- ECCN Code
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- HTS Code
- Memory IC Type
- JESD-30 Code
- Memory Density
- Memory Width
- Number of Terminals
- Number of Words
- Number of Words Code
Attribute column
Manufacturer
Silicon Storage Tech Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Output Enable | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Access Mode | Reverse Pinout | Self Refresh | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 IS42R16320D-7BL Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 54 | 5.4 ns | 143 MHz | INTEGRATED SILICON SOLUTION INC | - | 33554432 words | 32000000 | 70 °C | - | PLASTIC/EPOXY | TFBGA | TFBGA, BGA54,9X9,32 | BGA54,9X9,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | DSBGA | Yes | 2.5 V | - | - | EAR99 | - | AUTO/SELF REFRESH | 8542.32.00.28 | BOTTOM | BALL | - | 1 | 0.8 mm | compliant | - | 54 | R-PBGA-B54 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 1 | SYNCHRONOUS | 0.22 mA | 32MX16 | 3-STATE | 1.2 mm | 16 | 0.004 A | 536870912 bit | - | - | COMMON | SYNCHRONOUS DRAM | - | - | 8192 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | - | YES | 13 mm | 8 mm | ||
 IC43R16160-6TG Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 66 | 0.7 ns | 166 MHz | INTEGRATED SILICON SOLUTION INC | - | 16777216 words | 16000000 | 70 °C | - | PLASTIC/EPOXY | TSOP2 | TSOP2, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | - | Yes | 2.5 V | e3 | - | EAR99 | MATTE TIN | AUTO/SELF REFRESH | 8542.32.00.24 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 10 | - | R-PDSO-G66 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 1 | SYNCHRONOUS | 0.35 mA | 16MX16 | 3-STATE | 1.2 mm | 16 | - | 268435456 bit | - | - | COMMON | DDR1 DRAM | - | - | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | - | YES | 22.22 mm | 10.16 mm | ||
IC41C16256-35KG Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 40 | 35 ns | - | INTEGRATED SILICON SOLUTION INC | - | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | SOJ | SOJ, SOJ40,.44 | SOJ40,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | - | Yes | 5 V | e3 | - | EAR99 | MATTE TIN | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | J BEND | 260 | 1 | 1.27 mm | compliant | 10 | - | R-PDSO-J40 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.23 mA | 256KX16 | 3-STATE | - | 16 | 0.001 A | 4194304 bit | - | - | COMMON | EDO DRAM | - | - | 512 | - | - | EDO PAGE | - | NO | - | - | ||
 IS61NW6432-7TQ Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 100 | 7 ns | - | INTEGRATED SILICON SOLUTION INC | - | 65536 words | 64000 | 70 °C | - | PLASTIC/EPOXY | LQFP | TQFP-100 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 3.3 V | e0 | - | 3A991.B.2.A | TIN LEAD | SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE | 8542.32.00.41 | QUAD | GULL WING | - | 1 | 0.65 mm | compliant | - | 100 | R-PQFP-G100 | Not Qualified | 3.63 V | COMMERCIAL | 3.135 V | - | SYNCHRONOUS | 0.21 mA | 64KX32 | 3-STATE | 1.6 mm | 32 | 0.06 A | 2097152 bit | - | PARALLEL | COMMON | ZBT SRAM | 3.14 V | - | - | - | - | - | - | - | 20 mm | 14 mm | ||
