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Categories

Sockets for ICs, Transistors - Adapters

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357 Results

Product

Inventory

Pricing(USD)

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Datasheet

RoHS

Factory Lead Time

Contact Plating

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Mounting Type

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Housing Material

Weight

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Contact Material - Post

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JESD-609 Code

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Min Operating Temperature

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Gender

Additional Feature

Current Rating (Amps)

Pitch

Orientation

Depth

Current Rating

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Lead Pitch

Number of Contacts

Contact Finish - Post

PCB Contact Pattern

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Lead Length

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Contact Style

Insulation Resistance

Row Spacing

PCB Contact Row Spacing

Device Socket Type

Termination Post Length

Pitch - Post

Convert From (Adapter End)

Convert To (Adapter End)

Features

Height

Length

Width

Contact Finish Thickness - Mating

Contact Finish Thickness - Post

Material Flammability Rating

Radiation Hardening

REACH SVHC

RoHS Status

Flammability Rating

Lead Free

28-653000-11-RC
28-653000-11-RC

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

28

-

-

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

Box

2006

Correct-A-ChipĀ® 653000

e4

yes

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

UL 94V-0

-

-

-

-

1A

0.050 1.27mm

-

28

Gold

-

-

3.175mm

-

-

-

15.24 mm

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

PLCC

DIP, 0.6 (15.24mm) Row Spacing

Socket Included

-

-

-

-

10.0μin 0.25μm

UL94 V-0

-

No SVHC

ROHS3 Compliant

UL94 V-0

Lead Free

14-354000-11-RC
14-354000-11-RC

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Surface Mount

Surface Mount

-

14

Polyester

Polyamide (PA46), Nylon 4/6, Glass Filled

-

-

Beryllium Copper

Brass

-

Gold

Copper

-

-

-

2006

Correct-A-ChipĀ® 354000

e4

yes

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

STANDARD: UL 94V-0

-

-

-

-

3A

0.100 2.54mm

-

14

-

-

-

762μm

-

-

-

7.62 mm

-

IC SOCKET

0.030 0.76mm

0.050 1.27mm

DIP, 0.3 (7.62mm) Row Spacing

SOIC

-

-

-

-

10.0μin 0.25μm

10.0μin 0.25μm

UL94 V-0

-

No SVHC

ROHS3 Compliant

UL94 V-0

-

In Stock

-

Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

28

-

Polysulfone (PSU), Glass Filled

-

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

-

2001

Textoolā„¢

-

-

Active

1 (Unlimited)

Solder

-

28

150°C

-55°C

-

Female

-

1A

2.54mm

-

-

1A

0.100 2.54mm

-

28

Gold

-

-

-

-

-

-

-

-

-

0.130 3.30mm

0.100 2.54mm

DIP, 0.4 (10.16mm) Row Spacing

DIP, 0.4 (10.16mm) Row Spacing

-

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

-

-

RoHS Compliant

UL94 V-0

Lead Free

In Stock

-

Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

42

-

Polysulfone (PSU), Glass Filled

-

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

-

2011

Textoolā„¢

-

-

Active

1 (Unlimited)

Solder

-

42

150°C

-55°C

-

Female

-

1A

1.778mm

-

-

1A

0.070 1.78mm

-

42

Gold

-

-

-

-

-

-

-

-

-

0.130 3.30mm

0.070 1.78mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.6 (15.24mm) Row Spacing

Closed Frame

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

-

-

RoHS Compliant

UL94 V-0

Lead Free

20-351000-10
20-351000-10

Aries Electronics

In Stock

-

Datasheet

5 Weeks

Tin

-

Through Hole

-

20

-

-

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

-

2009

Correct-A-ChipĀ® 351000

e0

-

Active

1 (Unlimited)

Solder

EAR99

-

105°C

-55°C

2

-

SOCKET ADAPTER

-

-

-

-

1A

0.026 0.65mm

-

20

Tin-Lead

-

-

-

-

-

-

7.62 mm

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

SSOP

DIP, 0.3 (7.62mm) Row Spacing

-

1.58mm

-

-

-

200.0μin 5.08μm

-

-

-

Non-RoHS Compliant

-

Contains Lead

32-653000-11-RC
32-653000-11-RC

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

32

-

-

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

-

2006

Correct-A-ChipĀ® 653000

e4

yes

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

UL 94V-0

-

-

-

-

1A

0.050 1.27mm

-

32

Gold

-

-

3.175mm

-

-

-

15.24 mm

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

PLCC

DIP, 0.6 (15.24mm) Row Spacing

Socket Included

-

-

-

-

10.0μin 0.25μm

UL94 V-0

-

No SVHC

ROHS3 Compliant

UL94 V-0

Lead Free

1107254-24
1107254-24

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

-

Through Hole

-

-

-

Polyamide (PA46), Nylon 4/6, Glass Filled

-

-

Beryllium Copper

Brass

-

Gold

Copper

-

-

Bulk

2006

Correct-A-ChipĀ® 1107254

e3

yes

Active

1 (Unlimited)

