- Tolerance
- Series
- Core Material
- Ihs Manufacturer
- Part Life Cycle Code
- Rated Current-Max
- Reach Compliance Code
- Construction
- Inductor Type
- Packing Method
- Case/Size Code
- Inductance-Nom (L)
Attribute column
Manufacturer
Samsung Fixed Inductors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Mounting Type | Package / Case | Surface Mount | Terminal Shape | Supplier Device Package | Shape/Size Description | Number of Terminals | Core Material | Approvals | Current - Saturation (Isat) | DC Resistance | Frequency-Self-Resonant | Ihs Manufacturer | Inductance Frequency-Test | Manufacturer | Manufacturer Part Number | Manufacturer Series | Material-Core | Mfr | Mounting | Operating Temperature-Max | Operating Temperature-Min | Package | Package Description | Package Height | Package Length | Package Style | Package Width | Part Life Cycle Code | Product Status | Risk Rank | RoHS | Rohs Code | Self Resonance Frequency | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Type | Terminal Finish | HTS Code | Current Rating (Amps) | Packing Method | Shielding | Number of Functions | Construction | Reach Compliance Code | Current Rating | Inductance | Test Frequency | DC Resistance (DCR) | Inductor Application | Terminal Placement | Q @ Freq | Quality Factor-Min (at L-nom) | Inductor Type | Current - Saturation | Case/Size Code | Shielded | Rated Current-Max | Inductance-Nom (L) | Features | Height Seated (Max) | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 CIH02T0N5CNC Samsung | In Stock | - | - | Surface Mount | 01005 (0402 Metric) | YES | WRAPAROUND | 01005 (0402 Metric) | RECTANGULAR PACKAGE | 2 | Ceramic | - | - | 0.2 Ω | 10GHz | SAMSUNG ELECTRO-MECHANICS | 100MHz | ABB | ACH580-BCR-240A-4+F267+J429+K452 | - | -- | Samsung Electro-Mechanics | - | 125 °C | -55 °C | Tape & Reel (TR) | 01005 | 0.2 mm | 0.4 mm | SMT | 0.2 mm | End Of Life | Obsolete | 5.45 | Compliant | Yes | 10000 MHz | -55°C ~ 125°C | - | CIH02T | 0.016 L x 0.008 W (0.40mm x 0.20mm) | ±0.2nH | - | - | Active | EAR99 | Multilayer | - | 8504.50.80.00 | 350 mA | Tape, Paper | Unshielded | 1 | Chip | compliant | 350mA | 0.5nH | 100 MHz | 200 mOhm Max | RF INDUCTOR | DUAL ENDED | 12 @ 500MHz | - | GENERAL PURPOSE INDUCTOR | -- | 01005 | NO | 0.35 A | 0.0005 µH | -- | 0.009 (0.22mm) | -- | ||
CIGT252010LM2R2SNE Samsung | In Stock | - | - | Surface Mount | 0806 (2016 Metric) | - | - | 0806 (2016 Metric) | - | - | - | CE, CSA, UL | - | - | -- | - | 1MHz | Cutler Hammer, Div of Eaton Corp | PDG54P0800P4DM | - | Metal Composite | Samsung Electro-Mechanics | Panel | - | - | Tape & Reel (TR) | - | - | - | - | - | - | Active | - | - | - | - | -40°C ~ 125°C | - | CIGT | 0.079 L x 0.063 W (2.00mm x 1.60mm) | ±0.3nH | - | - | Active | - | Thin Film | - | - | - | - | Shielded | - | - | - | 800 A | 2.2µH | - | -- | - | - | -- | - | - | -- | - | - | - | - | -- | -- | -- | ||
