- Contact Materials
- Contact Plating
- Number of Contacts
- Housing Material
- Gender
- RoHS
- Pitch
- Type
- Body Orientation
- Termination Method
- Mounting Styles
- Insulation Resistance
Attribute column
Manufacturer
TE Connectivity Sockets for ICs, Transistors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Contact Plating | Base/Housing Material | Body Orientation | Card & Socket Accessory Typeu2009 | Centerline (Pitch)u2009 | Compatible With IC Socket Typeu2009 | Connector & Contact Terminates Tou2009 | Connector Systemu2009 | Contact Current Rating (Max)u2009(A) | Contact Materials | Contact Mating Area Plating Material Thicknessu2009(µin) | Device Typeu2009 | DRAM Typeu2009 | Fin Styleu2009 | IC Socket Typeu2009 | Leg Styleu2009 | Module Orientationu2009 | Mounting | Number of Finsu2009 | Number of Positionsu2009 | Operating Temperature Rangeu2009 | Operating Temperature Rangeu2009(°C) | PCB Hole Diameteru2009 | PCB Mounting Styleu2009 | Power Ratingu2009(W) | Socket Lengthu2009 | Socket Sleeve Styleu2009 | Stack Heightu2009 | TE Internal # | TE Internal Description | Termination Method | Voltage, Rating | Wire Size | Wire Sizeu2009(AWG) | Wire Sizeu2009(mm²) | Operating Temperature | Temperature Coefficient | Type | Resistance | Number of Rows | Gender | Power Rating | Pitch | Resistor Type | Housing Color | Resistance Tolerance | Product Length | Product Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 2310927-1 TE Connectivity | In Stock | - | - | - | - | - | Carrier | - | LGA 3647, Metric PQFP | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -25 – 100u2009°Cu2009[u2009-13 – 212u2009°Fu2009] | - | - | - | - | - | - | - | 2310927-1 | CARRIER, NARROW FABRIC, SOCKET P | - | - | - | - | - | - | 50.0000 ppm/°C | - | 232 Ohm | - | - | 0.125 W | - | High Reliability, MIL-PRF-55182 | - | 1 | 7.62 | - | ||
2309409-2 TE Connectivity | 2800 | - | - | - | - | - | - | - | - | - | Cable-to-Board | - | - | - | - | Small Outline (SO) | - | - | - | Right Angle | - | - | 260 | - | - | - | - | - | - | - | 5.2u2009mmu2009[u2009.205u2009inu2009] | 2309409-2 | DDR4 SODIMM 260P 5.2H STD | - | - | - | - | - | - | 100 ppm/K | - | 301 Ohm | - | - | 0.25 W | - | General Purpose | - | 1 | - | - | ||
292407-4 TE Connectivity | In Stock | - | - | - | - | - | - | - | - | - | Cable-to-Board | - | - | - | - | Double Data Rate (DDR) 2 | - | - | - | Right Angle | - | - | 200 | - | - | - | - | - | - | - | 4u2009mmu2009[u2009.157u2009inu2009] | 292407-4 | EMBOSS DDR2 SODIMM 200P 4H RVS | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
1-2324271-1 TE Connectivity | In Stock | - | - | Tin | Thermoplastic | Straight | - | - | - | - | Board-to-Board | - | Phosphor Bronze | 30 | - | - | - | LGA 4189 | - | - | Cable Mount | - | 2092 | - | - | - | Surface Mount Solder Ball | - | - | - | - | 1-2324271-1 | RIGHT SEGMENT LGA4189-4 SOCKETP4 FOR ODM | Screw | - | 28 to 16, 28 AWG | - | - | -40 to 115 °C | - | Terminal Block | - | 1 | Receptacle | - | 3.5000 mm | - | Green | - | 7 mm | - | ||
1-2199154-1 TE Connectivity | In Stock | - | - | - | - | - | - | - | - | - | Board-to-Board | - | - | - | - | Double Data Rate (DDR) 4 | - | - | - | Vertical | - | - | 288 | - | - | - | Through Hole - Solder | - | - | - | - | 1-2199154-1 | DDR4 DIMM 288 Pin TH type | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
1-2199154-4 TE Connectivity | In Stock | - | - | - | - | - | - | - | - | - | Board-to-Board | - | - | - | - | Double Data Rate (DDR) 4 | - | - | - | Vertical | - | - | 288 | - | - | - | Through Hole - Solder | - | - | - | - | 1-2199154-4 | DDR4 DIMM 288 Pin TH type | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
2-2330551-2 TE Connectivity | In Stock | - | - | - | - | - | Backplate | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -25 – 100 | - | - | - | - | - | - | 2-2330551-2 | SOCKET P4/P5 BACKPLATE ASSY,STUD 7.12MM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
5645508-1 TE Connectivity | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.83u2009mmu2009[u2009.072u2009inu2009] | - | - | 5.23u2009mmu2009[u2009.206u2009inu2009] | Closed Bottom | - | 5645508-1 | SKT, M.S.S. SER 4, SPL | - | - | - | 19 | .653 | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
