-

YES

32

-

-

-

-

RF MICRO DEVICES INC

-

-

85 °C

-40 °C

UNSPECIFIED

HVQCCN

HVQCCN,

-

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Transferred

QFN

-

-

-

3 V

-

-

-

5A991.G

-

8517.70.00.00

QUAD

NO LEAD

-

1

0.5 mm

unknown

-

32

S-XQCC-N32

-

INDUSTRIAL

-

0.95 mm

TELECOM CIRCUIT

-

-

5 mm

5 mm

-

YES

32

socket

2x3

2.54mm

SMT

RF MICRO DEVICES INC

female

-

85 °C

-40 °C

UNSPECIFIED

HLGA

HLGA,

-

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Transferred

-

-

2.54mm

straight

4.2 V

pin strips

-

-

5A991.G

-

8517.62.00.50

BOTTOM

BUTT

-

1

0.64 mm

unknown

-

-

S-XBGA-B32

-

INDUSTRIAL

-

1.09 mm

TELECOM CIRCUIT

beryllium copper

-

6 mm

6 mm

-

YES

16

socket

1x26

1.27mm

THT

RF MICRO DEVICES INC

female

-

85 °C

-40 °C

PLASTIC/EPOXY

QCCN

QCCN, LCC16,.12SQ,20

LCC16,.12SQ,20

SQUARE

CHIP CARRIER

Transferred

-

Yes

-

straight

3.3 V

pin strips

-

-

-

-

8542.39.00.01

QUAD

NO LEAD

-

-

0.5 mm

unknown

-

-

S-PQCC-N16

Not Qualified

INDUSTRIAL

260 mA

-

-

bronze

-

-

-

-

YES

23

-

-

-

-

RF MICRO DEVICES INC

-

-

85 °C

-30 °C

UNSPECIFIED

BCC

BCC, LCC22,.2X.26,40/36

LCC22,.2X.26,40/36

RECTANGULAR

CHIP CARRIER

Transferred

QMA

Yes

-

-

3.5 V

-

-

-

5A991.G

-

8517.62.00.50

BOTTOM

BUTT

-

1

0.91 mm

unknown

-

22

R-XBCC-B23

Not Qualified

OTHER

0.00001 mA

1.05 mm

RF AND BASEBAND CIRCUIT

-

5A

6.63 mm

5.24 mm

-

YES

32

-

-

-

-

RF MICRO DEVICES INC

-

-

70 °C

-

UNSPECIFIED

QCCN

QCCN, LCC32,.2SQ,20

LCC32,.2SQ,20

SQUARE

MICROELECTRONIC ASSEMBLY

Transferred

-

Yes

-

-

3.3 V

-

-

-

5A991.G

-

8517.62.00.50

QUAD

NO LEAD

-

1

0.5 mm

unknown

-

-

S-XQMA-N32

Not Qualified

COMMERCIAL

0.275 mA

1 mm

TELECOM CIRCUIT

-

-

5 mm

5 mm

-

YES

28

-

-

-

-

RF MICRO DEVICES INC

-

-

70 °C

-30 °C

UNSPECIFIED

HBCC

HBCC,

-

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG

Transferred

LGA

-

-

-

3.6 V

-

-

-

5A991.G

-

8517.62.00.50

BOTTOM

BUTT

-

1

-

unknown

-

28

R-XBCC-B28

-

OTHER

-

1.215 mm

TELECOM CIRCUIT

-

-

5.5 mm

5 mm

-

YES

32

-

-

-

-

RF MICRO DEVICES INC

-

-

85 °C

-40 °C

UNSPECIFIED

HVQCCN

HVQCCN, LCC32,.2SQ,20

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Transferred

QFN

Yes

-

-

3 V

-

-

-

5A991.G

-

8542.39.00.01

QUAD

NO LEAD

-

1

0.5 mm

unknown

-

32

S-XQCC-N32

Not Qualified

INDUSTRIAL

-

0.95 mm

MODEM-MODULATOR

-

-

5 mm

5 mm

-

YES

16

-

-

-

-

RF MICRO DEVICES INC

-

-

125 °C

-40 °C

UNSPECIFIED

HVQCCN

2.50 X 2.50 MM, 0.50 MM HEIGHT, GREEN, QFN-16

-

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Transferred

-

-

-

-

-

-

-

-

5A991.G

-

8517.62.00.50

QUAD

NO LEAD

-

1

0.5 mm

compliant

-

-

S-XQCC-N16

-

AUTOMOTIVE

-

0.5 mm

TELECOM CIRCUIT

-

-

2.5 mm

2.5 mm

-

YES

96

-

-

-

-

RF MICRO DEVICES INC

-

-

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

VFBGA,

-

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Obsolete

BGA

Yes

-

-

1.8 V

-

e1

-

-

TIN SILVER COPPER

8542.39.00.01

BOTTOM

BALL

-

1

0.5 mm

compliant

-

96

S-PBGA-B96

Not Qualified

INDUSTRIAL

-

1 mm

TELECOM CIRCUIT

-

-

6 mm

6 mm

-

YES

31

-

-

-

-

RF MICRO DEVICES INC

-

-

85 °C

-20 °C

UNSPECIFIED

HBCC

HBCC, LCC30(UNSPEC)

LCC30(UNSPEC)