CIGT252008LM2R2SNE Samsung | In Stock | - | - | Surface Mount | 0806 (2016 Metric) | - | - | 0806 (2016 Metric) | - | - | - | - | - | - | -- | - | 1MHz | - | - | - | Metal Composite | Samsung Electro-Mechanics | - | - | - | Tape & Reel (TR) | - | - | - | - | - | - | Active | - | - | - | - | -40°C ~ 125°C | - | CIGT | 0.079 L x 0.063 W (2.00mm x 1.60mm) | ±0.3nH | - | - | Active | - | Thin Film | - | - | - | - | Shielded | - | - | - | - | 2.2µH | - | -- | - | - | -- | - | - | -- | - | - | - | - | -- | -- | -- | ||
CIG22H1R2MAE Samsung | In Stock | - | - | Surface Mount | 1008 (2520 Metric) | - | - | 1008 (2520 Metric) | - | - | - | - | - | - | -- | - | 1MHz | - | - | - | -- | Samsung Electro-Mechanics | - | - | - | Tape & Reel (TR) | - | - | - | - | - | - | Obsolete | - | - | - | - | -40°C ~ 125°C | Tape & Reel (TR) | CIG22H_MAE | 0.098 L x 0.079 W (2.50mm x 2.00mm) | ±20% | - | - | Active | - | Multilayer | - | - | 1.7 A | - | Shielded | - | - | - | 1.7A | 1.2µH | - | 65 mOhm | - | - | -- | - | - | -- | - | - | - | - | -- | 0.039 (1.00mm) | -- | ||
CIH03U47NJNC Samsung Semiconductor | In Stock | - | Datasheet | - | - | - | - | - | - | - | Ceramic | - | - | 2.6 Ω | - | SAMSUNG SEMICONDUCTOR INC | - | - | - | CIH | - | - | - | 125 °C | -55 °C | - | 0201 | 0.3 mm | 0.6 mm | SMT | 0.3 mm | Active | - | - | - | - | 1600 MHz | - | - | CIH | - | 5% | - | - | - | - | - | - | - | - | Tape, Paper | - | - | Chip | compliant | - | - | - | - | - | - | - | 10 | GENERAL PURPOSE INDUCTOR | - | 0201 | - | 0.12 A | 0.047 μH | - | - | - | ||
CIL10NR10KNE Samsung Electro-Mechanics | In Stock | - | Datasheet | - | - | YES | WRAPAROUND | - | RECTANGULAR PACKAGE | 2 | FERRITE | - | - | 0.5 Ω | - | SAMSUNG ELECTRO-MECHANICS | - | - | - | - | - | - | - | 125 °C | -55 °C | - | CHIP, 0603 | 0.8 mm | 1.6 mm | SMT | 0.8 mm | Obsolete | - | - | - | Yes | 240 MHz | - | - | - | - | 10% | e3 | Yes | - | EAR99 | - | Matte Tin (Sn) - with Nickel (Ni) barrier | 8504.50.80.00 | - | Tape, Plastic | - | 1 | Chip | compliant | - | - | 25 MHz | - | RF INDUCTOR | DUAL ENDED | - | 15 | GENERAL PURPOSE INDUCTOR | - | 0603 | YES | 0.05 A | 0.1 μH | - | - | - | ||
CIL31NR33KNE Samsung Electro-Mechanics | In Stock | - | Datasheet | - | - | YES | WRAPAROUND | - | RECTANGULAR PACKAGE | 2 | FERRITE | - | - | 0.6 Ω | - | SAMSUNG ELECTRO-MECHANICS | - | - | - | - | - | - | - | 125 °C | -55 °C | - | 1206 | 1.1 mm | 3.2 mm | SMT | 1.6 mm | Obsolete | - | - | - | Yes | 145 MHz | - | - | - | - | 10% | e3 | Yes | - | EAR99 | - | Matte Tin (Sn) - with Nickel (Ni) barrier | 8504.50.80.00 | - | Tape, Plastic | - | 1 | Chip | compliant | - | - | 25 MHz | - | RF INDUCTOR | DUAL ENDED | - | 20 | GENERAL PURPOSE INDUCTOR | - | 1206 | YES | 0.25 A | 0.33 μH | - | - | - | ||
CIL31J1R2MNC Samsung Semiconductor | In Stock | - | Datasheet | - | - | - | - | - | - | - | Ferrite | - | - | 0.5 Ω | - | SAMSUNG SEMICONDUCTOR INC | - | - | - | - | - | - | - | 125 °C | -55 °C | - | 1206 | 1.1 mm | 3.2 mm | SMT | 1.6 mm | Active | - | - | - | Yes | 65 MHz | - | - | CIL | - | 20% | e3 | - | - | - | - | Matte Tin (Sn) - with Nickel (Ni) barrier | - | - | Tape, Paper | - | - | Chip | compliant | - | - | - | - | - | - | - | 45 | GENERAL PURPOSE INDUCTOR | - | 1206 | - | 0.1 A | 1.2 μH | - | - | - | ||
