCCN, LCC16,.12SQ,20 | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | QFN | Yes | 3.3 V | - | - | - | - | - | e3 | Yes | - | - | MATTE TIN | - | 8542.39.00.01 | - | QUAD | NO LEAD | - | 1 | 0.5 mm | compliant | - | 16 | S-XQCC-N16 | Not Qualified | - | COMMERCIAL | 0.2 mA | - | RF AND BASEBAND CIRCUIT | - | 3 mm | 3 mm | ||
RF2948BSR RF Micro Devices Inc | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
RF7411 RF Micro Devices Inc | In Stock | - | Datasheet | YES | - | 10 | - | - | - | - | - | RF MICRO DEVICES INC | - | - | - | - | 85 °C | -20 °C | UNSPECIFIED | HBCC | HBCC, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | - | - | 3.2 V | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | BOTTOM | BUTT | - | 1 | 0.6 mm | unknown | - | - | S-XBCC-B10 | - | - | OTHER | - | 1.015 mm | RF AND BASEBAND CIRCUIT | - | 3 mm | 3 mm | ||
RF5722TR7 RF Micro Devices Inc | In Stock | - | Datasheet | YES | polyolefin | 8 | - | - | - | 4 mm | 12 mm | RF MICRO DEVICES INC | - | - | - | 12 mm | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | 2.20 X 2.20 MM, 0.45 MM HEIGHT, GREEN, QFN-8 | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | - | Yes | 3.3 V | - | 0.68 mm | 39.25 | supplied in 1.0 m lengths | - | e3 | - | 5A991.G | Heat shrink tubing with adhesive layer | MATTE TIN | green | 8517.70.00.00 | - | QUAD | NO LEAD | 260 | 1 | 0.65 mm | unknown | 30 | - | S-XQCC-N8 | - | - | OTHER | - | 0.5 mm | TELECOM CIRCUIT | 2 | 1000 mm | 2.2 mm | ||
 RFSW6042TR7 RF Micro Devices Inc | 680 | - | Datasheet | YES | - | 12 | KGM | 0402 | 1005 | - | - | RF MICRO DEVICES INC | MLCC | - | SMD | - | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 5 V | ceramic | - | - | - | ±2% | - | Yes | 5A991.G | - | - | - | 8541.21.00.75 | 10pF | QUAD | NO LEAD | - | 1 | 0.4 mm | unknown | - | 12 | S-XQCC-N12 | - | C0G (NP0) | INDUSTRIAL | - | 0.65 mm | RF AND BASEBAND CIRCUIT | 2 | 1.8 mm | 1.8 mm |