IS61LPS25636T-133TQ Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 100 | 4 ns | 133 MHz | INTEGRATED SILICON SOLUTION INC | - | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | LQFP | TQFP-100 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 3.3 V | e0 | No | 3A991.B.2.A | TIN LEAD | - | 8542.32.00.41 | QUAD | GULL WING | - | 1 | 0.65 mm | compliant | - | 100 | R-PQFP-G100 | Not Qualified | 3.63 V | COMMERCIAL | 3.135 V | - | SYNCHRONOUS | 0.23 mA | 256KX36 | 3-STATE | 1.6 mm | 36 | 0.04 A | 9437184 bit | - | PARALLEL | COMMON | CACHE SRAM | 3.14 V | - | - | - | - | - | - | - | 20 mm | 14 mm | ||
 IS61LV256AL-10JI Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 28 | 10 ns | - | INTEGRATED SILICON SOLUTION INC | 3 | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ28,.34 | SOJ28,.34 | RECTANGULAR | SMALL OUTLINE | Active | SOJ | No | 3.3 V | e0 | No | EAR99 | TIN LEAD | - | 8542.32.00.41 | DUAL | J BEND | - | 1 | 1.27 mm | compliant | - | 28 | R-PDSO-J28 | Not Qualified | 3.63 V | INDUSTRIAL | 3.135 V | - | ASYNCHRONOUS | 0.025 mA | 32KX8 | 3-STATE | 3.76 mm | 8 | 0.00005 A | 262144 bit | - | PARALLEL | COMMON | STANDARD SRAM | 2 V | - | - | - | - | - | - | - | 18.12 mm | 7.58 mm | ||
IS61SP25618-133TQ Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 100 | 4 ns | 133 MHz | INTEGRATED SILICON SOLUTION INC | - | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | LQFP | TQFP-100 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 3.3 V | e0 | No | 3A991.B.2.A | TIN LEAD | SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE | 8542.32.00.41 | QUAD | GULL WING | - | 1 | 0.65 mm | compliant | - | 100 | R-PQFP-G100 | Not Qualified | 3.63 V | COMMERCIAL | 3.135 V | - | SYNCHRONOUS | 0.17 mA | 256KX18 | 3-STATE | 1.6 mm | 18 | 0.015 A | 4718592 bit | - | PARALLEL | COMMON | CACHE SRAM | 3.14 V | - | - | - | - | - | - | - | 20 mm | 14 mm | ||
AP9A128-12VC Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 28 | 12 ns | - | INTEGRATED SILICON SOLUTION INC | - | 32768 words | 32000 | 70 °C | - | PLASTIC/EPOXY | SOJ | 0.300 INCH, SOJ-28 | SOJ28,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | - | No | 5 V | e0 | - | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.41 | DUAL | J BEND | - | 1 | 1.27 mm | compliant | - | - | R-PDSO-J28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | - | ASYNCHRONOUS | 0.1 mA | 32KX8 | 3-STATE | 3.556 mm | 8 | 0.01 A | 262144 bit | - | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | - | - | - | - | - | - | - | 17.907 mm | 7.518 mm | ||
 IS61NVP25636A-200B2LI Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 119 | 3.1 ns | - | INTEGRATED SILICON SOLUTION INC | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | RECTANGULAR | GRID ARRAY | Active | BGA | Yes | 2.5 V | e1 | Yes | 3A991.B.2.A | TIN SILVER COPPER | PIPELINED ARCHITECTURE | 8542.32.00.41 | BOTTOM | BALL | - | 1 | 1.27 mm | compliant | - | 119 | R-PBGA-B119 | Not Qualified | 2.625 V | INDUSTRIAL | 2.375 V | - | SYNCHRONOUS | - | 256KX36 | - | 2.41 mm | 36 | - | 9437184 bit | - | PARALLEL | - | ZBT SRAM | - | - | - | - | - | - | - | - | 22 mm | 14 mm | ||
