Xilinx Inc. XC6SLX45-2CSG324C
Xilinx Inc. XC6SLX45-2CSG324C
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Xilinx Inc. XC6SLX45-2CSG324C

FPGAs Spartan®-6 LX 1.62GHz MHz FPGAs

Manufacturer No:

XC6SLX45-2CSG324C

Manufacturer:

Xilinx Inc.

Utmel No:

2773-XC6SLX45-2CSG324C

Package:

324-LFBGA, CSPBGA

ECAD Model:

Description:

1.2V V FPGAs Spartan®-6 LX Series 1.62GHz MHz 324-LFBGA, CSPBGA

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In Stock : 2567

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XC6SLX45-2CSG324C information

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Xilinx Inc. XC6SLX45-2CSG324C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6SLX45-2CSG324C.
  • Type
    Parameter
  • Factory Lead Time
    10 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    324-LFBGA, CSPBGA
  • Number of Pins
    324
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    324-CSPBGA (15x15)
  • Number of I/Os
    218
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~85°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Spartan®-6 LX
  • Published
    2008
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Termination

    Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

    SMD/SMT
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    0°C
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.14V~1.26V
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    1.62GHz
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    XC6SLX45
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.2V
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    1.26V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    1.14V
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    261kB
  • Number of Logic Elements/Cells
    43661
  • Total RAM Bits

    Total RAM Bits refers to the total number of memory bits that can be stored in a Random Access Memory (RAM) component. RAM is a type of computer memory that allows data to be accessed in any random order, making it faster than other types of memory like hard drives. The total RAM bits indicate the capacity of the RAM chip to store data temporarily for quick access by the computer's processor. The more total RAM bits a component has, the more data it can store and process at any given time, leading to improved performance and multitasking capabilities.

    2138112
  • Number of LABs/CLBs
    3411
  • Number of Logic Blocks (LABs)
    3411
  • Speed Grade

    Speed grade is a specification in electronic components that indicates the maximum operating speed at which the component can reliably function. It is commonly used for integrated circuits, particularly in digital logic devices and programmable logic devices. The speed grade is typically denoted by a number or letter code that correlates to the maximum frequency or propagation delay of the device, influencing its performance in high-speed applications. Components with higher speed grades are capable of faster processing and lower signal delay compared to those with lower grades.

    2
  • Number of Macro Cells
    43661
  • Number of Registers
    54576
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Xilinx Inc. XC6SLX45-2CSG324C.

Product Description:

The XC6SLX45-2CSG324C is a high-performance, field-programmable gate array (FPGA) from Xilinx Inc. This device is part of the Spartan?-6 LX series, designed to provide a balance of performance, density, and power efficiency. With a maximum operating frequency of 1.62 GHz, this FPGA is ideal for a wide range of applications requiring high-speed processing and data transfer.

Features:

  • High-speed processing with a maximum operating frequency of 1.62 GHz
  • 3411 logic blocks (LABs) and 43661 logic elements (LEs) for complex logic and signal processing
  • 218 I/O pins for high-speed data transfer and connectivity
  • 261 kB of RAM for data storage and processing
  • Operating temperature range of 0°C to 85°C for reliable operation in harsh environments
  • RoHS3 compliant and REACH SVHC free for environmental sustainability
  • Surface mount packaging with a moisture sensitivity level of 3 (168 hours) for easy integration into PCBs

Applications:

  • High-speed data processing and transfer in telecommunications, networking, and data storage applications
  • Complex signal processing and filtering in audio and video processing applications
  • Real-time control and monitoring in industrial automation and robotics applications
  • Embedded systems and microcontrollers in automotive, medical, and aerospace applications

Alternative Parts:

  • XC6SLX9-2CSG324C: A similar FPGA with a lower speed grade (1.5 GHz) and fewer logic elements (LEs)
  • XC6SLX16-2CSG324C: A higher-performance FPGA with a higher speed grade (2.5 GHz) and more logic elements (LEs)

Embedded Modules:

  • Xilinx Spartan?-6 LX FPGA modules for various applications, including telecommunications, networking, and data storage
  • Xilinx Zynq?-7000 SoC modules for embedded systems and microcontrollers

FAQs:

Q: What is the maximum operating frequency of the XC6SLX45-2CSG324C? A: The maximum operating frequency is 1.62 GHz.

Q: What is the operating temperature range of the XC6SLX45-2CSG324C? A: The operating temperature range is 0°C to 85°C.

Q: What is the packaging type of the XC6SLX45-2CSG324C? A: The packaging type is a 324-LFBGA, CSPBGA package.

Q: Is the XC6SLX45-2CSG324C RoHS3 compliant? A: Yes, the XC6SLX45-2CSG324C is RoHS3 compliant.

Q: What is the minimum supply voltage of the XC6SLX45-2CSG324C? A: The minimum supply voltage is 1.14V.

I hope this product description meets your requirements. Let me know if you need any further assistance.

The three parts on the right have similar specifications to Xilinx Inc. & XC6SLX45-2CSG324C.
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