

Everlight Electronics Co Ltd PD15-22C/TR8
Manufacturer No:
PD15-22C/TR8
Tiny WHSLManufacturer:
Utmel No:
821-PD15-22C/TR8
Package:
4-SMD, No Lead
Datasheet:
Description:
Surface Mount -25°C~85°C Tape & Reel (TR) 4-SMD, No Lead 10nA
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- TypeParameter
- Factory Lead Time15 Weeks
- Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
4-SMD, No Lead - Number of Pins4
- Shape
In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.
RECTANGULAR - Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-25°C~85°C - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - Published2008
- Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
3 (168 Hours) - Number of Functions1
- Configuration
The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.
SINGLE - Diode Type
In electronic components, the parameter "Diode Type" refers to the specific type or configuration of a diode, which is a semiconductor device that allows current to flow in one direction only. There are various types of diodes, each designed for specific applications and functions. Common diode types include rectifier diodes, zener diodes, light-emitting diodes (LEDs), and Schottky diodes, among others. The diode type determines the diode's characteristics, such as forward voltage drop, reverse breakdown voltage, and maximum current rating, making it crucial for selecting the right diode for a particular circuit or application. Understanding the diode type is essential for ensuring proper functionality and performance in electronic circuits.
PIN - Power Dissipation
the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.
150mW - Size2.8mm
- Rise Time
In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.
10ns - Fall Time (Typ)
Fall Time (Typ) is a parameter used to describe the time it takes for a signal to transition from a high level to a low level in an electronic component, such as a transistor or an integrated circuit. It is typically measured in nanoseconds or microseconds and is an important characteristic that affects the performance of the component in digital circuits. A shorter fall time indicates faster switching speeds and can result in improved overall circuit performance, such as reduced power consumption and increased data transmission rates. Designers often consider the fall time specification when selecting components for their circuits to ensure proper functionality and efficiency.
10 ns - Max Reverse Voltage (DC)
Max Reverse Voltage (DC) refers to the maximum voltage that a semiconductor device, such as a diode, can withstand in the reverse bias direction without failing. Exceeding this voltage can lead to breakdown and potential damage to the component. It is a critical parameter in circuit design to ensure reliability and prevent failure when the device is subjected to reverse voltage conditions.
32V - Reverse Breakdown Voltage
Reverse Breakdown Voltage is the maximum reverse voltage a semiconductor device can withstand before it starts to conduct heavily in the reverse direction. It is a critical parameter in diodes and other components, indicating the threshold at which the material's insulating properties fail. Beyond this voltage, the device may enter a breakdown region, leading to potential damage if not properly managed. This parameter is essential for ensuring safe operation and reliability in electronic circuits.
32V - Dark Current
the relatively small electric current that flows through photosensitive devices such as a photomultiplier tube, photodiode, or charge-coupled device even when no photons are entering the device.
10nA - Spectral Range
The parameter "Spectral Range" in electronic components refers to the range of frequencies or wavelengths within the electromagnetic spectrum that the component is designed to operate within or respond to. It indicates the specific range of electromagnetic radiation that the component can detect, transmit, or interact with effectively. Understanding the spectral range of an electronic component is crucial for ensuring its proper functionality and compatibility with the intended application or system. Different electronic components may have varying spectral ranges based on their design, materials used, and intended purpose.
400nm ~ 1100nm - Infrared Range
The "Infrared Range" in electronic components refers to the range of wavelengths within the infrared spectrum that the component is capable of detecting or emitting. Infrared radiation is electromagnetic radiation with longer wavelengths than visible light, and it is commonly used in various electronic devices for communication, sensing, and control purposes. The specific range of infrared wavelengths that a component can interact with is important for determining its functionality and compatibility with other components in a system. Components designed for infrared applications, such as infrared sensors or transmitters, are optimized to operate within a specific range of infrared wavelengths to ensure reliable performance.
YES - Light Current-Nom
Light Current-Nom is a parameter used in electronic components, particularly in optoelectronic devices such as photodiodes and phototransistors. It refers to the nominal or typical current generated by the component when exposed to a specific amount of light. This parameter helps to characterize the sensitivity of the component to light, indicating how much current it can produce in response to varying light levels. Understanding the Light Current-Nom value is crucial for designing circuits and systems that rely on light detection or emission, as it provides insight into the component's performance under different lighting conditions.
0.0065mA - Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free