- EU RoHS
- Part Status
- Chip Density (bit)
- Interface Type
- Maximum Operating Supply Voltage (V)
- Minimum Operating Supply Voltage (V)
- Typical Operating Supply Voltage (V)
- Timing Type
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- ECCN (US)
- Command Compatible
- Number of Bits/Word (bit)
Attribute column
Manufacturer
Winbond USB Flash Drives
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Address Bus Width (bit) | Automotive | Base Product Number | Block Organization | Cell Type | Chip Density (bit) | Clock Frequency-Max (fCLK) | Command Compatible | Dimensions | ECC Support | ECCN (US) | EU RoHS | HTS | Ihs Manufacturer | Interface Type | Lead Shape | Location of Boot Block | Manufacturer | Manufacturer Part Number | Max. Access Time (ns) | Maximum Erase Time (S) | Maximum Operating Frequency (MHz) | Maximum Operating Supply Voltage | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature | Maximum Operating Temperature (°C) | Maximum Programming Time (ms) | Memory Types | Mfr | Minimum Endurance (Cycles) | Minimum Operating Supply Voltage | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature | Minimum Operating Temperature (°C) | Mounting | Number of Bits/Word (bit) | Number of Words | Number of Words Code | Operating Current (mA) | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Height | Package Length | Package Shape | Package Style | Package Type | Package Width | Part Life Cycle Code | PCB changed | PPAP | Product Status | Program Current (mA) | Programmability | Programmable | Programming Voltage (V) | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Samacsys Description | Standard Package Name | Supplier Package | Supplier Temperature Grade | Supply Voltage-Nom (Vsup) | Support of Page Mode | Timing Type | Typical Operating Supply Voltage (V) | Operating Temperature | Packaging | Series | Part Status | Type | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Speed | Operating Mode | Clock Frequency | Access Time | Memory Format | Memory Interface | Architecture | Organization | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Memory IC Type | Programming Voltage | Sector Size | Page Size | Boot Block | Temperature | Memory Organization | Height | Length | Width |
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 W74M32FVSSIQ/REEL Winbond Electronics Corporation | In Stock | - | - | - | - | - | - | - | - | No | - | Symmetrical | - | 32M | - | Yes | - | No | 3A991.b.1.a | Compliant | - | - | Serial (SPI, Dual SPI, Quad SPI) | Gull-wing | - | - | - | 7 | - | - | - | 3.6 | - | 85 | - | - | - | 100000 | - | 2.7 | - | -40 | Surface Mount | 8 | 4M | - | 30 | - | - | - | - | - | - | 1.8 | 5.28 | - | - | - | 5.28 | - | 8 | No | - | - | Yes | - | - | - | - | - | - | - | SOP | SOIC | Industrial | - | No | Synchronous | 3|3.3 | - | Tube | - | Active | - | - | - | - | - | - | - | - | - | 8 | - | - | - | - | - | - | - | - | - | - | - | Sectored | - | - | - | - | - | - | - | - | 4Kbyte x 1024 | 256byte | No | - | - | - | - | - | ||