Solder

EAR99

24

-

-

2

-

SOCKET ADAPTER

3A

-

-

-

-

0.100 2.54mm

2.54mm

24

Tin

RECTANGULAR

0.7 inch

-

0.3 inch

RND PIN-SKT

-

15.24 mm

-

IC SOCKET

0.130 3.30mm

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.3 (7.62mm) Row Spacing

-

2.29mm

30.5mm

-

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

-

No SVHC

ROHS3 Compliant

-

Lead Free

1106396-14
1106396-14

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

14

-

Polyamide (PA46), Nylon 4/6, Glass Filled

-

-

Beryllium Copper

Brass

-

Gold

-

-

-

-

2006

Correct-A-ChipĀ® 1106396

e3

yes

Active

1 (Unlimited)

Solder

EAR99

-

-

-

2

-

SOCKET ADAPTER

-

-

-

-

3A

0.100 2.54mm

2.54mm

14

Tin

RECTANGULAR

-

3.302mm

-

RND PIN-SKT

-

-

0.6 mm

IC SOCKET

0.130 3.30mm

0.100 2.54mm

DIP, 0.3 (7.62mm) Row Spacing

DIP, 0.6 (15.24mm) Row Spacing

-

-

-

-

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

-

-

ROHS3 Compliant

UL94 V-0

-

1107254-16
1107254-16

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

16

-

Polyamide (PA46), Nylon 4/6, Glass Filled

-

-

Beryllium Copper

Brass

-

Gold

-

-

-

Bulk

2006

Correct-A-ChipĀ® 1107254

e3

yes

Active

1 (Unlimited)

Solder

EAR99

-

-

-

2

-

SOCKET ADAPTER

-

-

-

-

3A

0.100 2.54mm

2.54mm

16

Tin

RECTANGULAR

0.7 inch

3.302mm

0.3 inch

RND PIN-SKT

-

-

0.3 mm

IC SOCKET

0.130 3.30mm

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.3 (7.62mm) Row Spacing

-

-

-

-

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

-

-

ROHS3 Compliant

UL94 V-0

-

68-505-110-P
68-505-110-P

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

68

-

-

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

-

2011

Correct-A-ChipĀ® 505

e0

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

-

-

-

-

-

0.050 1.27mm

-

68

Tin-Lead

-

-

3.81mm

-

-

-

-

-

IC SOCKET

0.150 3.81mm

0.050 1.27mm

PLCC

PGA

-

-

-

-

-

200.0μin 5.08μm

-

-

-

Non-RoHS Compliant

-

Lead Free

1109522
1109522

Aries Electronics

In Stock

-

Datasheet

6 Weeks

-

Through Hole

Through Hole

TO-8

8

-

Polyamide (PA46), Nylon 4/6, Glass Filled

-

-

Beryllium Copper

Brass

FR4 Epoxy Glass

Gold

-

-

-

-

2006

Correct-A-ChipĀ® 1109522

e0

-

Active

1 (Unlimited)

Solder

EAR99

-

105°C

-55°C

2

-

STANDARD: UL 94V-0

-

-

-

-

3A

0.100 2.54mm

2.54mm

8

Tin-Lead

-

-

3.175mm

-

-

-

-

-

IC SOCKET

0.125 3.18mm

-

DIP, 0.3 (7.62mm) Row Spacing

JEDEC

-

-

-

-

10.0μin 0.25μm

200.0μin 5.08μm

UL94 V-0

-

-

Non-RoHS Compliant

UL94 V-0

-

In Stock

-

Datasheet

8 Weeks

Gold

Through Hole, Wire

Through Hole

-

20

-

Polysulfone (PSU), Glass Filled

453.59237g

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

-

2011

Textoolā„¢

-

-

Active

1 (Unlimited)

Wire Wrap

-

20

150°C

-55°C

-

Female

-

1A

2.54mm

-

25.4mm

1A

0.100 2.54mm

-

20

Gold

-

-

-

-

-

-

-

-

-

0.620 15.75mm

0.100 2.54mm

DIP, 0.3 (7.62mm) Row Spacing

DIP, 0.3 (7.62mm) Row Spacing

Closed Frame

-

40.1mm

6.9mm

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

-

-

RoHS Compliant

UL94 V-0

Lead Free

In Stock

-

Datasheet

8 Weeks

Gold

Through Hole, Wire

Through Hole

-

32

-

Polysulfone (PSU), Glass Filled

-

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

-

2011

Textoolā„¢

-

-

Active

1 (Unlimited)

Wire Wrap

-

32

-

-

2

-

-

1A

2.54mm

Straight

-

-

0.100 2.54mm

-

32

Gold

-

-

-

-

-

-

-

-

-

0.620 15.75mm

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.6 (15.24mm) Row Spacing

Closed Frame

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

No

-

RoHS Compliant

-

Lead Free

20-350001-10
20-350001-10

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

-

Through Hole

SOIC

20

-

-

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

-

2006

Correct-A-ChipĀ® 350000

e0

-

Active

1 (Unlimited)

