

Texas Instruments INA200AQDGKRQ1
Current regulation Automotive, AEC-Q100 Series 8 Pin 12V Current Regulator IC
Manufacturer No:
INA200AQDGKRQ1
Tiny WHSLManufacturer:
Utmel No:
2502-INA200AQDGKRQ1
Package:
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Usage Grade:
Automotive
Description:
8 Terminations 12V 8 Pin INA200 Current regulator Automotive, AEC-Q100 Series -40°C~125°C Min 2.7V Max 18V
Quantity:
Unit Price: $10.964553
Ext Price: $10.96
Delivery:





Payment:











In Stock : 8250
Minimum: 1 Multiples: 1
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Unit Price
Ext Price
1
$10.964553
$10.96
10
$10.343918
$103.44
100
$9.758413
$975.84
500
$9.206050
$4,603.02
1000
$8.684953
$8,684.95
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- TypeParameter
- Lifecycle Status
Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.
ACTIVE (Last Updated: 4 days ago) - Factory Lead Time6 Weeks
- Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) - Number of Pins8
- Usage LevelAutomotive grade
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~125°C - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
Automotive, AEC-Q100 - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e4 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
2 (1 Year) - Number of Terminations8
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Nickel/Palladium/Gold (Ni/Pd/Au) - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
12V - Terminal Pitch
The center distance from one pole to the next.
0.65mm - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
INA200 - Function
The parameter "Function" in electronic components refers to the specific role or purpose that the component serves within an electronic circuit. It defines how the component interacts with other elements, influences the flow of electrical signals, and contributes to the overall behavior of the system. Functions can include amplification, signal processing, switching, filtering, and energy storage, among others. Understanding the function of each component is essential for designing effective and efficient electronic systems.
Current Monitor - Number of Channels1
- Max Supply Voltage
In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.
18V - Min Supply Voltage
The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.
2.7V - Nominal Supply Current
Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.
1.85mA - Accuracy
Accuracy in electronic components refers to the degree to which a measured value agrees with the true or accepted value. It evaluates the precision of a component in providing correct output or measurement under specified conditions. High accuracy indicates minimal deviation from the actual value, while low accuracy shows significant error in measurement. This parameter is crucial in applications where precise data is essential for reliable performance and decision-making.
±3.5% - Slew Rate
the maximum rate of output voltage change per unit time.
1 V/us - Amplifier Type
Amplifier Type refers to the classification or categorization of amplifiers based on their design, functionality, and characteristics. Amplifiers are electronic devices that increase the amplitude of a signal, such as voltage or current. The type of amplifier determines its specific application, performance capabilities, and operating characteristics. Common types of amplifiers include operational amplifiers (op-amps), power amplifiers, audio amplifiers, and radio frequency (RF) amplifiers. Understanding the amplifier type is crucial for selecting the right component for a particular circuit or system design.
OPERATIONAL AMPLIFIER - Common Mode Rejection Ratio
Common Mode Rejection Ratio (CMRR) is a measure of the ability of a differential amplifier to reject input signals that are common to both input terminals. It is defined as the ratio of the differential gain to the common mode gain. A high CMRR indicates that the amplifier can effectively eliminate noise and interference that affects both inputs simultaneously, enhancing the fidelity of the amplified signal. CMRR is typically expressed in decibels (dB), with higher values representing better performance in rejecting common mode signals.
123 dB - Unity Gain BW-Nom
Unity Gain Bandwidth, often abbreviated as Unity Gain BW or UGBW, refers to the frequency at which an amplifier can provide a gain of one (0 dB). It is a critical parameter in assessing the performance of operational amplifiers and other amplifying devices, indicating the range of frequencies over which the amplifier can operate without distortion. Unity Gain BW is particularly important in applications where signal fidelity is crucial, as it helps determine the maximum frequency of operation for a given gain level. As the gain is reduced, the bandwidth typically increases, ensuring that the amplifier can still operate effectively across various signal frequencies.
500 kHz - Sensing Method
The sensing method in electronic components refers to the technique or mechanism used to detect and measure physical phenomena such as temperature, pressure, light, or motion. This includes a variety of technologies such as resistive, capacitive, inductive, and optical sensing methods. The choice of sensing method affects the accuracy, response time, and application suitability of the electronic component. It plays a crucial role in determining how effectively a device can interact with and interpret its environment.
High-Side - Input Offset Voltage-Max
The parameter "Input Offset Voltage-Max" in electronic components refers to the maximum allowable difference in voltage between the input terminals of an operational amplifier or other analog circuitry before the output is affected. It is a measure of the device's ability to maintain precise and accurate signal processing. A higher Input Offset Voltage-Max value indicates a greater potential for error in the output signal due to input voltage differences. Designers must consider this parameter when selecting components to ensure the desired level of accuracy and performance in their circuits.
3500μV - Voltage Gain-Nom
Voltage Gain-Nom is a parameter used to describe the ratio of the output voltage to the input voltage in electronic components such as amplifiers. It represents the amplification factor of the component and indicates how much the input voltage is amplified to produce the output voltage. The "Nom" in the term signifies that this value is the nominal or typical voltage gain under specified operating conditions. A higher voltage gain indicates a greater amplification of the input signal, while a lower voltage gain signifies less amplification. This parameter is crucial in determining the performance and functionality of electronic circuits and devices.
20 - Height1.07mm
- Length3mm
- Width3mm
- Thickness
Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.
970μm - Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant - Lead Free
Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.
Lead Free