W25Q16JLUXIG Winbond Electronics Corporation | 2843 | - | - | - | - | - | - | - | 24 | No | - | Symmetrical | NOR | 16M | - | Yes | - | No | EAR99 | Compliant | - | - | Serial (SPI, Dual SPI, Quad SPI) | - | - | - | - | 6 | 25/Chip | 104 | - | 3.6 | - | 85 | 3/Page | - | - | 100000 | - | 2.3 | - | -40 | Surface Mount | 8 | 2M | - | 25 | - | - | - | - | - | - | 0.53 | 2 | - | - | - | 3 | - | 8 | No | - | 25 | Yes | - | 2.3 to 3.6 | - | - | - | - | - | - | USON EP | Industrial | - | No | Synchronous | 3.3|2.5 | - | - | - | Active | - | - | - | - | - | - | - | - | - | 8 | - | - | - | - | - | - | - | - | - | - | - | Sectored | - | - | - | - | - | - | - | - | 4Kbyte x 512 | 256byte | No | - | - | - | - | - | ||
W25Q128FWFIQ Winbond Electronics Corporation | 109 | - | - | - | - | YES | - | 16 | 24 | No | - | Symmetrical | NOR | 128M | 104 MHz | Yes | - | No | 3A991b.1.a. | Compliant | 8542.32.00.71 | WINBOND ELECTRONICS CORP | Serial (SPI, Dual SPI, Quad SPI) | Gull-wing | - | Winbond Electronics Corp | W25Q128FWFIQ | 6 | 200/Chip | - | - | 1.95 | - | 85 | 5/Page | - | - | 100000 | - | 1.65 | - | -40 | Surface Mount | 8 | 16M | 16000000 | 20 | 85 °C | -40 °C | - | PLASTIC/EPOXY | SOP | SOP, | 2.31 | 10.31 | RECTANGULAR | SMALL OUTLINE | - | 7.49 | Obsolete | 16 | No | - | 25 | Yes | - | 1.65 to 1.95 | - | - | 5.7 | Yes | - | SOP | SOIC W | Industrial | 1.8 V | No | Synchronous | 1.8 | - | Tube | - | Obsolete | - | CMOS | - | DUAL | GULL WING | - | 1 | 1.27 mm | compliant | 16 | R-PDSO-G16 | 1.95 V | INDUSTRIAL | 1.65 V | - | - | SYNCHRONOUS | - | - | - | - | Sectored | 16MX8 | 2.64 mm | 8 | - | 134217728 bit | SERIAL | FLASH | 1.8 V | 4Kbyte x 4096 | 256byte | No | - | - | - | 10.31 mm | 7.49 mm | ||
W25Q32JVZEIQ TR Winbond Electronics Corporation | In Stock | - | - | - | - | - | - | - | - | No | - | Symmetrical | - | 32M | - | - | - | - | - | Compliant | 8542.32.00.71 | - | Serial (SPI, Dual SPI, Quad SPI) | - | - | - | - | - | - | - | - | 3.6 | - | - | - | - | - | - | - | 2.7 | - | - | Surface Mount | - | - | - | - | - | - | - | - | - | - | 0.73 | 6 | - | - | - | 8 | - | 8 | No | - | - | - | - | - | - | - | - | - | - | - | WSON EP | - | - | - | Synchronous | 3|3.3 | - | Tape and Reel | - | - | - | - | - | - | - | - | - | - | - | 8 | - | - | - | - | - | - | - | - | - | - | - | Sectored | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
W25Q128FWSIQ TR Winbond Electronics Corporation | In Stock | - | - | Surface Mount | 8-SOIC (0.209, 5.30mm Width) | - | 8-SOIC | - | - | No | W25Q128 | Symmetrical | - | 128M | - | - | - | - | - | Compliant | 8542.32.00.02 | WINBOND ELECTRONICS CORP | Serial (SPI, Dual SPI, Quad SPI) | - | - | Winbond Electronics Corp | W25Q128FWSIQTR | - | - | - | - | 1.95 | - | - | - | Non-Volatile | Winbond Electronics | - | - | 1.65 | - | - | Surface Mount | - | - | - | - | - | - | Tape & Reel (TR) | - | - | , | 1.8 | 5.28 | - | - | - | 5.28 | Not Recommended | 8 | No | Obsolete | - | - | - | - | - | - | 5.7 | - | - | - | SOIC | - | - | - | Synchronous | 1.8 | -40°C ~ 85°C (TA) | - | SpiFlash® | Obsolete | - | FLASH - NOR | 1.65V ~ 1.95V | - | - | - | - | - | unknown | 8 | - | - | - | - | 128Mbit | - | - | 104 MHz | - | FLASH | SPI - Quad I/O, QPI | Sectored | - | - | - | 60µs, 5ms | - | - | FLASH | 1.8 V | - | - | - | - | 16M x 8 | - | - | - | ||
