- Features
- Operating Temperature
- Part Status
- Series
- Package / Case
- Packaging
- Supplier Device Package
- Composition
- Failure Rate
- Height Seated (Max)
- Manufacturer
- Max Operating Temperature
Attribute column
Manufacturer
Microsemi ZARLINK Clock/Timing - Application Specific
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Contact Shape | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Brand | Contact Sizes | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Applications | Power (Watts) | HTS Code | Fastening Type | Subcategory | Contact Type | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Number of Functions | Ingress Protection | Terminal Pitch | Reach Compliance Code | Output | Shell Finish | Shell Size - Insert | Termination Style | JESD-30 Code | Qualification Status | Housing Color | Output Type | Failure Rate | Power Supplies | Temperature Grade | Note | Shell Size, MIL | Supply Current-Max | Accuracy | Seated Height-Max | Operating Pressure | Pressure Type | Port Style | Port Size | Product Type | Includes | Maximum Pressure | Telecom IC Type | Features | Product Category | Height Seated (Max) | Length | Width | Material Flammability Rating | Radiation Hardening |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() ZL30146GGG Microsemi ZARLINK | 43 | - | - | - | - | - | - | - | 64 | - | - | - | - | - | Glenair | - | - | - | Glenair | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-Compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | - | - | - | - | D-Sub Connectors | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Micro-D D-Sub Connectors | - | - | - | - | D-Sub Micro-D Connectors | - | - | - | - | No | ||
![]() ZL30407QCG1 Microsemi ZARLINK | 426 | - | - | - | Panel Mount | - | YES | Bulkhead - Front Side Nut | - | Circular | Composite | - | Plastic | 80 | - | 16 (2), 20 (37) | ZARLINK SEMICONDUCTOR INC | -- | Zarlink Semiconductor Inc | ZL30407QCG1 | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | LQFP, QFP80,.64SQ | QFP80,.64SQ | SQUARE | FLATPACK, LOW PROFILE | Transferred | 30 | 5.81 | - | Yes | 3.3 V | -65°C ~ 200°C | Bulk | MIL-DTL-38999 Series III, ACT | - | - | e3 | Active | -- | - | - | Receptacle Housing | For Female Sockets | - | 39 | MATTE TIN | - | - | - | SONET;SDH | - | 8542.39.00.01 | Threaded | Other Telecom ICs | Crimp | - | QUAD | N (Normal) | GULL WING | Shielded | 260 | 1 | Environment Resistant | 0.65 mm | compliant | - | Electroless Nickel | 21-39 | - | S-PQFP-G80 | Not Qualified | Silver | - | - | 3.3 V | INDUSTRIAL | Contacts Not Included | G | 0.155 mA | - | 1.6 mm | - | - | - | - | - | -- | - | ATM/SONET/SDH SUPPORT CIRCUIT | -- | - | - | 14 mm | 14 mm | -- | - | ||
![]() ZL30120GGG Microsemi ZARLINK | In Stock | - | - | - | - | Cylinder | - | - | 100 | - | - | -- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | - | -40°C ~ 125°C | - | -- | - | - | - | Active | - | - | - | - | - | - | - | - | 85 °C | -40 °C | - | - | - | - | - | - | - | -- | - | - | - | - | - | - | - | - | - | 0 mV ~ 100 mV | - | - | Cable with Connector | - | - | - | Wheatstone Bridge | - | - | - | - | - | - | ±0.1% | - | 500 PSI (3447.38 kPa) | Absolute | No Port | -- | - | - | 1500 PSI (10342.14 kPa) | - | Temperature Compensated | - | - | - | - | - | - | ||
![]() ZL30136GGG Microsemi ZARLINK | 2030 | - | - | Surface Mount | - | Axial | - | - | 64 | - | - | Axial | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Non-Compliant | - | - | -55°C ~ 155°C | Tape & Box (TB) | RNF | 0.071 Dia x 0.130 L (1.80mm x 3.30mm) | ±1% | - | Active | - | 2 | ±100ppm/°C | - | - | 20 Ohms | - | - | 85 °C | -40 °C | Metal Film | - | 0.125W, 1/8W | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Flame Retardant Coating, Safety | - | -- | - | - | - | - | ||
![]() ZL30117GGG Microsemi ZARLINK | In Stock | - | - | - | - | Axial | - | - | - | - | - | Axial | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -55°C ~ 155°C | Tape & Reel (TR) | RNF | 0.071 Dia x 0.130 L (1.80mm x 3.30mm) | ±1% | - | Active | - | 2 | ±100ppm/°C | - | - | 26.7 Ohms | - | - | - | - | Metal Film | - | 0.125W, 1/8W | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Flame Retardant Coating, Safety | - | -- | - | - | - | - | ||
![]() ZL30107GGG Microsemi ZARLINK | 150 | - | - | - | - | Axial | YES | - | - | - | - | Axial | - | 64 | - | - | MICROCHIP TECHNOLOGY INC | - | Microchip Technology Inc | ZL30107GGG | - | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | - | 5.65 | - | - | 1.8 V | -55°C ~ 155°C | Tape & Reel (TR) | RNF | 0.093 Dia x 0.250 L (2.35mm x 6.35mm) | ±1% | - | Active | - | 2 | ±100ppm/°C | - | - | 1.24 kOhms | - | - | - | - | Metal Film | - | 0.25W, 1/4W | - | - | - | - | - | BOTTOM | - | BALL | - | - | 1 | - | 1 mm | compliant | - | - | - | - | S-PBGA-B64 | - | - | - | -- | - | INDUSTRIAL | - | - | - | - | 1.72 mm | - | - | - | - | - | - | - | TELECOM CIRCUIT | Flame Retardant Coating, Safety | - | -- | 9 mm | 9 mm | - | - |