CIH03U3N1BNC Samsung Electro-Mechanics | In Stock | - | Datasheet | - | - | YES | WRAPAROUND | - | RECTANGULAR PACKAGE | 2 | CERAMIC | - | - | 0.25 Ω | - | SAMSUNG ELECTRO-MECHANICS | - | - | - | - | - | - | - | 125 °C | -55 °C | - | 0201 | 0.3 mm | 0.6 mm | SMT | 0.3 mm | Obsolete | - | - | - | Yes | 9000 MHz | - | - | - | - | 6.4516% | - | Yes | - | EAR99 | - | - | 8504.50.80.00 | - | Tape, Paper | - | 1 | Rectangular | compliant | - | - | 500 MHz | - | RF INDUCTOR | DUAL ENDED | - | 14 | GENERAL PURPOSE INDUCTOR | - | 0201 | NO | 0.5 A | 0.0031 μH | - | - | - | ||
CIL31N47NMNC Samsung Semiconductor | In Stock | - | Datasheet | - | - | - | - | - | - | - | Ferrite | - | - | 0.15 Ω | - | SAMSUNG SEMICONDUCTOR INC | - | - | - | - | - | - | - | 125 °C | -55 °C | - | 1206 | 1.1 mm | 3.2 mm | SMT | 1.6 mm | Active | - | - | - | Yes | 320 MHz | - | - | CIL | - | 20% | e3 | - | - | - | - | Matte Tin (Sn) - with Nickel (Ni) barrier | - | - | Tape, Paper | - | - | Chip | compliant | - | - | - | - | - | - | - | 20 | GENERAL PURPOSE INDUCTOR | - | 1206 | - | 0.3 A | 0.047 µH | - | - | - | ||
CIH03U1N8BNC Samsung Semiconductor | In Stock | - | Datasheet | - | - | - | - | - | - | - | Ceramic | - | - | 0.15 Ω | - | SAMSUNG SEMICONDUCTOR INC | - | - | - | CIH | - | - | - | 125 °C | -55 °C | - | 0201 | 0.3 mm | 0.6 mm | SMT | 0.3 mm | Active | - | - | - | - | 10000 MHz | - | - | CIH | - | - | - | - | - | - | - | - | - | - | Tape, Paper | - | - | Chip | compliant | - | - | - | - | - | - | - | 14 | GENERAL PURPOSE INDUCTOR | - | 0201 | - | 0.8 A | 0.0018 µH | - | - | - | ||
CIL10J1R0MNC Samsung Electro-Mechanics | In Stock | - | Datasheet | - | - | YES | WRAPAROUND | - | RECTANGULAR PACKAGE | 2 | FERRITE | - | - | 0.6 Ω | - | SAMSUNG ELECTRO-MECHANICS | - | - | - | - | - | - | - | 125 °C | -55 °C | - | 0603 | 0.8 mm | 1.6 mm | SMT | 0.8 mm | Obsolete | - | - | - | Yes | 70 MHz | - | - | - | - | 20% | e3 | Yes | - | EAR99 | - | Matte Tin (Sn) - with Nickel (Ni) barrier | 8504.50.80.00 | - | Tape, Paper | - | 1 | Chip | compliant | - | - | 10 MHz | - | RF INDUCTOR | DUAL ENDED | - | 35 | GENERAL PURPOSE INDUCTOR | - | 0603 | YES | 0.025 A | 1 µH | - | - | - | ||
CIL31J2R2MNE Samsung Semiconductor | In Stock | - | Datasheet | - | - | - | - | - | - | - | Ferrite | - | - | 0.6 Ω | - | SAMSUNG SEMICONDUCTOR INC | - | - | - | - | - | - | - | 125 °C | -55 °C | - | 1206 | 1.1 mm | 3.2 mm | SMT | 1.6 mm | Active | - | - | - | Yes | 50 MHz | - | - | CIL | - | 20% | e3 | - | - | - | - | Matte Tin (Sn) - with Nickel (Ni) barrier | - | - | Tape, Plastic | - | - | Chip | compliant | - | - | - | - | - | - | - | 45 | GENERAL PURPOSE INDUCTOR | - | 1206 | - | 0.05 A | 2.2 µH | - | - | - | ||
CIH21TR10JNE Samsung Semiconductor | In Stock | - | Datasheet | - | - | - | - | - | - | - | Ceramic | - | - | - | - | SAMSUNG SEMICONDUCTOR INC | - | - | - | - | - | - | - | - | - | - | 0805 | 1 mm | 2 mm | SMT | 1.25 mm | Obsolete | - | - | - | Yes | - | - | - | - | - | 10% | e3 | Yes | - | EAR99 | - | Matte Tin (Sn) - with Nickel (Ni) barrier | 8504.50.80.00 | - | TR, Embossed, 7 Inch | - | - | Air Gap | compliant | - | - | - | - | - | - | - | - | GENERAL PURPOSE INDUCTOR | - | 0805 | NO | 0.3 A | 0.1 µH | - | - | - | ||