W74M25FVZEIQ Winbond Electronics Corporation | In Stock | - | - | - | - | - | - | - | - | No | - | Symmetrical | - | 256M | - | Yes | - | No | 3A991.b.1.a | Compliant | 8542.32.00.71 | - | Serial (SPI, Dual SPI, Quad SPI) | - | - | - | - | 7 | - | - | - | 3.6 | - | 85 | - | - | - | 100000 | - | 2.7 | - | -40 | Surface Mount | 8 | 32M | - | 30 | - | - | - | - | - | - | 0.73 | 6 | - | - | - | 8 | - | 8 | No | - | - | Yes | - | - | - | - | - | - | - | - | WSON EP | Industrial | - | No | Synchronous | 3|3.3 | - | Tube | - | - | - | - | - | - | - | - | - | - | - | 8 | - | - | - | - | - | - | - | - | - | - | - | Sectored | - | - | - | - | - | - | - | - | 4Kbyte x 8192 | 256byte | No | - | - | - | - | - | ||
W29N08GVSIAA Winbond Electronics Corporation | In Stock | - | - | Surface Mount | 48-TFSOP (0.724, 18.40mm Width) | YES | 48-TSOP | 48 | 31 | Yes | - | Symmetrical | SLC NAND | 8G | - | No | 18.5 x 12.1 x 1.05mm | Yes | 3A991b.1.a. | Compliant | 8542.32.00.71 | WINBOND ELECTRONICS CORP | Parallel | Gull-wing | - | Winbond Electronics Corp | W29N08GVSIAA | - | 0.01/Block | - | 3.6 V | 3.6 | +85 °C | 85 | 0.7/Page | Non-Volatile | Winbond Electronics | 100000 | 2.7 V | 2.7 | -40 °C | -40 | Surface Mount | 8 | 1G | 1000000000 | 35 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TSOP1 | TSOP1, | 1 | 12 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | TSOP | 18.4 | Active | 48 | Unknown | Active | 35 | Yes | - | 2.7 to 3.6 | - | NOT SPECIFIED | 2.28 | Yes | - | SOP | TSOP-I | Industrial | 2.7V - 3.6V | Yes | Asynchronous | 3|3.3 | -40°C ~ 85°C (TA) | - | - | Active | SLC NAND Flash | FLASH - NAND (SLC) | 2.7V ~ 3.6V | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | 8Gbit | 40MHz | ASYNCHRONOUS | - | 25 ns | FLASH | Parallel | Sectored | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 1.2 mm | 8 | 25ns, 700µs | 8Gb | PARALLEL | FLASH | 3 V | 128Kbyte x 8192 | 2Kbyte | No | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 1G x 8 | 1.05mm | 12.1mm | 18.5mm | ||
W25Q80NESNIG Winbond Electronics Corporation | In Stock | - | - | - | - | - | - | - | 24 | No | - | Symmetrical | NOR | 8M | - | Yes | - | No | EAR99 | Compliant | 8542.32.00.71 | - | Serial (SPI, Dual SPI, Quad SPI) | Gull-wing | - | - | - | 7 | 20/Chip | - | - | 1.3 | - | 85 | 5/Page | - | - | 100000 | - | 1.14 | - | -40 | Surface Mount | 8 | 1M | - | 20 | - | - | - | - | - | - | 1.5(Max) | 5(Max) | - | - | - | 4(Max) | - | 8 | No | - | 20 | Yes | - | - | - | - | - | - | - | - | SOIC N | Industrial | - | No | Synchronous | 1.2 | - | Tube | - | Unconfirmed | - | - | - | - | - | - | - | - | - | 8 | - | - | - | - | - | - | - | - | - | - | - | Sectored | - | - | - | - | - | - | - | - | 4Kbyte x 256 | 256byte | No | - | - | - | - | - | ||