1-5331677-3 TE Connectivity | 7876 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.57u2009mmu2009[u2009.062u2009inu2009] | - | - | 3.51u2009mmu2009[u2009.138u2009inu2009] | Closed Bottom | - | 1-5331677-3 | SOCKET,MIN-SPR SN SER-3U SER-3 | - | - | - | 20 – 21 | .41 – .518 | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
1814655-5 TE Connectivity | 10 |
| - | - | - | - | - | 2.54u2009mmu2009[u2009.1u2009inu2009] | - | Printed Circuit Board | - | 1 | - | - | - | - | - | - | Standard | - | - | - | 10 | - | - | - | - | - | - | - | - | 1814655-5 | SIP IC Skt 10 SSR Sn/Au 0.75 RoHS | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
1542993-2 TE Connectivity | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | SFP | - | Pin Fin | - | - | - | - | 50 | - | - | - | - | - | 5, 10, 15 | - | - | - | 1542993-2 | SFP HEATSINK 13.5MM TALL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
50865 TE Connectivity | 20 |
| - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.83u2009mmu2009[u2009.072u2009inu2009] | - | - | 6.6u2009mmu2009[u2009.26u2009inu2009] | Closed Bottom | - | 50865 | SOCKET,MIN-SPR AU SER-4 | - | - | - | 20 – 18 | .518 – .823 | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
50871-4 TE Connectivity | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.56u2009mmu2009[u2009.101u2009inu2009] | - | - | 7.32u2009mmu2009[u2009.288u2009inu2009] | Closed Bottom | - | 50871-4 | SOCKET,MIN-SPR AU SER-5 | - | - | - | 18 – 17 | .823 – 1.04 | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
1-2324271-4 TE Connectivity | 168 | - | - | - | - | - | - | - | - | - | Board-to-Board | - | - | 15 | - | - | - | LGA 4189 | - | - | - | - | 2097 | - | - | - | Surface Mount Solder Ball | - | - | - | - | 1-2324271-4 | LEFT SEGMENT LGA4189-4 SOCKET-P4 FOR ODM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
2-2330552-2 TE Connectivity | 3840 | - | - | Gold Over Nickel | PPS (Polyphenylene Sulfide) | Right Angle | Carrier | - | Metric PQFP | - | - | - | Phosphor Bronze | - | - | - | - | - | - | - | Through Hole | - | - | -25 – 100u2009°Cu2009[u2009-13 – 212u2009°Fu2009] | - | - | - | - | - | - | - | 2-2330552-2 | ICX POINT PHM CARRIER ASSY, P4 | Solder | - | - | - | - | -65 to 125 °C | - | - | - | - | RCP | - | 2.5400 mm | - | Natural | - | 150.88 mm | - | ||
322-HCS6P3-100 TE Connectivity | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.61u2009mmu2009[u2009.064u2009inu2009] | - | - | 3.45u2009mmu2009[u2009.136u2009inu2009] | Open Bottom | - | 4-1437514-4 | 322-HCS6P3-100=HOLT CNT SKT RE | - | - | - | 28 – 25 | .081 – .162 | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
2-2013289-3 TE Connectivity | In Stock | - | - | - | - | - | - | - | - | - | Cable-to-Board | - | - | - | - | Double Data Rate (DDR) 3 | - | - | - | Right Angle | - | - | 204 | - | - | - | - | - | - | - | 5.2u2009mmu2009[u2009.205u2009inu2009] | 2-2013289-3 | EMBOSS TAPE DDR3 204P 5.2H STD Au 0.76 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
2-2013290-3 TE Connectivity | In Stock | - | - | - | - | - | - | - | - | - | Cable-to-Board | - | - | - | - | Double Data Rate (DDR) 3 | - | - | - | Right Angle | - | - | 204 | - | - | - | - | - | - | - | 5.2u2009mmu2009[u2009.205u2009inu2009] | 2-2013290-3 | EMBOSS TAPE DDR3 204P 5.2H RVS Au 0.76 | - | 250 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
2-2013310-2 TE Connectivity | In Stock |
| - | - | - | - | - | - | - | - | Cable-to-Board | - | - | - | - | Double Data Rate (DDR) 3 | - | - | - | Right Angle | - | - | 204 | - | - | - | - | - | - | - | 9.2u2009mmu2009[u2009.362u2009inu2009] | 2-2013310-2 | EMBOSS TAPE DDR3 204P 9.2H STD | - | - | - | - | - | - | 200 ppm/K | - | 4.75 Ohm | - | - | 0.75 W | - | General Purpose | - | 1 | 5 | 2.5 | ||
5-2308107-5 TE Connectivity | In Stock | - | - | - | - | - | - | - | - | - | Board-to-Bus Bar | - | - | - | - | Double Data Rate (DDR) 4 | - | - | - | Vertical | - | - | 288 | - | - | - | Through Hole - Solder | - | - | - | - | 5-2308107-5 | DDR4 DIMM 288 PIN TH TYPE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |