Product
Brand
Articles
Tools- Ihs Manufacturer
- JESD-30 Code
- Memory Density
- Memory Width
- Number of Terminals
- Number of Words
- Number of Words Code
- Operating Temperature-Max
- Organization
- Package Body Material
- Package Description
- Package Shape
Attribute column
Manufacturer
Toshiba Memory - Modules
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Surface Mount | Material | Number of Terminals | Access Time-Max | Additionally | Date Of Intro | Gross weight | Ihs Manufacturer | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | Transport packaging size / quantity | Useful height (B) | JESD-609 Code | ECCN Code | Type | Terminal Finish | Color | Additional Feature | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Boot Block | Common Flash Interface | Features | Length | Width | Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 THGBMNG5D1LBAIT Toshiba America Electronic Components | In Stock | - | Datasheet | YES | polyethylene | 153 | - | with a red stripe | 2019-01-21 | 1.25 | TOSHIBA CORP | 4294967296 words | 4000000000 | 85 °C | -25 °C | PLASTIC/EPOXY | BGA | WFBGA-153 | - | RECTANGULAR | GRID ARRAY | Transferred | - | - | - | 48*31.5*22/15000 | 100 mm | - | EAR99 | PE bag with zip lock | - | transparent | - | 8542.32.00.51 | BOTTOM | BALL | 1 | - | unknown | - | R-PBGA-B153 | - | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | - | 4GX8 | - | - | 8 | - | 34359738368 bit | SERIAL | - | FLASH | 2.7 V | - | - | - | - | - | - | - | - | zip-lock | - | 100 mm | 45 μm | ||
TC58F400FT-90 Toshiba America Electronic Components | In Stock | - | Datasheet | YES | - | 48 | 90 ns | - | - | - | TOSHIBA CORP | 524288 words | 512000 | 70 °C | - | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, PLASTIC, TSOP-48 | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 5 V | - | - | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | - | 100000 ERASE/PROGRAM CYCLES; BLOCK ERASE; ALSO CONFIGURABLE AS 256K X 16 | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | - | 512KX8 | - | 1.2 mm | 8 | - | 4194304 bit | PARALLEL | - | FLASH | 5 V | - | - | - | - | - | - | BOTTOM | - | - | 18.4 mm | 12 mm | - | ||
TMM24128AP Toshiba America Electronic Components | In Stock | - | Datasheet | NO | - | 28 | 200 ns | - | - | - | TOSHIBA CORP | 16384 words | 16000 | 70 °C | - | PLASTIC/EPOXY | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Active | - | No | 5 V | - | - | e0 | EAR99 | - | Tin/Lead (Sn/Pb) | - | - | 8542.32.00.71 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | R-PDIP-T28 | Not Qualified | - | COMMERCIAL | - | - | - | 16KX8 | 3-STATE | - | 8 | - | 131072 bit | - | COMMON | - | 12.5 V | - | - | - | - | - | - | - | - | - | - | - | - | ||
TC58F400F-90 Toshiba America Electronic Components | In Stock | - | Datasheet | YES | - | 44 | 90 ns | - | - | - | TOSHIBA CORP | 524288 words | 512000 | 70 °C | - | PLASTIC/EPOXY | SOP | 0.600 INCH, PLASTIC, SOP-44 | - | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | - | - | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | - | 100000 ERASE/PROGRAM CYCLES; BLOCK ERASE; ALSO CONFIGURABLE AS 256K X 16 | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | - | 512KX8 | - | 3.1 mm | 8 | - | 4194304 bit | PARALLEL | - | FLASH | 5 V | - | - | - | - | - | - | BOTTOM | - | - | 28.2 mm | 12.6 mm | - | ||
TC58C256AXB Toshiba America Electronic Components | In Stock | - | Datasheet | YES | - | 69 | 103 ns | - | - | - | TOSHIBA CORP | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA69,10X12,32 | BGA69,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | - | No | - | - | - | - | EAR99 | - | - | - | - | 8542.32.00.51 | BOTTOM | BALL | - | 0.8 mm | unknown | - | R-PBGA-B69 | Not Qualified | - | INDUSTRIAL | - | - | 0.045 mA | 32MX8 | - | - | 8 | 0.00004 A | 268435456 bit | PARALLEL | - | FLASH | - | NO | NO | NO | 2K | 16K | 512 words | - | YES | - | - | - | - | ||
 TC58NYG0S3ETAI0 Toshiba America Electronic Components | In Stock | - | Datasheet | YES | - | 48 | - | - | - | - | TOSHIBA CORP | 134217728 words | 128000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, | - | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | TSOP | - | 1.8 V | - | - | - | EAR99 | - | - | - | - | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | - | 1.95 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | - | 128MX8 | - | 1.2 mm | 8 | - | 1073741824 bit | SERIAL | - | FLASH | 1.8 V | - | - | - | - | - | - | - | - | - | 18.4 mm | - | - |