- ECCN Code
- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Memory IC Type
- Number of Terminals
- Operating Temperature-Max
- Package Body Material
- Package Code
- Package Description
- Package Shape
- Package Style
Attribute column
Manufacturer
Silicon Storage Tech Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Memory IC Type | Mixed Memory Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 SST30VR021-500-C-WH Silicon Storage Technology | In Stock | - | Datasheet | YES | 32 | SILICON STORAGE TECHNOLOGY INC | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP32,.56,20 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3 V | e0 | EAR99 | TIN LEAD | ALSO CONTAINS 128K X 8 SRAM | 8542.32.00.71 | DUAL | GULL WING | - | 1 | 0.5 mm | unknown | - | 32 | R-PDSO-G32 | Not Qualified | 3.3 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.0065 mA | 256KX8 | 1.2 mm | 8 | 0.00001 A | 2097152 bit | MEMORY CIRCUIT | ROM+SRAM | 12.4 mm | 8 mm | ||
 SST30VR023-500-C-KH Silicon Storage Technology | In Stock | - | Datasheet | YES | 32 | SILICON STORAGE TECHNOLOGY INC | - | - | 70 °C | - | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP32,.56,20 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | - | No | 3 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.71 | DUAL | GULL WING | - | - | 0.5 mm | unknown | - | - | R-PDSO-G32 | Not Qualified | - | COMMERCIAL | - | - | 0.0065 mA | - | - | - | 0.00001 A | - | MEMORY CIRCUIT | ROM+SRAM | - | - | ||
SST32HF64A2-70-4E-L2SE Silicon Storage Technology | In Stock | - | Datasheet | YES | 64 | SILICON STORAGE TECHNOLOGY INC | 4194304 words | 4000000 | 85 °C | -20 °C | PLASTIC/EPOXY | LFBGA | LFBGA, | - | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | Yes | 3 V | e1 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PSRAM IS ORGANIZED AS 1024K X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 24 | 64 | R-PBGA-B64 | Not Qualified | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | - | 4MX16 | 1.4 mm | 16 | - | 67108864 bit | MEMORY CIRCUIT | - | 10 mm | 8 mm | ||
 SST34HF1642C-70-4E-L1PE Silicon Storage Technology | In Stock | - | Datasheet | YES | 56 | SILICON STORAGE TECHNOLOGY INC | 1048576 words | 1000000 | 85 °C | -20 °C | PLASTIC/EPOXY | LFBGA | LFBGA, | - | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | - | 3 V | - | EAR99 | - | SRAM IS ORGANIZED AS 256K X 16 / 512K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8 | 8542.32.00.71 | BOTTOM | BALL | - | 1 | 0.8 mm | unknown | - | 56 | R-PBGA-B56 | Not Qualified | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | - | 1MX16 | 1.4 mm | 16 | - | 16777216 bit | MEMORY CIRCUIT | - | 10 mm | 8 mm |