- Memory Format
- Memory Interface
- Memory Size
- Memory Types
- Mounting Type
- Operating Temperature
- Package / Case
- Packaging
- Voltage - Supply
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
Attribute column
Manufacturer
Winbond Memory
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Memory Types | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Clock Frequency | Access Time | Memory Format | Memory Interface | Organization | Output Characteristics | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Access Time (Max) | Parallel/Serial | I/O Type | Sync/Async | Word Size | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Ambient Temperature Range High | Refresh Cycles | Common Flash Interface | Sequential Burst Length | Interleaved Burst Length | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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![]() W29GL256SH9C Winbond Electronics | 156 |
| Datasheet | 14 Weeks | - | - | Surface Mount | 56-TFBGA | YES | - | Non-Volatile | -40°C~85°C TA | Tube | 2016 | - | - | - | Obsolete | 3 (168 Hours) | 56 | - | - | - | - | 2.7V~3.6V | BOTTOM | - | 1 | 3V | 0.8mm | - | - | - | R-PBGA-B56 | Not Qualified | - | 3.6V | 3/3.3V | 2.7V | - | 256Mb 16M x 16 | - | - | ASYNCHRONOUS | - | - | FLASH | Parallel | 16MX16 | - | 16 | 90ns | - | - | 0.0001A | 268435456 bit | 90 ns | - | - | - | - | 3V | - | - | - | - | - | YES | YES | YES | 256 | 64K | 16words | YES | - | - | - | YES | - | - | - | 1.2mm | 9mm | 7mm | - | ROHS3 Compliant | - | ||
![]() W25Q64CVSFIG Winbond Electronics | 10 | - | Datasheet | - | - | Surface Mount | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | - | 16 | Non-Volatile | -40°C~85°C TA | Tube | 2011 | SpiFlash® | - | - | Obsolete | 3 (168 Hours) | 16 | 3A991.B.1.A | - | - | 8542.32.00.51 | 2.7V~3.6V | DUAL | - | 1 | 3V | 1.27mm | - | - | 16 | - | - | 3.3V | 3.6V | - | 2.7V | SPI, Serial | 64Mb 8M x 8 | - | 18mA | - | 80MHz | 7 ns | FLASH | SPI - Quad I/O | 8MX8 | - | 8 | 50μs, 3ms | 24b | 64 Mb | 0.000005A | - | - | - | - | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | 256B | - | - | - | - | - | - | - | - | 2.64mm | 10.31mm | - | No | ROHS3 Compliant | - | ||
![]() W25Q128FVEIG Winbond Electronics | 38 | - | Datasheet | - | - | Surface Mount | Surface Mount | 8-WDFN Exposed Pad | - | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | - | - | Discontinued | 3 (168 Hours) | 8 | 3A991.B.1.A | - | - | - | 2.7V~3.6V | DUAL | - | 1 | 3V | 1.27mm | - | - | 8 | - | - | - | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 128Mb 16M x 8 | - | 20mA | - | 104MHz | 7 ns | FLASH | SPI - Quad I/O, QPI | - | - | 1 | 50μs, 3ms | 24b | 128 Mb | 0.00002A | - | - | - | - | Synchronous | 8b | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No | ROHS3 Compliant | - | ||
![]() W25Q80EWSSIG Winbond Electronics | In Stock | - | Datasheet | 10 Weeks | - | - | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | YES | - | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | - | - | Active | 3 (168 Hours) | 8 | - | - | - | - | 1.65V~1.95V | DUAL | - | 1 | 1.8V | 1.27mm | - | - | - | S-PDSO-G8 | - | - | 1.95V | - | 1.65V | SPI, Serial | 8Mb 1M x 8 | - | - | SYNCHRONOUS | 104MHz | - | FLASH | SPI | 8MX1 | - | 1 | 3ms | - | - | - | 8388608 bit | - | - | - | - | - | 1.8V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.16mm | 5.28mm | 5.28mm | - | ROHS3 Compliant | - | ||
