- Memory Format
- Memory Interface
- Memory Size
- Memory Types
- Mounting Type
- Operating Temperature
- Package / Case
- Packaging
- Voltage - Supply
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
Attribute column
Manufacturer
Winbond Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Active Read Current - Max | Base Product Number | Brand | Factory Pack QuantityFactory Pack Quantity | Interface Type | Manufacturer | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Product Status | RoHS | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Tradename | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Memory Size | Number of Ports | Nominal Supply Current | Speed | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Max Frequency | Parallel/Serial | I/O Type | Sync/Async | Word Size | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Page Size | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Product Category | Temperature | Memory Organization | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 W25X10CLSNIG Winbond Electronics | 941 | - | Datasheet | 10 Weeks | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | - | 8 | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2006 | SpiFlash® | - | - | Active | 3 (168 Hours) | 8 | EAR99 | - | - | - | - | - | 2.3V~3.6V | DUAL | - | 1 | 3V | 1.27mm | - | 8 | - | - | - | 3.6V | 2.5/3.3V | 2.7V | SPI, Serial | 1Mb 128K x 8 | - | 14mA | - | - | 104MHz | - | 8 ns | FLASH | SPI | - | 1MX1 | - | 1 | 800μs | 24b | - | 8 Mb | 0.000005A | - | - | - | - | Synchronous | - | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | - | - | - | - | - | - | 1.75mm | 4.9mm | - | No | ROHS3 Compliant | - | ||
 W9825G6KH-6I Winbond Electronics | 5175 |
| Datasheet | 10 Weeks | - | Surface Mount | 54-TSOP (0.400, 10.16mm Width) | YES | - | - | - | - | - | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2016 | - | - | - | Active | 3 (168 Hours) | 54 | - | - | - | AUTO/SELF REFRESH | - | - | 3V~3.6V | DUAL | NOT SPECIFIED | 1 | 3.3V | 0.8mm | NOT SPECIFIED | - | R-PDSO-G54 | - | - | 3.6V | - | 3V | - | 256Mb 16M x 16 | 1 | - | - | SYNCHRONOUS | 166MHz | - | 5ns | DRAM | Parallel | - | 16MX16 | - | 16 | - | - | - | - | - | 268435456 bit | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | 22.22mm | 10.16mm | - | ROHS3 Compliant | - | ||
 W25X20CLSVIG Winbond Electronics | 100 |
| Datasheet | 10 Weeks | - | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | - | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2016 | SpiFlash® | - | - | Active | 3 (168 Hours) | 8 | EAR99 | - | - | IT ALSO OPERATES AT 2.3 V AT 80 MHZ | 8542.32.00.51 | - | 2.3V~3.6V | DUAL | - | 1 | 3V | 1.27mm | - | 8 | R-PDSO-G8 | Not Qualified | - | 3.6V | 2.5/3.3V | 2.7V | SPI, Serial | 2Mb 256K x 8 | - | - | - | SYNCHRONOUS | 104MHz | - | - | FLASH | SPI | - | 2MX1 | - | 1 | 800μs | - | - | - | 0.000005A | 2097152 bit | - | - | - | - | - | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | 1mm | 4.9mm | 3.9mm | - | ROHS3 Compliant | - | ||
 W25Q16CVSSIG Winbond Electronics | 190 | - | Datasheet | - | Surface Mount | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | - | 8 | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2008 | SpiFlash® | e3 | - | Obsolete | 3 (168 Hours) | 8 | EAR99 | - | Matte Tin (Sn) | - | - | - | 2.7V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | - | 8 | - | - | 3.3V | 3.6V | - | 3V | SPI, Serial | 16Mb 2M x 8 | - | 18mA | - | - | 104MHz | - | 7 ns | FLASH | SPI - Quad I/O | - | - | - | 8 | 50μs, 3ms | 21b | - | 16 Mb | 0.000005A | - | - | - | - | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | - | - | - | - | - | - | 2.16mm | - | - | No | ROHS3 Compliant | - | ||