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG

Transferred

MODULE

Yes

-

-

3.6 V

-

-

-

-

-

8542.39.00.01

BOTTOM

BUTT

-

1

-

unknown

-

31

R-XBCC-B31

Not Qualified

OTHER

2.6 mA

1.015 mm

RF AND BASEBAND CIRCUIT

-

-

7 mm

6 mm

-

YES

16

-

-

-

-

RF MICRO DEVICES INC

-

-

85 °C

-20 °C

UNSPECIFIED

-

,

-

SQUARE

MICROELECTRONIC ASSEMBLY

Transferred

-

-

-

-

3.3 V

-

-

-

5A991.G

-

8517.62.00.50

QUAD

NO LEAD

-

1

0.5 mm

unknown

-

-

S-XQMA-N16

-

OTHER

-

1.05 mm

TELECOM CIRCUIT

-

-

3 mm

3 mm

-

NO

10

-

-

-

-

RF MICRO DEVICES INC

-

-

85 °C

-30 °C

UNSPECIFIED

-

,

-

SQUARE

MICROELECTRONIC ASSEMBLY

Transferred

MODULE

-

-

-

3.4 V

-

-

-

-

-

8542.39.00.01

DUAL

NO LEAD

-

1

0.6 mm

unknown

-

10

S-XDMA-N10

Not Qualified

OTHER

-

1.05 mm

TELECOM CIRCUIT

-

-

3 mm

3 mm

-

YES

94

-

-

-

-

RF MICRO DEVICES INC

-

-

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

VFBGA,

-

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Obsolete

DIE

Yes

-

-

1.8 V

-

e1

-

-

TIN SILVER COPPER

8542.39.00.01

BOTTOM

BALL

-

1

-

compliant

-

94

S-PBGA-B94

Not Qualified

INDUSTRIAL

-

0.415 mm

TELECOM CIRCUIT

-

-

3.7 mm

3.7 mm

-

YES

48

-

-

-

-

RF MICRO DEVICES INC

-

1

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

9 X 9 MM, TQFP-48

-

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

Obsolete

QFP

No

-

-

3.3 V

-

-

No

-

-

8542.39.00.01

QUAD

GULL WING

-

1

0.5 mm

compliant

-

48

S-PQFP-G48

Not Qualified

INDUSTRIAL

-

1.1 mm

RF AND BASEBAND CIRCUIT

-

-

7 mm

7 mm

-

YES

24

-

-

-

-

RF MICRO DEVICES INC

-

-

85 °C

-40 °C

UNSPECIFIED

HVQCCN

HVQCCN,

-

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Transferred

-

Yes

-

-

5 V

-

-

-

-

-

8542.39.00.01

QUAD

NO LEAD

-

1

0.5 mm

unknown

-

-

S-XQCC-N24

-

INDUSTRIAL

-

1 mm

TELECOM CIRCUIT

-

-

4 mm

4 mm

-

YES

24

-

-

-

-

RF MICRO DEVICES INC

-

-

85 °C

-40 °C

UNSPECIFIED

HVQCCN

HVQCCN, LCC24,.16SQ,20

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Transferred

QFN

Yes

-

-

5 V

-

-

-

-

-

8542.39.00.01

QUAD

NO LEAD

-

1

0.5 mm

unknown

-

24

S-XQCC-N24

Not Qualified

INDUSTRIAL

0.231 mA

0.9 mm

RF AND BASEBAND CIRCUIT

-

-

4 mm

4 mm

-

YES

20

-

-

-

-

RF MICRO DEVICES INC

-

2

85 °C

-40 °C

UNSPECIFIED

HVQCCN

HVQCCN,

-

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Transferred

QFN

Yes

-

-

3.6 V

-

-

Yes

-

-

8542.39.00.01

QUAD

NO LEAD

-

1

0.5 mm

compliant

-

20

S-XQCC-N20

Not Qualified

INDUSTRIAL

-

0.6 mm

TELECOM CIRCUIT

-

-

3.5 mm

3.5 mm

-

YES

8

-

-

-

-

RF MICRO DEVICES INC

-

3

85 °C

-40 °C

UNSPECIFIED

QCCN

QCCN,

-

SQUARE

CHIP CARRIER

Transferred

QFN

Yes

-

-

5 V

-

-

Yes

-

-

8542.39.00.01

QUAD

NO LEAD

-

1

-

compliant

-

8

S-XQCC-N8

-

INDUSTRIAL

-

-

RF AND BASEBAND CIRCUIT

-

-

7 mm

7 mm

-

YES

32

-

-

-

-

RF MICRO DEVICES INC

-

-

85 °C

-40 °C

UNSPECIFIED

HVQCCN

HVQCCN,

-

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Transferred

QFN

Yes

-

-

3 V

-

-

-

5A991.G

-

8517.70.00.00

QUAD

NO LEAD

NOT SPECIFIED

1

0.5 mm

unknown

NOT SPECIFIED

32

S-XQCC-N32

-

INDUSTRIAL

-

0.95 mm

TELECOM CIRCUIT

-

-

5 mm

5 mm

-

YES

28

-

-

-

-

RF MICRO DEVICES INC

-

-

85 °C

-40 °C

UNSPECIFIED

HLGA

HLGA,

-

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

Transferred

-

-

-

-

3.6 V

-

-

-

5A991.G

-

8517.62.00.50

BOTTOM

BUTT

-

1

-

unknown

-

-

R-XBGA-B28

-

INDUSTRIAL

-

1.25 mm

TELECOM CIRCUIT

-

-

5.5 mm

5 mm