 IS49NLC18160-25EBLI Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 144 | 2.5 ns | 400 MHz | INTEGRATED SILICON SOLUTION INC | - | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, BGA144,12X18,40/32 | BGA144,12X18,40/32 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | Yes | 1.8 V | - | - | EAR99 | - | AUTO REFRESH | 8542.32.00.28 | BOTTOM | BALL | - | 1 | 1 mm | compliant | - | 144 | R-PBGA-B144 | Not Qualified | 1.9 V | INDUSTRIAL | 1.7 V | 1 | SYNCHRONOUS | 0.98 mA | 16MX18 | 3-STATE | 1.2 mm | 18 | - | 301989888 bit | - | - | COMMON | DDR DRAM | - | - | - | 2,4,8 | - | MULTI BANK PAGE BURST | - | - | 18.5 mm | 11 mm | ||
IS61SF6432-10PQ Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 100 | 10 ns | 66 MHz | INTEGRATED SILICON SOLUTION INC | - | 65536 words | 64000 | 70 °C | - | PLASTIC/EPOXY | LQFP | PLASTIC, QFP-100 | QFP100,.7X.9 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 3.3 V | e0 | - | 3A991.B.2.A | Tin/Lead (Sn/Pb) | SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE | 8542.32.00.41 | QUAD | GULL WING | - | 1 | 0.65 mm | unknown | - | 100 | R-PQFP-G100 | Not Qualified | 3.63 V | COMMERCIAL | 3.135 V | - | SYNCHRONOUS | 0.29 mA | 64KX32 | 3-STATE | 1.6 mm | 32 | 0.01 A | 2097152 bit | - | PARALLEL | COMMON | CACHE SRAM | 3.14 V | - | - | - | - | - | - | - | 20 mm | 14 mm | ||
IS42VS32200E-10BLI Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 90 | 8 ns | 100 MHz | INTEGRATED SILICON SOLUTION INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | LFBGA, BGA90,9X15,32 | BGA90,9X15,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | e1 | Yes | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | 8542.32.00.02 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 10 | 90 | R-PBGA-B90 | Not Qualified | 1.9 V | INDUSTRIAL | 1.7 V | 1 | SYNCHRONOUS | 0.09 mA | 2MX32 | 3-STATE | 1.45 mm | 32 | 0.001 A | 67108864 bit | - | - | COMMON | SYNCHRONOUS DRAM | - | - | 4096 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | - | YES | 13 mm | 8 mm | ||
 IS45S81600E-7CTLA2 Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 54 | 5.4 ns | - | INTEGRATED SILICON SOLUTION INC | - | 16777216 words | 16000000 | 105 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | - | 3.3 V | e3 | - | EAR99 | MATTE TIN | AUTO/SELF REFRESH | 8542.32.00.02 | DUAL | GULL WING | - | 1 | 0.8 mm | unknown | - | 54 | R-PDSO-G54 | - | 3.6 V | INDUSTRIAL | 3 V | 1 | SYNCHRONOUS | - | 16MX8 | - | 1.2 mm | 8 | - | 134217728 bit | - | - | - | SYNCHRONOUS DRAM | - | - | - | - | - | FOUR BANK PAGE BURST | - | YES | 22.22 mm | 10.16 mm | ||
AS7C251MPFS18A-166TQC Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 100 | 3.5 ns | - | INTEGRATED SILICON SOLUTION INC | - | 1048576 words | 1000000 | 70 °C | - | PLASTIC/EPOXY | LQFP | LQFP, | - | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 2.5 V | e0 | No | 3A991.B.2.A | TIN LEAD | PIPELINED ARCHITECTURE | 8542.32.00.41 | QUAD | GULL WING | - | 1 | 0.65 mm | compliant | - | 100 | R-PQFP-G100 | Not Qualified | 2.625 V | COMMERCIAL | 2.375 V | - | SYNCHRONOUS | - | 1MX18 | - | 1.6 mm | 18 | - | 18874368 bit | - | PARALLEL | - | STANDARD SRAM | - | - | - | - | - | - | - | - | 20 mm | 14 mm | ||
IS42R16800E-8TLI Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 54 | 7 ns | - | INTEGRATED SILICON SOLUTION INC | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | Yes | 2.5 V | e3 | Yes | EAR99 | Matte Tin (Sn) | AUTO/SELF REFRESH | 8542.32.00.02 | DUAL | GULL WING | 260 | 1 | 0.8 mm | compliant | 40 | 54 | R-PDSO-G54 | Not Qualified | 2.7 V | INDUSTRIAL | 2.3 V | 1 | SYNCHRONOUS | - | 8MX16 | - | 1.2 mm | 16 | - | 134217728 bit | - | - | - | SYNCHRONOUS DRAM | - | - | - | - | - | FOUR BANK PAGE BURST | - | YES | 22.22 mm | 10.16 mm | ||
