- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Description
- Package Shape
- Package Style
- Part Life Cycle Code
- Reach Compliance Code
- Surface Mount
- Terminal Form
Attribute column
Manufacturer
RFMD Interface - Telecom
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Seated Height-Max | Telecom IC Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 RF3225 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 17 | RF MICRO DEVICES INC | 5A | 85 °C | -30 °C | PLASTIC/EPOXY | HTSON | HTSON, | - | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | Transferred | SOIC | Yes | 3.6 V | - | Yes | 5A991.G | - | 8542.33.00.01 | DUAL | NO LEAD | - | 1 | - | compliant | - | 17 | S-PDSO-N17 | Not Qualified | OTHER | - | 1.05 mm | RF AND BASEBAND CIRCUIT | 5 mm | 5 mm | ||
 RF5225 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | 65 °C | -15 °C | UNSPECIFIED | HVQCCN | HVQCCN, LCC16,.12SQ,20 | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3.7 V | - | - | 5A991.G | - | 8517.70.00.00 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 16 | S-XQCC-N16 | Not Qualified | COMMERCIAL | - | 0.55 mm | RF AND BASEBAND CIRCUIT | 3 mm | 3 mm | ||
RF9234TR13 RF Micro Devices Inc | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
RFFM6403 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 28 | RF MICRO DEVICES INC | 3 | 85 °C | -40 °C | UNSPECIFIED | HLGA | HLGA, LCC28,.24SQ,28 | LCC28,.24SQ,28 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Transferred | - | Yes | 3.6 V | - | - | - | - | 8542.39.00.01 | BOTTOM | BUTT | - | 1 | 0.7 mm | unknown | - | - | S-XBGA-B28 | Not Qualified | INDUSTRIAL | 1.5 mA | 1.05 mm | TELECOM CIRCUIT | 6 mm | 6 mm | ||
RF1193A RF Micro Devices Inc | In Stock | - | - | YES | 26 | RF MICRO DEVICES INC | - | 90 °C | -20 °C | UNSPECIFIED | VQCCN | VQCCN, | - | RECTANGULAR | CHIP CARRIER | Transferred | QFN | Yes | 2.65 V | - | - | 5A991.G | - | 8541.21.00.75 | QUAD | NO LEAD | - | 1 | 0.4 mm | unknown | - | 26 | R-XQCC-N26 | Not Qualified | OTHER | - | 0.9 mm | RF AND BASEBAND CIRCUIT | 3.8 mm | 3 mm | ||
RFFM6403SR RF Micro Devices Inc | In Stock | - | Datasheet | YES | 28 | RF MICRO DEVICES INC | - | 85 °C | -40 °C | UNSPECIFIED | HLGA | HLGA, LCC28,.24SQ,28 | LCC28,.24SQ,28 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Transferred | - | Yes | 3.6 V | - | - | 5A991.G | - | 8517.62.00.50 | BOTTOM | BUTT | NOT SPECIFIED | 1 | 0.7 mm | compliant | NOT SPECIFIED | - | S-XBGA-B28 | Not Qualified | INDUSTRIAL | - | 1.05 mm | TELECOM CIRCUIT | 6 mm | 6 mm | ||
 RF1201 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 6 | RF MICRO DEVICES INC | - | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 2.65 V | - | - | 5A991.G | - | 8541.29.00.75 | QUAD | NO LEAD | - | 1 | 0.65 mm | unknown | - | 6 | S-XQCC-N6 | Not Qualified | OTHER | - | 0.9 mm | RF AND BASEBAND CIRCUIT | 2 mm | 2 mm | ||
RFDA0057SQ RF Micro Devices Inc | In Stock | - | Datasheet | YES | 32 | RF MICRO DEVICES INC | 3 | 85 °C | -40 °C | UNSPECIFIED | BCC | BCC, | - | SQUARE | CHIP CARRIER | Transferred | MCM | Yes | 5 V | - | Yes | 5A991.G | - | 8542.33.00.01 | BOTTOM | BUTT | - | 1 | 0.7 mm | compliant | - | 32 | S-XBCC-B32 | - | INDUSTRIAL | - | 1.25 mm | RF AND BASEBAND CIRCUIT | 7 mm | 7 mm | ||
RF2959SR RF Micro Devices Inc | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
RF6569 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 20 | RF MICRO DEVICES INC | - | - | - | UNSPECIFIED | QCCN | QCCN, | - | SQUARE | CHIP CARRIER | Transferred | - | - | 3.6 V | - | - | 5A991.G | - | 8517.70.00.00 | QUAD | NO LEAD | - | 1 | - | unknown | - | - | S-XQCC-N20 | - | - | - | - | TELECOM CIRCUIT | - | - | ||