W25Q128FWYIC TR Winbond Electronics Corporation | In Stock | - | - | Surface Mount | 32-UFBGA, WLCSP | - | 32-WLCSP (3.98x3.19) | - | - | No | W25Q128 | Symmetrical | - | 128M | - | - | - | - | - | Compliant | - | - | Serial (SPI, Dual SPI, Quad SPI) | - | - | - | - | - | - | - | - | 1.95 | - | - | - | Non-Volatile | Winbond Electronics | - | - | 1.65 | - | - | Surface Mount | - | - | - | - | - | - | Tape & Reel (TR) | - | - | - | 0.33 | - | - | - | - | - | - | 32 | No | Obsolete | - | - | - | - | - | - | - | - | - | - | WLCSP | - | - | - | Synchronous | 1.8 | -40°C ~ 85°C (TA) | - | SpiFlash® | Obsolete | - | FLASH - NOR | 1.65V ~ 1.95V | - | - | - | - | - | - | 32 | - | - | - | - | 128Mbit | - | - | 104 MHz | - | FLASH | SPI - Quad I/O, QPI | Sectored | - | - | - | 60µs, 5ms | - | - | - | - | - | - | - | - | 16M x 8 | - | - | - | ||
W29N04GVBIAA TR Winbond Electronics Corporation | 44 |
| - | Surface Mount | 63-VFBGA | - | 63-VFBGA (9x11) | - | 30 | Yes | - | Symmetrical | SLC NAND | 4G | - | No | - | Yes | 3A991b.1.a. | Compliant | 8542.32.00.71 | - | Parallel | - | - | - | - | - | 0.01/Block | - | - | 3.6 | - | 85 | 0.7/Page | Non-Volatile | Winbond Electronics | 100000 | - | 2.7 | - | -40 | Surface Mount | 8 | 512M | - | 35 | - | - | Tape & Reel (TR) | - | - | - | 0.6(Max) | 11 | - | - | VFBGA | 9 | - | 63 | Unknown | Active | 35 | Yes | Yes | 2.7 to 3.6 | No | - | - | - | - | - | VFBGA | Industrial | 2.7V - 3.6V | Yes | Asynchronous | 3.3 | -40°C ~ 85°C (TA) | - | - | Active | SLC NAND Flash | FLASH - NAND (SLC) | 2.7V ~ 3.6V | - | - | - | - | - | - | 63 | - | - | - | - | 4Gbit | 40MHz | - | - | 20 ns | FLASH | ONFI | Sectored | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | - | - | 25ns, 700µs | 4Gb | - | - | - | 128Kbyte x 4096 | 2Kbyte | No | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 512M x 8 | - | - | - | ||
W29N04GVSIAF TR Winbond Electronics Corporation | 37 |
| - | Surface Mount | 48-TFSOP (0.724, 18.40mm Width) | - | 48-TSOP | - | 30 | Yes | - | Symmetrical | SLC NAND | 4G | - | No | - | Yes | 3A991.b.1.a | Compliant | 8542.32.00.71 | - | Parallel | - | - | - | - | - | 0.01/Block | - | - | 3.6 | - | 85 | 0.7/Page | Non-Volatile | Winbond Electronics | - | - | 2.7 | - | -40 | Surface Mount | 8 | 512M | - | 35 | - | - | Tape & Reel (TR) | - | - | - | 1 | 12 | - | - | - | 18.4 | - | 48 | Unknown | Active | 35 | Yes | - | 2.7 to 3.6 | - | - | - | - | - | - | TSOP | Industrial | 2.7V - 3.6V | No | Asynchronous | 3|3.3 | -40°C ~ 85°C (TA) | - | - | Active | SLC NAND Flash | FLASH - NAND (SLC) | 2.7V ~ 3.6V | - | - | - | - | - | - | 48 | - | - | - | - | 4Gbit | 40MHz | - | - | 25 ns | FLASH | ONFI | Sectored | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | - | - | 25ns, 700µs | 4Gb | - | - | - | 128Kbyte x 4096 | 2Kbyte | No | 40ºC ~ 85ºC / -40ºC ~ 105ºC | 512M x 8 | - | - | - | ||
W29N02GZBIBA TR Winbond Electronics Corporation | 37 |
| - | - | - | - | - | - | - | Yes | - | - | - | - | - | - | - | - | - | Compliant | 8542.32.00.71 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Surface Mount | - | - | - | - | - | - | - | - | - | - | 0.6(Max) | 11 | - | - | - | 9 | - | 63 | Unknown | - | - | - | - | - | - | - | - | - | - | - | VFBGA | - | 1.7V - 1.95V | - | - | - | - | - | - | Active | SLC NAND Flash | - | - | - | - | - | - | - | - | 63 | - | - | - | - | - | 29MHz | - | - | - | - | - | - | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | - | - | - | 2Gb | - | - | - | - | - | - | 40ºC ~ 85ºC / -40ºC ~ 105ºC | - | - | - | - | ||