IS61NVP51236B-200B2LI Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 119 | 3 ns | - | INTEGRATED SILICON SOLUTION INC | - | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | HBGA | HBGA, | - | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | Obsolete | - | - | 2.5 V | - | - | 3A991.B.2.A | - | - | 8542.32.00.41 | BOTTOM | BALL | - | 1 | 1.27 mm | unknown | - | - | R-PBGA-B119 | - | 2.625 V | INDUSTRIAL | 2.375 V | - | SYNCHRONOUS | - | 512KX36 | - | 3.5 mm | 36 | - | 18874368 bit | - | PARALLEL | - | STANDARD SRAM | - | - | - | - | - | - | - | - | 22 mm | 14 mm | ||
IS64LF12832EC-6.5B3LA3 Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 165 | 6.5 ns | 133 MHz | INTEGRATED SILICON SOLUTION INC | 3 | 131072 words | 128000 | 125 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Active | BGA | Yes | 3.3 V | e1 | - | 3A991.B.2.A | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.32.00.41 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 10 | 165 | R-PBGA-B165 | Not Qualified | 3.465 V | AUTOMOTIVE | 3.135 V | - | SYNCHRONOUS | 0.2 mA | 128KX32 | 3-STATE | 1.2 mm | 32 | 0.1 A | 4194304 bit | AEC-Q100 | PARALLEL | COMMON | CACHE SRAM | 3.14 V | - | - | - | - | - | - | - | 15 mm | 13 mm | ||
 IS61NVP25618A-250B3I Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 165 | 2.6 ns | 250 MHz | INTEGRATED SILICON SOLUTION INC | - | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Active | BGA | No | 2.5 V | e0 | No | 3A991.B.2.A | TIN LEAD | PIPELINED ARCHITECTURE | 8542.32.00.41 | BOTTOM | BALL | - | 1 | 1 mm | compliant | - | 165 | R-PBGA-B165 | Not Qualified | 2.625 V | INDUSTRIAL | 2.375 V | - | SYNCHRONOUS | 0.25 mA | 256KX18 | 3-STATE | 1.2 mm | 18 | 0.035 A | 4718592 bit | - | PARALLEL | COMMON | ZBT SRAM | 2.38 V | - | - | - | - | - | - | - | 15 mm | 13 mm | ||
IS64VLPS204836B-166B3LA3 Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 165 | 3.5 ns | 166 MHz | INTEGRATED SILICON SOLUTION INC | - | 2097152 words | 2000000 | 125 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | Yes | 2.5 V | - | - | 3A991.B.2.A | - | - | 8542.32.00.41 | BOTTOM | BALL | - | 1 | 1 mm | compliant | - | 165 | R-PBGA-B165 | Not Qualified | 2.625 V | AUTOMOTIVE | 2.375 V | - | SYNCHRONOUS | - | 2MX36 | 3-STATE | 1.2 mm | 36 | - | 75497472 bit | AEC-Q100 | PARALLEL | COMMON | CACHE SRAM | 3.14 V | - | - | - | - | - | - | - | 15 mm | 13 mm | ||
IS67WVE4M16TBLL-70BLA1 Integrated Silicon Solution Inc | In Stock | - | Datasheet | YES | 48 | 70 ns | - | INTEGRATED SILICON SOLUTION INC | - | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA48,6X8,30 | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | Yes | - | e1 | - | 3A991.B.2.A | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.32.00.41 | BOTTOM | BALL | 260 | 1 | 0.75 mm | compliant | 10 | - | R-PBGA-B48 | - | 3.6 V | INDUSTRIAL | 2.7 V | 1 | ASYNCHRONOUS | 0.025 mA | 4MX16 | 3-STATE | 1.2 mm | 16 | 0.00015 A | 67108864 bit | AEC-Q100 | PARALLEL | COMMON | PSEUDO STATIC RAM | 2.7 V | NO | - | - | - | - | NO | - | 8 mm | 6 mm |