CIH03U2N4SNC Samsung Electro-Mechanics | In Stock | - | Datasheet | - | - | YES | WRAPAROUND | - | RECTANGULAR PACKAGE | 2 | Ceramic | - | - | 0.18 Ω | - | SAMSUNG ELECTRO-MECHANICS | - | - | - | - | - | - | - | 125 °C | -55 °C | - | 0201 | 0.3 mm | 0.6 mm | SMT | 0.3 mm | Obsolete | - | - | - | Yes | 10000 MHz | - | - | - | - | 12.5% | - | Yes | - | EAR99 | - | - | 8504.50.80.00 | - | Tape, Paper | - | 1 | Chip | compliant | - | - | 500 MHz | - | RF INDUCTOR | DUAL ENDED | - | 15 | GENERAL PURPOSE INDUCTOR | - | 0201 | NO | 0.7 A | 0.0024 µH | - | - | - | ||
CIH10TR10KNC Samsung Semiconductor | In Stock | - | Datasheet | - | - | - | - | - | - | - | Ceramic | - | - | 1 Ω | - | SAMSUNG SEMICONDUCTOR INC | - | - | - | CIH | - | - | - | 125 °C | -55 °C | - | 0603 | 0.8 mm | 1.6 mm | SMT | 0.8 mm | Active | - | - | - | Yes | 600 MHz | - | - | CIH | - | 10% | e3 | - | - | - | - | Matte Tin (Sn) - with Nickel (Ni) barrier | - | - | Tape, Paper | - | - | Chip | compliant | - | - | - | - | - | - | - | 12 | GENERAL PURPOSE INDUCTOR | - | 0603 | - | 0.35 A | 0.1 µH | - | - | - | ||
CIL31NR12KNC Samsung Semiconductor | In Stock | - | Datasheet | - | - | - | - | - | - | - | Ferrite | - | - | 0.3 Ω | - | SAMSUNG SEMICONDUCTOR INC | - | - | - | - | - | - | - | 125 °C | -55 °C | - | 1206 | 1.1 mm | 3.2 mm | SMT | 1.6 mm | Active | - | - | - | Yes | 220 MHz | - | - | CIL | - | 10% | e3 | - | - | - | - | Matte Tin (Sn) - with Nickel (Ni) barrier | - | - | Tape, Paper | - | - | Chip | compliant | - | - | - | - | - | - | - | 20 | GENERAL PURPOSE INDUCTOR | - | 1206 | - | 0.25 A | 0.12 µH | - | - | - | ||
CIH05T82NKNC Samsung Electro-Mechanics | In Stock | - | Datasheet | - | - | YES | WRAPAROUND | - | RECTANGULAR PACKAGE | 2 | CERAMIC | - | - | 1.6 Ω | - | SAMSUNG ELECTRO-MECHANICS | - | - | - | - | - | - | - | 125 °C | -55 °C | - | 0402 | 0.5 mm | 1 mm | SMT | 0.5 mm | Obsolete | - | - | - | Yes | 600 MHz | - | - | - | - | 10% | e3 | Yes | - | EAR99 | - | Tin (Sn) - with Nickel (Ni) barrier | 8504.50.80.00 | - | Tape, Paper | - | 1 | Rectangular | compliant | - | - | 100 MHz | - | RF INDUCTOR | DUAL ENDED | - | 8 | GENERAL PURPOSE INDUCTOR | - | 0402 | NO | 0.15 A | 0.082 µH | - | - | - | ||
CIG22E2R2MAE Samsung Semiconductor | In Stock | - | Datasheet | - | - | - | - | - | - | - | - | - | - | 0.146 Ω | - | SAMSUNG SEMICONDUCTOR INC | - | - | - | CIG22E-MAE | - | - | - | 125 °C | -40 °C | - | 1008 | 0.8 mm | 2.5 mm | SMT | 2 mm | Active | - | - | - | - | - | - | - | CIG22E-MAE | - | 20% | - | - | - | - | - | - | - | - | Tape, Embossed | - | - | Chip | compliant | - | - | - | - | - | - | - | - | GENERAL PURPOSE INDUCTOR | - | 1008 | - | 1.3 A | 2.2 µH | - | - | - | ||
CIH03U2N2BNC Samsung Semiconductor | In Stock | - | Datasheet | - | - | - | - | - | - | - | Ceramic | - | - | 0.15 Ω | - | SAMSUNG SEMICONDUCTOR INC | - | - | - | CIH | - | - | - | 125 °C | -55 °C | - | 0201 | 0.3 mm | 0.6 mm | SMT | 0.3 mm | Active | - | - | - | - | 10000 MHz | - | - | CIH | - | - | - | - | - | - | - | - | - | - | Tape, Paper | - | - | Chip | compliant | - | - | - | - | - | - | - | 15 | GENERAL PURPOSE INDUCTOR | - | 0201 | - | 0.7 A | 0.0022 μH | - | - | - |