W29N02GZSIBA Winbond Electronics Corporation | 50 | - | - | - | - | YES | - | 63 | 29 | Yes | - | Symmetrical | NAND | 2G | - | No | - | Yes | 3A991.b.1.a | Compliant | 8542.32.00.71 | WINBOND ELECTRONICS CORP | Parallel | - | - | Winbond Electronics Corp | W29N02GZSIBA | - | 0.01/Block | - | - | 1.95 | - | 85 | 0.7/Page | - | - | - | - | 1.7 | - | -40 | Surface Mount | 8 | 256M | 256000000 | 20 | 85 °C | -40 °C | - | PLASTIC/EPOXY | VFBGA | VFBGA, | 1 | 12 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | 18.4 | Active | 48 | Unknown | - | 20 | Yes | - | 1.7 to 1.95 | - | - | 2.31 | Yes | - | - | TSOP | Industrial | 1.7V - 1.95V | Yes | Asynchronous | 1.8 | - | - | - | Active | SLC NAND Flash | CMOS | - | BOTTOM | BALL | - | 1 | 0.8 mm | compliant | 48 | R-PBGA-B63 | 1.95 V | INDUSTRIAL | 1.7 V | - | 29MHz | ASYNCHRONOUS | - | - | - | - | Sectored | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 1 mm | 8 | - | 2Gb | PARALLEL | FLASH | 1.8 V | 128Kbyte x 2048 | 2Kbyte | No | 40ºC ~ 85ºC / -40ºC ~ 105ºC | - | - | 11 mm | 9 mm | ||
W74M32FVSSIQ Winbond Electronics Corporation | In Stock | - | - | - | - | YES | - | 8 | - | No | - | Symmetrical | - | 32M | 80 MHz | Yes | - | No | 3A991b.1.a. | Compliant | 8542.32.00.71 | WINBOND ELECTRONICS CORP | Serial (SPI, Dual SPI, Quad SPI) | Gull-wing | - | Winbond Electronics Corp | W74M32FVSSIQ | 7 | - | - | - | 3.6 | - | 85 | - | - | - | 100000 | - | 2.7 | - | -40 | Surface Mount | 8 | 4M | 4000000 | 30 | 85 °C | -40 °C | - | PLASTIC/EPOXY | SOP | SOIC-8 | 1.8 | 5.28 | SQUARE | SMALL OUTLINE | - | 5.28 | Active | 8 | No | - | - | Yes | - | - | - | NOT SPECIFIED | 2.36 | Yes | Security ICs / Authentication ICs Security Authentication spiFlash, 3V, 32M-bit | SOP | SOIC | Industrial | 3 V | No | Synchronous | 3|3.3 | - | Tube | - | Active | NOR TYPE | CMOS | - | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | 8 | S-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.7 V | - | - | SYNCHRONOUS | - | - | - | - | Sectored | 4MX8 | 2.16 mm | 8 | - | 33554432 bit | SERIAL | FLASH | 3 V | 4Kbyte x 1024 | 256byte | No | - | - | - | 5.28 mm | 5.28 mm | ||
W29N08GVBIAA Winbond Electronics Corporation | 860 |
| - | Surface Mount | 63-VFBGA | YES | 63-VFBGA (9x11) | 63 | 31 | Yes | W29N08 | Symmetrical | SLC NAND | 8G | - | No | - | Yes | 3A991.b.1.a | Compliant | 8542.32.00.71 | WINBOND ELECTRONICS CORP | Parallel | Ball | - | Winbond Electronics Corp | W29N08GVBIAA | - | 0.01/Block | - | - | 3.6 | - | 85 | 0.7/Page | Non-Volatile | Winbond Electronics | 100000 | - | 2.7 | - | -40 | Surface Mount | 8 | 1G | 1000000000 | 35 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | 0.6(Max) | 11 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | 9 | Active | 63 | Unknown | Active | 35 | Yes | - | 2.7 to 3.6 | - | NOT SPECIFIED | 2.31 | Yes | - | BGA | VFBGA | Industrial | 2.7V - 3.6V | Yes | Asynchronous | 3|3.3 | -40°C ~ 85°C (TA) | - | - | Active | SLC NAND Flash | FLASH - NAND (SLC) | 2.7V ~ 3.6V | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.8 mm | compliant | 63 | R-PBGA-B63 | 3.6 V | INDUSTRIAL | 2.7 V | 8Gbit | 40MHz | ASYNCHRONOUS | 40 MHz | 25 ns | FLASH | Parallel | Sectored | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | 1 mm | 8 | 25ns | 8Gb | PARALLEL | FLASH | 3 V | 128Kbyte x 8192 | 2Kbyte | No | -40ºC ~ 85ºC / -40ºC ~ 105ºC | 1G x 8 | - | 11 mm | 9 mm | ||