 W25Q128FWPIG Winbond Electronics | 5018 | - | Datasheet | 10 Weeks | Surface Mount | Surface Mount | 8-WDFN Exposed Pad | - | 8 | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2016 | SpiFlash® | - | - | Active | 3 (168 Hours) | 8 | - | - | - | - | - | - | 1.65V~1.95V | DUAL | - | 1 | 1.8V | 1.27mm | - | 8 | - | Not Qualified | 1.8V | 1.95V | - | 1.7V | SPI, Serial | 128Mb 16M x 8 | - | - | - | SYNCHRONOUS | 104MHz | - | 6 ns | FLASH | SPI - Quad I/O, QPI | - | - | - | 1 | 60μs, 5ms | - | - | 128 Mb | 0.00002A | - | - | - | - | - | - | - | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | - | - | - | - | - | - | - | 6mm | 5mm | - | ROHS3 Compliant | - | ||
 W29N01HVSINA Winbond Electronics | 7 | - | Datasheet | 10 Weeks | Surface Mount | Surface Mount | 48-TFSOP (0.488, 12.40mm Width) | - | 48 | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2016 | - | - | yes | Active | 3 (168 Hours) | 48 | - | - | - | - | - | - | 2.7V~3.6V | DUAL | - | 1 | 3V | 0.5mm | - | - | - | - | 3.3V | 3.6V | - | 2.7V | - | 1Gb 128M x 8 | - | - | - | ASYNCHRONOUS | - | - | - | FLASH | Parallel | - | 128MX8 | - | 8 | 25ns | 28b | - | 1 Gb | - | - | - | - | - | - | - | - | - | - | - | - | 2.1kB | - | - | - | - | - | - | 1.2mm | 18.4mm | - | - | ROHS3 Compliant | - | ||
 W25Q256JVFIQ Winbond Electronics | 10 | - | Datasheet | 10 Weeks | - | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | YES | - | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2002 | SpiFlash® | - | yes | Active | 3 (168 Hours) | 16 | - | - | - | - | - | - | 2.7V~3.6V | DUAL | NOT SPECIFIED | 1 | 3V | 1.27mm | NOT SPECIFIED | - | R-PDSO-G16 | - | - | 3.6V | - | 2.7V | SPI, Serial | 256Mb 32M x 8 | - | - | - | SYNCHRONOUS | 133MHz | - | - | FLASH | SPI - Quad I/O | - | 32MX8 | - | 8 | 3ms | - | - | - | - | 268435456 bit | - | - | - | - | - | 3V | - | - | - | - | - | - | - | - | - | - | - | 2.64mm | 10.31mm | 7.49mm | - | ROHS3 Compliant | - | ||
 W631GG6KB-15 Winbond Electronics | 15000 |
| Datasheet | 14 Weeks | Surface Mount | Surface Mount | 96-TFBGA | - | 96 | - | - | - | - | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TC | Tray | 2016 | - | - | - | Obsolete | 3 (168 Hours) | 96 | EAR99 | - | - | AUTO/SELF REFRESH | 8542.32.00.32 | - | 1.425V~1.575V | BOTTOM | - | 1 | 1.5V | 0.8mm | - | 96 | - | - | 1.5V | 1.575V | - | 1.425V | - | 1Gb 64M x 16 | 1 | 240mA | - | - | 667MHz | - | 20ns | DRAM | Parallel | 16b | 64MX16 | 3-STATE | 16 | - | 16b | - | 1 Gb | 0.014A | - | - | - | COMMON | - | - | - | - | - | - | - | - | 8192 | 8 | 8 | - | - | - | 1.2mm | 13mm | - | No | ROHS3 Compliant | - | ||
 W631GG6MB-12 Winbond Electronics | 907 | - | Datasheet | 10 Weeks | - | Surface Mount | 96-VFBGA | YES | - | - | - | - | - | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | 0°C~95°C TC | Tray | 2017 | - | - | - | Active | 3 (168 Hours) | 96 | - | - | - | AUTO/SELF REFRESH | - | - | 1.425V~1.575V | BOTTOM | NOT SPECIFIED | 1 | 1.5V | 0.8mm | NOT SPECIFIED | - | R-PBGA-B96 | - | - | 1.575V | - | 1.425V | - | 1Gb 64M x 16 | 1 | - | - | SYNCHRONOUS | 800MHz | - | 20ns | DRAM | Parallel | - | 64MX16 | - | 16 | - | - | - | - | - | 1073741824 bit | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1mm | 13mm | 7.5mm | - | ROHS3 Compliant | - | ||
 W9725G6KB25I Winbond Electronics | 15 |
