NXP USA Inc. MMDS09254HT1
NXP USA Inc. MMDS09254HT1
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NXP USA Inc. MMDS09254HT1

Manufacturer No:

MMDS09254HT1

Manufacturer:

NXP USA Inc.

Utmel No:

1786-MMDS09254HT1

Package:

32-VFQFN Exposed Pad

Usage Grade:

  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive

ECAD Model:

Description:

MMDS09254HT1 datasheet pdf and RF Misc ICs and Modules product details from NXP USA Inc. stock available at Utmel

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In Stock : 5000

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FedEx International, 5-7 business days.

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MMDS09254HT1 information

Specifications
Documents & Media
Product Details
Product Comparison
NXP USA Inc. MMDS09254HT1 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MMDS09254HT1.
  • Type
    Parameter
  • Factory Lead Time
    14 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    32-VFQFN Exposed Pad
  • Usage Level
    Military grade
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2014
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    700MHz~1GHz
  • Function

    The parameter "Function" in electronic components refers to the specific role or purpose that the component serves within an electronic circuit. It defines how the component interacts with other elements, influences the flow of electrical signals, and contributes to the overall behavior of the system. Functions can include amplification, signal processing, switching, filtering, and energy storage, among others. Understanding the function of each component is essential for designing effective and efficient electronic systems.

    Advanced Doherty Alignment Module
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for NXP USA Inc. MMDS09254HT1.

MMDS09254HT1 Overview

RF modulator operates on the basis of the frequency of 700MHz~1GHz.This RF IC is excellent due to its enhanced 32-VFQFN Exposed Pad package.The package of this RF modulator is Tape & Reel (TR).On any Surface Mount-type PCB or development board, you can install this RF modulator.

MMDS09254HT1 Features

Frequency of 700MHz~1GHz
32-VFQFN Exposed Pad package
Tape & Reel (TR)

MMDS09254HT1 Applications

There are a lot of NXP USA Inc.
MMDS09254HT1 RF Misc ICs and Modules applications.


  • Variable matched attenuator
  • Phase shifter
  • Cellular base stations
  • Radio links
  • Fixed wireless access
  • Broadband/CATV
  • RF/IF analog multiplexer
  • Balanced modulation
  • Demodulation
  • Synchronous detection
The three parts on the right have similar specifications to NXP USA Inc. & MMDS09254HT1.
MMDS09254HT1 Relevant information

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