W25Q80BVSSIP Winbond Electronics Corporation | In Stock | - | - | - | - | - | - | - | 1 | No | - | Symmetrical | NOR | 8M | - | Yes | - | No | EAR99 | Compliant | 8542.32.00.71 | - | Serial (SPI, Dual SPI, Quad SPI) | Gull-wing | - | - | - | 8.5 | 6/Chip | - | - | 3.6 | - | 85 | 3/Page | - | - | 100000 | - | 2.7 | - | -40 | Surface Mount | 8 | 1M | - | 18 | - | - | - | - | - | - | 1.8 | 5.28 | - | - | - | 5.28 | - | 8 | No | - | - | Yes | - | 2.7 to 3.6 | - | - | - | - | - | SOP | SOIC | Industrial | - | No | Synchronous | 3|3.3 | - | - | - | Unconfirmed | - | - | - | - | - | - | - | - | - | 8 | - | - | - | - | - | - | - | - | - | - | - | Sectored | - | - | - | - | - | - | - | - | 4Kbyte x 256 | 256byte | No | - | - | - | - | - | ||
W25Q32JVXGIM/REEL Winbond Electronics Corporation | In Stock | - | - | - | - | - | - | - | 24 | No | - | Symmetrical | NOR | 32M | - | Yes | - | No | 3A991.b.1.a | Compliant | - | - | Serial (SPI, Dual SPI, Quad SPI) | - | Bottom|Top | - | - | 6 | 50/Chip | - | - | 3.6 | - | 85 | 3/Page | - | - | 100000 | - | 2.7 | - | -40 | Surface Mount | 8 | 4M | - | 25 | - | - | - | - | - | - | 0.43 | 4 | - | - | - | 4 | - | 8 | No | - | 25 | Yes | - | 2.7 to 3.6 | - | - | - | - | - | - | XSON EP | Industrial | - | No | Synchronous | 3|3.3 | - | Tube | - | Active | - | - | - | - | - | - | - | - | - | 8 | - | - | - | - | - | - | - | - | - | - | - | Sectored | - | - | - | - | - | - | - | - | 4Kbyte x 1024 | 256byte | Yes | - | - | - | - | - | ||
W25Q128JVSJQ/TUBE Winbond Electronics Corporation | In Stock | - | - | - | - | - | - | - | - | Unknown | - | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
W25Q16JVUXAQ/REEL Winbond Electronics Corporation | In Stock | - | - | - | - | - | - | - | - | Yes | - | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Unknown | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Unconfirmed | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
W29N01HZBINA/REEL Winbond Electronics Corporation | In Stock | - | - | - | - | - | - | - | 28 | No | - | Symmetrical | SLC NAND | 1G | - | No | - | Yes | 3A991.b.1.a | Compliant | - | - | Parallel | - | - | - | - | - | 0.01/Block | - | - | 1.95 | - | 85 | 0.7/Page | - | - | 100000 | - | 1.7 | - | -40 | Surface Mount | 8 | 128M | - | 25 | - | - | - | - | - | - | 0.6(Max) | 11 | - | - | - | 9 | - | 63 | No | - | 25 | Yes | - | 1.7 to 1.95 | - | - | - | - | - | - | VFBGA | Industrial | - | Yes | Asynchronous | 1.8 | - | - | - | Active | - | - | - | - | - | - | - | - | - | 63 | - | - | - | - | - | - | - | - | - | - | - | Sectored | - | - | - | - | - | - | - | - | 128Kbyte x 1024 | 2Kbyte | No | - | - | - | - | - |