| Datasheet | 10 Weeks | Surface Mount | Surface Mount | 84-TFBGA | - | 84 | - | - | - | - | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~95°C TC | Tube | 2014 | - | - | - | Active | 3 (168 Hours) | 84 | EAR99 | - | - | AUTO/SELF REFRESH | 8542.32.00.24 | - | 1.7V~1.9V | BOTTOM | - | 1 | 1.8V | 0.8mm | - | 84 | - | - | 1.8V | 1.9V | - | 1.7V | - | 256Mb 16M x 16 | 1 | 110mA | - | - | - | - | 400ps | DRAM | Parallel | 16b | 16MX16 | 3-STATE | 16 | 15ns | 13b | - | 2 Gb | 0.006A | - | 400MHz | - | COMMON | - | - | - | - | - | - | - | - | 8192 | 48 | 48 | - | - | - | 1.2mm | 12.5mm | - | No | ROHS3 Compliant | - | ||
 W25Q40EWSNIG Winbond Electronics | In Stock | - | Datasheet | 10 Weeks | - | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | - | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2014 | SpiFlash® | - | - | Active | 3 (168 Hours) | 8 | - | - | - | - | - | - | 1.65V~1.95V | DUAL | - | 1 | 1.8V | 1.27mm | - | - | R-PDSO-G8 | Not Qualified | - | 1.95V | 1.8V | 1.65V | SPI, Serial | 4Mb 512K x 8 | - | - | - | SYNCHRONOUS | 104MHz | - | - | FLASH | SPI | - | 4MX1 | - | 1 | 800μs | - | - | - | 0.0000075A | 4194304 bit | - | - | - | - | - | 1.8V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | 1.75mm | 4.85mm | 3.9mm | - | ROHS3 Compliant | - | ||
 W25Q16JVZPIQ Winbond Electronics | 3984 | - | Datasheet | 10 Weeks | - | Surface Mount | 8-WDFN Exposed Pad | YES | - | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2016 | SpiFlash® | e3 | - | Active | 3 (168 Hours) | 8 | EAR99 | - | Tin (Sn) | - | 8542.32.00.51 | - | 2.7V~3.6V | DUAL | NOT SPECIFIED | 1 | 3V | 1.27mm | NOT SPECIFIED | - | R-PDSO-N8 | - | - | 3.6V | - | 2.7V | - | 16Mb 2M x 8 | - | - | - | SYNCHRONOUS | 133MHz | - | - | FLASH | SPI - Quad I/O | - | 2MX8 | - | 8 | 3ms | - | - | - | - | 16777216 bit | - | SERIAL | - | - | - | 3V | - | - | - | - | - | - | - | - | - | - | - | 0.8mm | 6mm | 5mm | - | ROHS3 Compliant | - | ||
W25X20CLZPIG Winbond Electronics | 950000 |
| Datasheet | 10 Weeks | - | Surface Mount | 8-WDFN Exposed Pad | YES | 8 | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2009 | SpiFlash® | - | - | Active | 3 (168 Hours) | 8 | EAR99 | - | - | - | - | - | 2.3V~3.6V | DUAL | - | 1 | 3V | 1.27mm | - | 8 | - | Not Qualified | - | 3.6V | 2.5/3.3V | 2.7V | SPI, Serial | 2Mb 256K x 8 | - | - | - | SYNCHRONOUS | 104MHz | - | - | FLASH | SPI | - | 2MX1 | - | 1 | 800μs | - | - | - | 0.000005A | 2097152 bit | - | - | - | - | - | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | 6mm | 5mm | - | ROHS3 Compliant | - | ||
W25Q256FVFIG Winbond Electronics | In Stock |
| Datasheet | - | Surface Mount | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | - | 16 | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2016 | SpiFlash® | - | - | Discontinued | 3 (168 Hours) | 16 | - | - | - | - | - | - | 2.7V~3.6V | DUAL | - | 1 | 3V | 1.27mm | - | - | - | - | 3.3V | 3.6V | - | 2.7V | SPI, Serial | 256Mb 32M x 8 | - | 20mA | - | - | 104MHz | - | 8.5 ns | FLASH | SPI - Quad I/O, QPI | - | 256MX1 | - | 1 | 50μs, 3ms | 1b | - | 256 Mb | 0.000025A | - | - | - | - | Synchronous | 8b | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | 2.64mm | 10.31mm | - | No | ROHS3 Compliant | Lead Free | ||
 W9864G6KH-6I Winbond Electronics | 9 |
| Datasheet | 10 Weeks | - | Surface Mount | 54-TSOP (0.400, 10.16mm Width) | YES | - | - | - | - | - | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2016 | - | - | - | Active | 3 (168 Hours) | 54 | - | - | - | AUTO/SELF REFRESH | - | - | 3V~3.6V | DUAL | NOT SPECIFIED | 1 | 3.3V | 0.8mm | NOT SPECIFIED | - | R-PDSO-G54 | - | - | 3.6V | - | 3V | - | 64Mb 4M x 16 | 1 | - | - | SYNCHRONOUS | 166MHz | - | 5ns | DRAM | Parallel | - | 4MX16 | - | 16 | - | - | - | - | - | 67108864 bit | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | 22.22mm | 10.16mm | - | ROHS3 Compliant | - | ||
W25X40CLSVIG Winbond Electronics | 462 |
