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The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

Thermal resistance of a package in electronic components refers to the ability of a package to dissipate heat generated by the component. It is quantified as the temperature rise of the package per unit of power dissipated, typically expressed in degrees Celsius per watt. A lower thermal resistance value indicates better heat dissipation capabilities, ensuring the component operates within safe temperature limits. This parameter is critical for maintaining performance, reliability, and longevity of electronic devices by preventing overheating.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

The parameter "Voltage - Forward (Vf) (Typ)" in electronic components refers to the typical forward voltage drop across the component when it is conducting current in the forward direction. It is a crucial characteristic of components like diodes and LEDs, indicating the minimum voltage required for the component to start conducting current. The forward voltage drop is typically specified as a typical value because it can vary slightly based on factors such as temperature and manufacturing tolerances. Designers use this parameter to ensure that the component operates within its specified voltage range and to calculate power dissipation in the component.

the angle at which a display can be viewed with acceptable visual performance.

Optoelectronic Device Type refers to the classification of electronic components that can both detect and emit light. These devices convert electrical signals into light or vice versa, making them essential for applications such as optical communication, sensing, and display technologies. Common types of optoelectronic devices include light-emitting diodes (LEDs), photodiodes, phototransistors, and laser diodes. Understanding the optoelectronic device type is crucial for selecting the appropriate component for a specific application based on factors such as wavelength, power output, and sensitivity.

Current - Test is a parameter in electronic components that refers to the maximum current that the component can handle during testing without being damaged. This parameter is crucial for determining the operational limits of the component and ensuring its reliability under specified conditions. It is typically specified in the component's datasheet and is important for designers and engineers to consider when designing circuits to prevent overloading the component. Testing the component at or below the specified "Current - Test" value helps ensure its proper functioning and longevity in the intended application.

Lumens/Watt @ Current - Test is a measurement used to evaluate the efficiency of light-emitting components, such as LEDs, under specific test conditions. It indicates the amount of luminous flux produced (in lumens) for every watt of electrical power consumed by the device at a given current level. This metric helps in assessing the brightness and energy efficiency of lighting solutions, allowing for better comparisons between different products and technologies. Higher values signify more efficient light sources that produce more light for less energy consumed.

Lenses are classified by the curvature of the two optical surfaces. A lens is biconvex (or double convex, or just convex) if both surfaces are convex. If both surfaces have the same radius of curvature, the lens is equiconvex. A lens with two concave surfaces is biconcave (or just concave).

Forward Current-Max is a parameter used to specify the maximum amount of current that an electronic component, such as a diode or LED, can safely handle when it is forward-biased. This parameter is crucial for determining the operating limits of the component to prevent damage or failure due to excessive current flow. Exceeding the specified Forward Current-Max can lead to overheating, degradation of the component, or even permanent damage. It is important to carefully consider this parameter when designing circuits to ensure the component operates within its safe limits.

Overall Height is a parameter that refers to the total vertical measurement of an electronic component, typically measured from the bottom of the component to the highest point on top. It is an important specification to consider when designing or selecting components for a project, as it determines the amount of space the component will occupy within a circuit or device. Understanding the overall height of electronic components is crucial for ensuring proper fit and clearance within the overall system design. Manufacturers provide this information in datasheets to help engineers and designers make informed decisions during the product development process.

Flux at 25°C, Current - Test refers to the amount of electrical current that flows through a material or component when tested under specified conditions at a temperature of 25 degrees Celsius. It indicates the performance and reliability of the electronic component under normal operating conditions. This parameter is crucial for evaluating the heat dissipation and efficiency of the component in various electronic applications.

The parameter "Flux @ 85°C, Current - Test" in electronic components refers to the measurement of the flow of electric current through a circuit or component when subjected to an elevated temperature of 85 degrees Celsius. It is often used to assess the performance and reliability of electronic materials and soldering processes under thermal stress. This parameter is critical for ensuring that components will function correctly in high-temperature environments, providing insights into their durability and operational effectiveness.

Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.