Solder

EAR99

-

105°C

-55°C

2

-

SOCKET ADAPTER

-

-

-

-

-

0.050 1.27mm

-

20

Tin

-

-

-

-

-

-

7.62 mm

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

SOJ

DIP, 0.3 (7.62mm) Row Spacing

-

1.58mm

-

-

-

200.0μin 5.08μm

-

-

-

Non-RoHS Compliant

-

Contains Lead

96-160M65
96-160M65

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

-

Through Hole

-

160

-

-

-

-

Copper

Brass

FR4 Epoxy Glass

Tin

-

-

-

-

2006

Correct-A-ChipĀ® 96-160M65

e3

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

SOCKET ADAPTER

-

-

-

-

-

0.026 0.65mm

-

160

Tin-Lead

-

-

-

-

-

-

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

QFP

PGA

-

2.39mm

39.4mm

-

-

200.0μin 5.08μm

-

-

-

Non-RoHS Compliant

-

Contains Lead

1107254-28
1107254-28

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

-

Through Hole

-

-

-

Polyamide (PA46), Nylon 4/6, Glass Filled

-

-

Beryllium Copper

Brass

-

Gold

Copper

-

-

-

2006

Correct-A-ChipĀ® 1107254

e3

yes

Active

1 (Unlimited)

Solder

EAR99

28

-

-

2

-

SOCKET ADAPTER

3A

-

-

-

-

0.100 2.54mm

2.54mm

28

Tin

RECTANGULAR

0.7 inch

-

0.3 inch

RND PIN-SKT

-

15.24 mm

-

IC SOCKET

0.130 3.30mm

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.3 (7.62mm) Row Spacing

-

2.29mm

35.6mm

-

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

-

No SVHC

ROHS3 Compliant

-

Lead Free

In Stock

-

Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

28

-

Polysulfone (PSU), Glass Filled

-

Glass, Polysulfone

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

-

2001

Textoolā„¢

-

-

Active

1 (Unlimited)

Solder

-

28

150°C

-55°C

-

Female

-

1A

1.78mm

Straight

6.9mm

1A

0.070 1.78mm

-

28

Gold

-

-

-

-

-

1GOhm

10.16 mm

-

-

0.130 3.30mm

0.070 1.78mm

DIP, 0.4 (10.16mm) Row Spacing

DIP, 0.4 (10.16mm) Row Spacing

-

-

40.5mm

27.9mm

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

-

-

RoHS Compliant

UL94 V-0

Lead Free

In Stock

-

Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

40

-

Polysulfone (PSU), Glass Filled

453.59237g

Glass, Polysulfone

Beryllium Copper

Beryllium Copper

-

Gold

Copper

1kV

-55°C~125°C

-

2001

Textoolā„¢

-

-

Active

1 (Unlimited)

Solder

-

40

150°C

-55°C

-

Female

-

1A

2.54mm

Straight

6.9mm

1A

0.100 2.54mm

-

40

Gold

-

-

-

-

-

-

15.24 mm

-

-

0.130 3.30mm

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.6 (15.24mm) Row Spacing

-

-

65.5mm

32.3mm

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

-

-

RoHS Compliant

UL94 V-0

Lead Free

1106396-24
1106396-24

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

-

Through Hole

-

-

-

Polyamide (PA46), Nylon 4/6, Glass Filled

-

-

Beryllium Copper

Brass

-

Gold

-

-

-

-

2006

Correct-A-ChipĀ® 1106396

e3

yes

Active

1 (Unlimited)

Solder

EAR99

24

-

-

2

-

SOCKET ADAPTER

3A

-

-

-

-

0.100 2.54mm

2.54mm

24

Tin

RECTANGULAR

-

-

-

RND PIN-SKT

-

7.62 mm

-

IC SOCKET

0.130 3.30mm

0.100 2.54mm

DIP, 0.3 (7.62mm) Row Spacing

DIP, 0.6 (15.24mm) Row Spacing

-

2.29mm

30.5mm

-

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

-

No SVHC

ROHS3 Compliant

-

Lead Free

In Stock

-

Datasheet

9 Weeks

Gold

Through Hole

Through Hole

-

42

-

Polysulfone (PSU), Glass Filled

-

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

-

2011

Textoolā„¢

-

-

Active

1 (Unlimited)

Solder

-

42

150°C

-55°C

-

Female

-

1A

1.778mm

-

-

1A

0.070 1.78mm

-

42

Gold

-

-

-

-

-

-

-

-

-

0.130 3.30mm

0.070 1.78mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.6 (15.24mm) Row Spacing

Closed Frame

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

-

-

RoHS Compliant

UL94 V-0

Lead Free