- ECCN Code
- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- JESD-609 Code
- Number of Terminals
- Operating Temperature-Max
- Package Body Material
- Package Code
- Package Equivalence Code
- Package Shape
- Package Style
Attribute column
Manufacturer
STMicroelectronics Specialized
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Ihs Manufacturer | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | I/O Type | Memory IC Type | Mixed Memory Type | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M36L0R7040U3ZA5U SGS Thomson | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
MAP168-45L Waferscale Integration Inc | In Stock | - | Datasheet | YES | 44 | 45 ns | WAFERSCALE INTEGRATION INC | - | - | 70 °C | - | CERAMIC | QCCJ | - | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | - | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.71 | QUAD | J BEND | - | 1.27 mm | unknown | - | S-XQCC-J44 | Not Qualified | - | COMMERCIAL | - | - | 0.143 mA | - | - | - | - | 0.001 A | - | - | - | - | - | - | ||
HCF40108BF SGS-Ates Componenti Electronici SPA | In Stock | - | Datasheet | NO | 24 | - | SGS-ATES COMPONENTI ELECTRONICI S P A | - | - | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | - | No | - | e0 | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.71 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | R-XDIP-T24 | Not Qualified | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
 M36L0R8060T1ZAQE STMicroelectronics | In Stock | - | Datasheet | YES | 88 | - | STMICROELECTRONICS | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 1.8 V | e1 | EAR99 | TIN SILVER COPPER | PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 88 | R-PBGA-B88 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 0.052 mA | 16MX16 | - | 1.2 mm | 16 | 0.00011 A | 268435456 bit | - | MEMORY CIRCUIT | FLASH+PSRAM | 10 mm | 8 mm | ||
M36W0R6050B1ZAQF STMicroelectronics | In Stock | - | Datasheet | YES | 88 | 70 ns | STMICROELECTRONICS | 4194304 words | 4000000 | 85 °C | -30 °C | PLASTIC/EPOXY | TFBGA | 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 1.8 V | e1 | EAR99 | TIN SILVER COPPER | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 88 | R-PBGA-B88 | Not Qualified | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | - | 4MX16 | - | 1.2 mm | 16 | - | 67108864 bit | - | MEMORY CIRCUIT | FLASH+PSRAM | 10 mm | 8 mm | ||
M36DR232A120ZA6C STMicroelectronics | In Stock | - | Datasheet | YES | 66 | 120 ns | STMICROELECTRONICS | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | 0.80 MM PITCH, STACK, LFBGA-66 | BGA66,8X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Transferred | BGA | No | - | e0 | EAR99 | TIN LEAD | THE DEVICE ALSO CONTAINS A 2 MBIT (128K X16) SRAM | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | not_compliant | 66 | R-PBGA-B66 | Not Qualified | 2.2 V | INDUSTRIAL | 1.65 V | ASYNCHRONOUS | 0.04 mA | 2MX16 | - | 1.4 mm | 16 | 0.000025 A | 33554432 bit | - | MEMORY CIRCUIT | FLASH+SRAM | 12 mm | 8 mm | ||
M2704 SGS-Ates Componenti Electronici SPA | In Stock | - | Datasheet | NO | 24 | 450 ns | SGS-ATES COMPONENTI ELECTRONICI S P A | 512 words | 512 | 70 °C | - | CERAMIC | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | - | No | - | e0 | EAR99 | Tin/Lead (Sn/Pb) | - | 8542.32.00.71 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | R-XDIP-T24 | Not Qualified | - | COMMERCIAL | - | - | - | 512X8 | 3-STATE | - | 8 | - | 4096 bit | COMMON | - | - | - | - |