SIW3500GIG1SB RF Micro Devices Inc | In Stock | - | Datasheet | YES | 96 | RF MICRO DEVICES INC | - | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | - | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | - | - | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | - | 1 | 0.5 mm | compliant | - | 96 | S-PBGA-B96 | Not Qualified | INDUSTRIAL | - | 1 mm | TELECOM CIRCUIT | 6 mm | 6 mm | ||
 RF5288 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 32 | RF MICRO DEVICES INC | - | 70 °C | - | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | - | 3.3 V | - | - | 5A991.G | - | 8517.70.00.00 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 32 | S-XQCC-N32 | Not Qualified | COMMERCIAL | - | 0.95 mm | RF AND BASEBAND CIRCUIT | 5 mm | 5 mm | ||
 RF7163 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 23 | RF MICRO DEVICES INC | - | - | - | UNSPECIFIED | QCCN | QCCN, LCC22(UNSPEC) | LCC22(UNSPEC) | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Transferred | MODULE | Yes | 3.5 V | - | Yes | 5A991.G | - | 8517.62.00.50 | UNSPECIFIED | NO LEAD | NOT SPECIFIED | 1 | - | compliant | NOT SPECIFIED | 23 | R-XXMA-N23 | Not Qualified | - | 0.00008 mA | 1.015 mm | RF AND BASEBAND CIRCUIT | 6.63 mm | 5.24 mm | ||
RFSA2614SR RF Micro Devices Inc | In Stock | - | Datasheet | YES | 24 | RF MICRO DEVICES INC | 1 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 5 V | - | - | 5A991.G | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 24 | S-XQCC-N24 | Not Qualified | INDUSTRIAL | - | 0.9 mm | PCM JITTER ATTENUATOR | 4 mm | 4 mm | ||
 RF5605SQ RF Micro Devices Inc | In Stock | - | Datasheet | YES | 24 | RF MICRO DEVICES INC | 3 | 85 °C | -40 °C | UNSPECIFIED | HQCCN | HQCCN, LCC24,.24SQ,35 | LCC24,.24SQ,35 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | QFN | Yes | 5 V | - | Yes | 5A991.G | - | 8517.70.00.00 | QUAD | NO LEAD | - | 1 | 0.9 mm | compliant | - | 24 | S-XQCC-N24 | Not Qualified | INDUSTRIAL | - | 1.015 mm | RF AND BASEBAND CIRCUIT | 6 mm | 6 mm | ||
RVA3007L RF Micro Devices Inc | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 RF5501 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 12 | RF MICRO DEVICES INC | - | 75 °C | -10 °C | PLASTIC/EPOXY | VQCCN | VQCCN, | - | SQUARE | CHIP CARRIER, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | - | - | 5A991.G | - | 8517.70.00.00 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 12 | S-PQCC-N12 | Not Qualified | COMMERCIAL EXTENDED | - | 0.5 mm | RF AND BASEBAND CIRCUIT | 2 mm | 2 mm | ||
STQ-2016-3Z RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | HTSSOP | HTSSOP, TSSOP16,.25 | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | Yes | 5 V | e3 | - | - | MATTE TIN | 8542.39.00.01 | DUAL | GULL WING | - | 1 | 0.6 mm | unknown | - | 16 | R-PDSO-G16 | Not Qualified | INDUSTRIAL | 0.086 mA | 1.2 mm | RF AND BASEBAND CIRCUIT | 4.9 mm | 4.3 mm | ||
RF7321 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 10 | RF MICRO DEVICES INC | - | 85 °C | -30 °C | PLASTIC/EPOXY | HVSON | HVSON, | - | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | SOIC | Yes | 3.4 V | - | Yes | - | - | 8542.39.00.01 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.6 mm | compliant | NOT SPECIFIED | 10 | S-PDSO-N10 | - | OTHER | - | 0.85 mm | RF AND BASEBAND CIRCUIT | 3 mm | 3 mm | ||
RFFM8202SB RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | - | - | 3.3 V | - | - | 5A991.G | - | 8517.62.00.50 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | - | S-XQCC-N16 | - | INDUSTRIAL | - | 0.45 mm | TELECOM CIRCUIT | 2.6 mm | 2.6 mm |