![]() W25Q64FVSSIQ Winbond Electronics | In Stock | - | Datasheet | - | - | - | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | YES | - | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | - | - | Obsolete | 3 (168 Hours) | 8 | - | - | - | - | 2.7V~3.6V | DUAL | - | 1 | - | 1.27mm | - | - | - | S-PDSO-G8 | Not Qualified | - | 3.6V | - | 3V | - | 64Mb 8M x 8 | - | - | SYNCHRONOUS | 104MHz | - | FLASH | SPI - Quad I/O, QPI | 8MX8 | 3-STATE | 8 | 50μs, 3ms | - | - | 0.00005A | 67108864 bit | - | SERIAL | - | - | - | - | SPI | - | 20 | HARDWARE/SOFTWARE | 1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.16mm | 5.28mm | 5.28mm | - | ROHS3 Compliant | - | ||
![]() W9712G6KB-25 Winbond Electronics | 473 |
| Datasheet | 10 Weeks | - | Surface Mount | Surface Mount | 84-TFBGA | - | 84 | Volatile | 0°C~85°C TC | Tray | 2016 | - | - | - | Active | 3 (168 Hours) | 84 | - | - | AUTO/SELF REFRESH | - | 1.7V~1.9V | BOTTOM | NOT SPECIFIED | 1 | 1.8V | 0.8mm | - | NOT SPECIFIED | - | - | Not Qualified | 1.8V | 1.9V | - | 1.7V | - | 128Mb 8M x 16 | 1 | 135mA | SYNCHRONOUS | 200MHz | 400ps | DRAM | Parallel | 8MX16 | 3-STATE | 16 | 15ns | 15b | 128 Mb | 0.008A | - | - | - | COMMON | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 4096 | - | 48 | 48 | - | 1.2mm | 12.5mm | - | - | ROHS3 Compliant | - | ||
![]() W25Q16BVSSIG Winbond Electronics | 3650 | - | Datasheet | - | - | Surface Mount | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | - | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2010 | SpiFlash® | - | - | Obsolete | 3 (168 Hours) | 8 | EAR99 | - | - | - | 2.7V~3.6V | DUAL | - | 1 | 3V | 1.27mm | - | - | 8 | - | - | 3.3V | 3.6V | - | 2.7V | SPI, Serial | 16Mb 2M x 8 | - | 18mA | - | 104MHz | 6 ns | FLASH | SPI - Quad I/O | - | - | 8 | 50μs, 3ms | 1b | 16 Mb | 0.000005A | - | - | - | - | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | 256B | - | - | - | - | - | - | - | - | 2.16mm | - | - | No | ROHS3 Compliant | Lead Free | ||
![]() W25Q80BVSSIG Winbond Electronics | 18522 | - | Datasheet | - | Tin | Surface Mount | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | - | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2010 | SpiFlash® | - | - | Obsolete | 3 (168 Hours) | 8 | EAR99 | - | - | - | 2.7V~3.6V | DUAL | - | 1 | 3V | 1.27mm | - | - | 8 | - | - | 3.3V | 3.6V | - | 2.7V | - | 8Mb 1M x 8 | - | 18mA | - | 104MHz | 8.5 ns | FLASH | SPI | - | - | 1 | 3ms | 1b | 8 Mb | 0.000005A | - | - | SERIAL | - | Asynchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | 256B | - | - | 85°C | - | - | - | - | 2.16mm | - | - | - | No | ROHS3 Compliant | - | ||
![]() W9425G6KH-5I Winbond Electronics | 550 |
| Datasheet | 10 Weeks | - | - | Surface Mount | 66-TSSOP (0.400, 10.16mm Width) | YES | - | Volatile | -40°C~85°C TA | Tray | 2016 | - | - | - | Active | 3 (168 Hours) | 66 | EAR99 | - | AUTO/SELF REFRESH | - | 2.3V~2.7V | DUAL | NOT SPECIFIED | 1 | 2.5V | 0.65mm | - | NOT SPECIFIED | - | R-PDSO-G66 | - | - | 2.7V | - | 2.3V | - | 256Mb 16M x 16 | 1 | - | SYNCHRONOUS | 200MHz | 55ns | DRAM | Parallel | 16MX16 | - | 16 | 15ns | - | - | - | 268435456 bit | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2mm | 22.22mm | 10.16mm | - | ROHS3 Compliant | - | ||
