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refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

Thickness - Overall is a parameter that refers to the total thickness of an electronic component, typically measured from the bottom of the component to the highest point on top. This measurement is important for determining the overall size and profile of the component, which can impact its compatibility with other components or its fit within a specific device or circuit board. Manufacturers provide this specification to help designers and engineers ensure proper spacing and clearance when integrating the component into their electronic systems. Understanding the overall thickness of a component is crucial for proper installation and functionality within an electronic device.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.