| Datasheet | 10 Weeks | - | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | - | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2009 | SpiFlash® | - | - | Active | 3 (168 Hours) | 8 | EAR99 | - | - | IT ALSO OPERATES AT 2.3 V AT 80 MHZ | 8542.32.00.51 | - | 2.3V~3.6V | DUAL | - | 1 | 3V | 1.27mm | - | 8 | R-PDSO-G8 | Not Qualified | - | 3.6V | 2.5/3.3V | 2.7V | SPI, Serial | 4Mb 512K x 8 | - | - | - | SYNCHRONOUS | 104MHz | - | - | FLASH | SPI | - | 4MX1 | - | 1 | 800μs | - | - | - | 0.000005A | 4194304 bit | - | - | - | - | - | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | 1mm | 4.9mm | 3.9mm | - | ROHS3 Compliant | - | ||
 W25N01GVZEIR TR Winbond Electronics | 4441 |
| - | - | - | Surface Mount | 8-WDFN Exposed Pad | - | - | 8-WSON (8x6) | 35 mA | W25N01 | Winbond | 4000 | SPI | Winbond | 104 MHz | + 85 C | Non-Volatile | Winbond Electronics | - 40 C | Yes | SMD/SMT | Active | Details | 3.6 V | 2.7 V | 2.7V - 3.6V | SpiFlash | -40°C ~ 85°C (TA) | Reel | - | W25N01GV | - | - | - | - | - | - | QspiNAND Flash | - | - | - | Memory & Data Storage | 2.7V ~ 3.6V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1Gbit | - | - | 104MHz | - | 104 MHz | 35 mA | 7 ns | FLASH | SPI - Quad I/O | 8 bit | High Quality Single Level Cell (SLC) Technology Standard Serial Interface with x1/x2/x4 Bus Width | - | - | 700μs | - | NAND Flash | - | - | 1Gb | - | - | - | - | - | - | - | - | - | - | - | - | - | - | NAND Flash | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 128M x 8 | - | - | - | - | - | - | ||
 W25Q16DVSNIG Winbond Electronics | In Stock | - | Datasheet | - | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | - | 8 | - | - | - | - | - | - | - | - | - | Non-Volatile | - | - | - | - | - | - | - | - | - | - | -40°C~85°C TA | Tube | 2008 | SpiFlash® | - | - | Discontinued | 3 (168 Hours) | 8 | - | - | - | - | - | - | 2.7V~3.6V | DUAL | - | 1 | 3V | 1.27mm | - | - | - | - | - | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 16Mb 2M x 8 | - | 18mA | - | - | 104MHz | - | 7 ns | FLASH | SPI - Quad I/O | - | - | - | 8 | 50μs, 3ms | 24b | - | 16 Mb | 0.000005A | - | - | - | - | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | 1.75mm | 5mm | - | No | ROHS3 Compliant | - | ||
 W972GG6KB-25 Winbond Electronics | 56000 |
| Datasheet | 10 Weeks | Surface Mount | Surface Mount | 84-TFBGA | - | 84 | - | - | - | - | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TC | Tray | 2016 | - | e1 | - | Active | 3 (168 Hours) | 84 | EAR99 | - | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | - | - | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1 | 1.8V | 0.8mm | NOT SPECIFIED | - | - | - | 1.8V | 1.9V | - | 1.7V | - | 2Gb 128M x 16 | 1 | - | - | SYNCHRONOUS | 400MHz | - | 400ps | DRAM | Parallel | 16b | 128MX16 | - | 16 | 15ns | 14b | - | 2 Gb | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | 12.5mm | - | - | ROHS3 Compliant | - | ||
W631GG6KB-12 Winbond Electronics | 992 | - | Datasheet | 14 Weeks | Surface Mount | Surface Mount | 96-TFBGA | - | 96 | - | - | - | - | - | - | - | - | - | Volatile | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TC | Tray | 2016 | - | - | - | Obsolete | 3 (168 Hours) | 96 | EAR99 | - | - | AUTO/SELF REFRESH | 8542.32.00.32 | - | 1.425V~1.575V | BOTTOM | NOT SPECIFIED | 1 | 1.5V | 0.8mm | NOT SPECIFIED | 96 | - | Not Qualified | 1.5V | 1.575V | - | 1.425V | - | 1Gb 64M x 16 | 1 | 280mA | - | SYNCHRONOUS | 800MHz | - | 20ns | DRAM | Parallel | 16b | 64MX16 | 3-STATE | 16 | - | 13b | - | 1 Gb | 0.014A | - | - | - | COMMON | - | - | - | - | - | - | - | - | 8192 | 8 | 8 | - | - | - | 1.2mm | 13mm | - | - | ROHS3 Compliant | - |