- Series
- Connector Type
- Flash Size
- Module/Board Type
- Core Processor
- Size / Dimension
- Operating Temperature
- Speed
- Part Status
- Published
- RAM Size
- RoHS Status
Attribute column
Manufacturer
Trenz Electronic Embedded - Microcontroller, Microprocessor, FPGA Modules
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Operating Temperature | Series | Size / Dimension | Part Status | Moisture Sensitivity Level (MSL) | Connector Type | Speed | RAM Size | Core Processor | Module/Board Type | Flash Size | Co-Processor | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 TE0745-02-45-1CA Trenz Electronic GmbH | In Stock | - | Datasheet | 14 Weeks | 0°C~70°C | TE0745 | 2.05 x 2.99 52mmx76mm | Obsolete | 1 (Unlimited) | Samtec UFPS | - | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 32MB | Zynq-7000 (Z-7045) | ROHS3 Compliant | ||
TE0808-04-9GI21-AS Trenz Electronic GmbH | In Stock | - | Datasheet | 14 Weeks | -40°C~85°C | TE0808 | 2.05 x 2.99 52mmx76mm | Active | Not Applicable | B2B | - | 4GB | Zynq UltraScale+ ZU9 | FPGA Core | 128MB | - | ROHS3 Compliant | ||
TE0808-04-6BE21-AK Trenz Electronic GmbH | 635 | - | Datasheet | 12 Weeks | 0°C~85°C | TE0808 | 2.05 x 2.99 52mmx76mm | Active | 1 (Unlimited) | B2B | - | 4GB | Zynq UltraScale+ XCZU6EG-1FFVC900E | MPU Core | 128MB | - | ROHS3 Compliant | ||
TE0841-02-41I21-L Trenz Electronic GmbH | In Stock | - | Datasheet | - | - | - | - | Active | Not Applicable | - | - | - | - | - | - | - | ROHS3 Compliant | ||
TE0803-02-04CG-1EA Trenz Electronic GmbH | In Stock | - | - | - | 0°C~85°C | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU4CG-1SFVC784E | MPU Core | 128MB | - | - | ||
TE0725LP-01-72C-1U Trenz Electronic GmbH | In Stock | - | - | 12 Weeks | 0°C~70°C | TE0725 | 2.87 x 1.38 73mmx35mm | Active | 1 (Unlimited) | 50 Pin | 25MHz | - | Artix-7 A100T | FPGA Core | 64MB | - | - | ||
TE0841-02-31I21-A Trenz Electronic GmbH | 629 | - | Datasheet | - | - | - | - | Active | Not Applicable | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 TE0745-02-71I11-A Trenz Electronic GmbH | In Stock | - | - | 12 Weeks | -40°C~85°C | TE0745 | 2.05 x 2.99 52mmx76mm | Active | 1 (Unlimited) | Samtec ST5 | - | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 64MB | Zynq-7000 (Z-7030) | ROHS3 Compliant | ||
TE0841-02-41I21-A Trenz Electronic GmbH | 744 | - | Datasheet | 12 Weeks | -40°C~85°C | TE0841 | 1.97 x 1.57 50mmx40mm | Active | 1 (Unlimited) | B2B | - | 2GB | Kintex UltraScale KU40 | MCU, FPGA | 64MB | - | - | ||
TE0745-02-71I11-AK Trenz Electronic GmbH | In Stock | - | Datasheet | 12 Weeks | -40°C~85°C | TE0745 | 2.05 x 2.99 52mmx76mm | Active | 1 (Unlimited) | Samtec ST5 | - | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 64MB | Zynq-7000 (Z-7030) | ROHS3 Compliant | ||
TE0803-02-03-1EA-S Trenz Electronic GmbH | In Stock | - | - | - | 0°C~85°C | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | FPGA Core | 128MB | - | - | ||
TEC0850-03-15EG1EA Trenz Electronic GmbH | In Stock | - | - | - | - | TEC0850 | - | Obsolete | Not Applicable | CompactPCI Serial Backplane | - | 8GB | Zynq UltraScale+ XCZU15EG-1FFVB1156E | MCU, FPGA | 128MB | - | ROHS3 Compliant | ||
TE0803-02-03EG-1EA Trenz Electronic GmbH | In Stock | - | - | - | 0°C~85°C | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | MPU Core | 128MB | - | - | ||
TEC0850-03-015EG1E Trenz Electronic GmbH | In Stock | - | - | - | - | TEC0850 | - | Obsolete | Not Applicable | CompactPCI Serial Backplane | - | 8GB | Zynq UltraScale+ XCZU15EG-1FFVB1156E | MCU, FPGA | 128MB | - | ROHS3 Compliant | ||
TE0841-02-41C21-A Trenz Electronic GmbH | 758 | - | Datasheet | 12 Weeks | 0°C~70°C | TE0841 | 1.97 x 1.57 50mmx40mm | Active | 1 (Unlimited) | B2B | - | 2GB | Kintex UltraScale KU40 | MCU, FPGA | 64MB | - | ROHS3 Compliant | ||
TE0630-02I Trenz Electronic GmbH | In Stock | - | - | 12 Weeks | -40°C~85°C | TE0630 | 1.6 x 1.9 40.5mmx47.5mm | Active | Not Applicable | B2B | 100MHz | 128MB | Spartan-6 LX-45 | FPGA, USB Core | 8MB | Cypress EZ-USB FX2LP | - | ||
TE0630-02IV Trenz Electronic GmbH | In Stock | - | - | 12 Weeks | -40°C~85°C | TE0630 | 1.6 x 1.9 40.5mmx47.5mm | Active | Not Applicable | B2B | 100MHz | 128MB | Spartan-6 LX-150 | FPGA, USB Core | 8MB | Cypress EZ-USB FX2LP | - | ||
TE0803-03-3BE11-AS Trenz Electronic GmbH | In Stock | - | Datasheet | - | - | - | - | Active | Not Applicable | - | - | - | - | - | - | - | ROHS3 Compliant | ||
TE0803-02-05EV-1IA Trenz Electronic GmbH | In Stock | - | - | - | - | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | - | - | MPU Core | - | - | - | ||
TE0803-02-04EG-1ID Trenz Electronic GmbH | In Stock | - | - | - | - | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | - | - | MPU Core | - | - | - |