- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Number of Terminals
- Package Body Material
- Package Description
- Package Shape
- Package Style
- Part Life Cycle Code
- Reach Compliance Code
- Surface Mount
- Terminal Form
Attribute column
Manufacturer
RFMD Interface - Telecom
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Supply Current-Max | Seated Height-Max | Telecom IC Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 ML4621CP RF Micro Devices Inc | In Stock | - | Datasheet | NO | 24 | MICRO LINEAR CORP | - | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | - | 5 V | - | - | - | - | 8542.39.00.01 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | unknown | - | 24 | R-PDIP-T24 | Not Qualified | COMMERCIAL | 110 mA | 4.32 mm | TELECOM CIRCUIT | 31.75 mm | 7.62 mm | ||
 RF6555 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 20 | RF MICRO DEVICES INC | - | - | - | UNSPECIFIED | QCCN | QCCN, | - | SQUARE | CHIP CARRIER | Transferred | - | - | - | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | - | unknown | - | - | S-XQCC-N20 | - | - | - | - | TELECOM CIRCUIT | - | - | ||
 RF7234A RF Micro Devices Inc | In Stock | - | Datasheet | YES | 10 | RF MICRO DEVICES INC | - | 85 °C | -25 °C | UNSPECIFIED | HBCC | HBCC, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | MODULE | Yes | 3.4 V | - | - | - | - | 8542.39.00.01 | BOTTOM | BUTT | - | 1 | 0.6 mm | unknown | - | 10 | S-XBCC-B10 | Not Qualified | OTHER | - | 1.015 mm | RF AND BASEBAND CIRCUIT | 3 mm | 3 mm | ||
RF5506 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | - | 70 °C | -10 °C | UNSPECIFIED | HVQCCN | HVQCCN, | - | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | - | - | 3.3 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | - | S-XQCC-N16 | - | COMMERCIAL | - | 0.58 mm | TELECOM CIRCUIT | 3 mm | 3 mm | ||
 RF6539 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 28 | RF MICRO DEVICES INC | 3 | 70 °C | -30 °C | UNSPECIFIED | QCCN | QCCN, | - | RECTANGULAR | CHIP CARRIER | Transferred | QFN | Yes | 3.6 V | - | Yes | 5A991.G | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | - | compliant | - | 28 | R-XQCC-N28 | Not Qualified | OTHER | - | 1.215 mm | TELECOM CIRCUIT | 5.5 mm | 5 mm | ||
 RFVA1027TR13 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 8 | RF MICRO DEVICES INC | 3 | 85 °C | -40 °C | UNSPECIFIED | QCCN | QCCN, | - | SQUARE | CHIP CARRIER | Transferred | QFN | Yes | 5 V | - | Yes | 5A991.G | - | 8542.33.00.01 | QUAD | NO LEAD | - | 1 | - | compliant | - | 8 | S-XQCC-N8 | - | INDUSTRIAL | - | - | RF AND BASEBAND CIRCUIT | 7 mm | 7 mm | ||
RF7303 RF Micro Devices Inc | In Stock | - | Datasheet | NO | 10 | RF MICRO DEVICES INC | - | - | - | UNSPECIFIED | - | , | - | SQUARE | MICROELECTRONIC ASSEMBLY | Transferred | - | Yes | - | - | - | - | - | 8542.39.00.01 | DUAL | NO LEAD | NOT SPECIFIED | 1 | - | unknown | NOT SPECIFIED | - | S-XDMA-N10 | - | - | - | - | BASEBAND CIRCUIT | - | - | ||
RF5745 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 16 | RF MICRO DEVICES INC | 2 | 65 °C | -15 °C | PLASTIC/EPOXY | HQCCN | 3 X 3 MM, 0.5 MM HEIGHT, ROHS COMPLIANT, PLASTIC, QFN-16 | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Transferred | QFN | Yes | 3.3 V | e3 | Yes | 5A991.G | Matte Tin (Sn) - annealed | 8517.70.00.00 | QUAD | NO LEAD | 260 | 1 | 0.5 mm | unknown | 30 | 16 | S-PQCC-N16 | Not Qualified | COMMERCIAL | - | - | RF AND BASEBAND CIRCUIT | 3 mm | 3 mm | ||
 RF9986 RF Micro Devices Inc | In Stock | - | Datasheet | YES | 24 | RF MICRO DEVICES INC | - | 85 °C | -40 °C | PLASTIC/EPOXY | SSOP | SSOP, | - | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Obsolete | SSOP | No | 3.6 V | e0 | - | - | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | - | 1 | 0.635 mm | unknown | - | 24 | R-PDSO-G24 | Not Qualified | INDUSTRIAL | - | 1.7475 mm | RF AND BASEBAND CIRCUIT | 8.6487 mm | 3.9 mm | ||
ML5824EM RF Micro Devices Inc | In Stock | - | Datasheet | YES | 28 | SIRENZA MICRODEVICES INC | - | 70 °C | -10 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, | - | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | - | 3.2 V | - | - | - | - | 8542.39.00.01 | QUAD | NO LEAD | - | 1 | 0.5 mm | unknown | - | 28 | R-PQCC-N28 | Not Qualified | COMMERCIAL | - | 1 mm | TELECOM CIRCUIT | 5 mm | 4 mm |