![]() W631GU6KB-15 Winbond Electronics | 2000 | - | Datasheet | - | - | - | Surface Mount | 96-TFBGA | YES | - | Volatile | 0°C~95°C TC | Tray | 2016 | - | - | - | Obsolete | 3 (168 Hours) | 96 | EAR99 | - | AUTO/SELF REFRESH | 8542.32.00.32 | 1.283V~1.45V | BOTTOM | NOT SPECIFIED | 1 | 1.35V | 0.8mm | - | NOT SPECIFIED | 96 | R-PBGA-B96 | Not Qualified | - | 1.45V | 1.35V | 1.283V | - | 1Gb 64M x 16 | 1 | - | SYNCHRONOUS | 667MHz | 20ns | DRAM | Parallel | 64MX16 | 3-STATE | 16 | - | - | - | 0.014A | 1073741824 bit | - | - | COMMON | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 8192 | - | 8 | 8 | - | 1.2mm | 13mm | 9mm | - | ROHS3 Compliant | - | ||
![]() W9812G6JB-6I Winbond Electronics | 3 |
| Datasheet | 10 Weeks | - | Surface Mount | Surface Mount | 54-TFBGA | - | 54 | Volatile | -40°C~85°C TA | Tray | 2010 | - | - | - | Active | 3 (168 Hours) | 54 | EAR99 | - | AUTO/SELF REFRESH | - | 3V~3.6V | BOTTOM | NOT SPECIFIED | 1 | 3.3V | 0.8mm | unknown | NOT SPECIFIED | 54 | - | Not Qualified | 3.3V | 3.6V | - | 3V | - | 128Mb 8M x 16 | 1 | 75mA | SYNCHRONOUS | 166MHz | 5ns | DRAM | Parallel | 8MX16 | 3-STATE | 16 | - | 14b | 128 Mb | 0.002A | - | - | - | COMMON | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 4096 | - | 1248FP | 1248 | - | 1.2mm | 8mm | - | - | ROHS3 Compliant | - | ||
![]() W631GU6MB-12 Winbond Electronics | 16005 |
| Datasheet | 10 Weeks | - | - | Surface Mount | 96-VFBGA | YES | - | Volatile | 0°C~95°C TC | Tray | 2017 | - | - | - | Active | 3 (168 Hours) | 96 | - | - | AUTO/SELF REFRESH | - | 1.283V~1.45V | BOTTOM | NOT SPECIFIED | 1 | 1.35V | 0.8mm | - | NOT SPECIFIED | - | R-PBGA-B96 | - | - | 1.45V | - | 1.283V | - | 1Gb 64M x 16 | 1 | - | SYNCHRONOUS | 800MHz | 20ns | DRAM | Parallel | 64MX16 | - | 16 | - | - | - | - | 1073741824 bit | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1mm | 13mm | 7.5mm | - | ROHS3 Compliant | - | ||
![]() W25Q80EWSNIG Winbond Electronics | 1825 | - | Datasheet | 10 Weeks | - | - | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | YES | - | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | - | - | Active | 3 (168 Hours) | 8 | - | - | - | - | 1.65V~1.95V | DUAL | - | 1 | 1.8V | 1.27mm | - | - | - | R-PDSO-G8 | Not Qualified | - | 1.95V | 1.8V | 1.65V | SPI, Serial | 8Mb 1M x 8 | - | - | SYNCHRONOUS | 104MHz | - | FLASH | SPI | 8MX1 | - | 1 | 800μs | - | - | 0.0000075A | 8388608 bit | - | - | - | - | - | 1.8V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.75mm | 4.85mm | 3.9mm | - | ROHS3 Compliant | - | ||
![]() W25Q64JVZEIQ Winbond Electronics | 4000 | - | Datasheet | 10 Weeks | - | - | Surface Mount | 8-WDFN Exposed Pad | YES | - | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | - | - | Active | 3 (168 Hours) | 8 | 3A991.B.1.A | - | - | 8542.32.00.51 | 2.7V~3.6V | DUAL | NOT SPECIFIED | 1 | 3V | 1.27mm | - | NOT SPECIFIED | - | R-PDSO-N8 | - | - | 3.6V | - | 2.7V | SPI, Serial | 64Mb 8M x 8 | - | - | SYNCHRONOUS | 133MHz | - | FLASH | SPI - Quad I/O | 64MX1 | - | 1 | 3ms | - | - | - | 67108864 bit | - | - | - | - | - | 2.7V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0.8mm | 8mm | 6mm | - | ROHS3 Compliant | - | ||
![]() W25Q64FVSFIG Winbond Electronics | 2722 | - | Datasheet | - | - | Surface Mount | Surface Mount | 16-SOIC (0.295, 7.50mm Width) | - | 16 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | SpiFlash® | - | yes | Obsolete | 3 (168 Hours) | 16 | 3A991.B.1.A | - | - | 8542.32.00.51 | 2.7V~3.6V | DUAL | - | 1 | - | 1.27mm | - | - | 16 | - | - | - | 3.6V | - | 3V | SPI, Serial | 64Mb 8M x 8 | - | 40mA | - | 104MHz | 8.5 ns | FLASH | SPI - Quad I/O, QPI | 8MX8 | 3-STATE | 8 | 50μs, 3ms | 1b | 64 Mb | 0.00005A | - | - | - | - | Synchronous | 8b | - | SPI | - | 20 | HARDWARE/SOFTWARE | 1 | - | - | - | - | - | 256B | - | - | - | - | - | - | - | - | 2.64mm | 10.31mm | - | No | ROHS3 Compliant | - | ||
![]() W29GL128CH9T Winbond Electronics | 335 | - | Datasheet | 14 Weeks | - | Surface Mount | Surface Mount | 56-TFSOP (0.724, 18.40mm Width) | - | 56 | Non-Volatile | -40°C~85°C TA | Tube | 2012 | - | e3 | - | Obsolete | 3 (168 Hours) | 56 | 3A991.B.1.A | Tin (Sn) | IT ALSO OPERATES AT 3 V TO 3.6 V | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | - | - | 56 | - | - | - | 3.6V | 1.8/3.33/3.3V | 2.7V | - | 128Mb 16M x 8 8M x 16 | - | 55mA | - | - | - | FLASH | Parallel | 128MX1 | - | 1 | 90ns | 23b | 128 Mb | 0.000005A | - | 100 ns | - | - | Asynchronous | 1b | 3V | - | - | - | - | 8 | YES | YES | YES | 128 | 128K | 256B | YES | - | - | - | YES | - | - | - | 1.2mm | 18.4mm | - | No | ROHS3 Compliant | Lead Free | ||
![]() W25X40BVSNIG Winbond Electronics | 5000 | - | Datasheet | - | - | Surface Mount | Surface Mount | 8-SOIC (0.154, 3.90mm Width) | - | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | SpiFlash® | - | - | Obsolete | 3 (168 Hours) | 8 | EAR99 | - | - | - | 2.7V~3.6V | DUAL | - | 1 | 3V | 1.27mm | - | - | 8 | - | - | 3.3V | 3.6V | - | 2.7V | SPI, Serial | 4Mb 512K x 8 | - | 16.5mA | - | 104MHz | 7 ns | FLASH | SPI | 4MX1 | - | 1 | 3ms | 24b | 4 Mb | 0.000005A | - | - | - | - | Synchronous | 1b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | - | - | - | - | - | - | 256B | - | - | - | - | - | - | - | - | 1.72mm | - | - | No | ROHS3 Compliant | - | ||
![]() W949D6DBHX5I Winbond Electronics | 10 |
| Datasheet | 10 Weeks | - | - | Surface Mount | 60-TFBGA | YES | - | Volatile | -40°C~85°C TA | Tray | 2016 | - | - | - | Active | 3 (168 Hours) | 60 | - | - | AUTO/SELF REFRESH | - | 1.7V~1.95V | BOTTOM | - | 1 | 1.8V | 0.8mm | - | - | - | R-PBGA-B60 | - | - | 1.95V | - | 1.7V | - | 512Mb 32M x 16 | 1 | - | SYNCHRONOUS | 200MHz | 5ns | DRAM | Parallel | 32MX16 | - | 16 | 15ns | - | - | - | 536870912 bit | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.025mm | 9mm | 8mm | - | ROHS3 Compliant | - | ||
![]() W29N01HVSINF Winbond Electronics | 15000 | - | Datasheet | 10 Weeks | - | Surface Mount | Surface Mount | 48-TFSOP (0.488, 12.40mm Width) | - | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2016 | - | - | yes | Active | 3 (168 Hours) | 48 | - | - | - | - | 2.7V~3.6V | DUAL | - | 1 | 3V | 0.5mm | - | - | - | - | - | 3.3V | 3.6V | - | 2.7V | - | 1Gb 128M x 8 | - | - | ASYNCHRONOUS | - | - | FLASH | Parallel | 128MX8 | - | 8 | 25ns | 28b | 1 Gb | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.1kB | - | - | - | - | - | - | - | - | 1.2mm | 18.4mm | - | - | ROHS3 Compliant | - | ||
![]() W29GL032CB7S Winbond Electronics | 220002 | - | Datasheet | 14 Weeks | - | - | Surface Mount | 48-TFSOP (0.724, 18.40mm Width) | YES | - | Non-Volatile | -40°C~85°C TA | Tray | 2016 | - | e3 | yes | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | MATTE TIN | BOTTOM BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | DUAL | NOT SPECIFIED | 1 | 3V | 0.5mm | - | NOT SPECIFIED | 48 | R-PDSO-G48 | Not Qualified | - | 3.6V | 3/3.3V | 2.7V | - | 32Mb 4M x 8 2M x 16 | - | - | ASYNCHRONOUS | - | - | FLASH | Parallel | 32MX1 | - | 1 | 70ns | - | - | 0.000005A | 33554432 bit | 70 ns | - | - | - | - | 3V | - | - | - | - | 8 | YES | YES | YES | 863 | 8K64K | 8/16words | YES | BOTTOM | - | - | YES | - | - | - | 1.2mm | 18.4mm | 12mm | - | ROHS3 Compliant | - |