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Sockets for ICs, Transistors - Adapters

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357 Results

Product

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Lead Free

08-666000-00
08-666000-00

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Surface Mount

Surface Mount

-

8

-

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

2006

Correct-A-Chip® 666000

e0

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

UL 94V-0

-

-

-

-

-

0.050 1.27mm

-

8

Tin-Lead

2.032mm

-

-

IC SOCKET

0.080 2.03mm

0.050 1.27mm

SOIC

SOWIC

-

-

-

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

-

10-665000-00
10-665000-00

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Surface Mount

Surface Mount

SOIC

10

-

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

2006

Correct-A-Chip® 665000

-

Active

1 (Unlimited)

Solder

-

10

-

-

-

-

-

-

-

-

-

-

0.050 1.27mm

-

-

Tin-Lead

787.4μm

-

-

-

0.031 0.80mm

0.050 1.27mm

SOIC-W

SOIC

-

-

-

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

-

18-666000-00
18-666000-00

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Surface Mount

Surface Mount

-

18

-

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

2006

Correct-A-Chip® 666000

e0

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

UL 94V-0

-

-

-

-

-

0.050 1.27mm

-

18

Tin-Lead

2.032mm

-

-

IC SOCKET

0.080 2.03mm

0.050 1.27mm

SOIC

SOWIC

-

-

-

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

-

28-665000-00
28-665000-00

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Surface Mount

Surface Mount

-

28

-

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

2006

Correct-A-Chip® 665000

e3

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

SOCKET ADAPTER

-

-

-

-

-

0.050 1.27mm

-

28

Tin-Lead

787.4μm

-

-

IC SOCKET

0.031 0.80mm

0.050 1.27mm

SOIC-W

SOIC

-

-

-

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

-

44-505-110
44-505-110

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

44

-

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

2006

Correct-A-Chip® 505

e0

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

SOCKET ADAPTER

-

-

-

-

-

0.050 1.27mm

-

44

Tin-Lead

3.81mm

-

-

IC SOCKET

0.150 3.81mm

0.050 1.27mm

PLCC

PGA

-

-

-

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

-

18-350000-10-HT
18-350000-10-HT

Aries Electronics

In Stock

-

Datasheet

6 Weeks

-

Through Hole

Through Hole

-

18

POLYAMIDE

-

-

-

Brass

Polyimide (PI)

Tin

-

-

-

2005

Correct-A-Chip® 350000

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

SOCKET ADAPTER

-

-

-

-

-

0.050 1.27mm

-

18

Tin-Lead

3.175mm

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

SOIC

DIP, 0.3 (7.62mm) Row Spacing

High Temperature

-

-

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

-

20-352000-10
20-352000-10

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

20

RYTON

-

-

-

Brass

FR4 Epoxy Glass

NOT SPECIFIED

-

-

-

2006

Correct-A-Chip® 352000

e3

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

-

-

-

-

1A

0.050 1.27mm

-

20

Tin-Lead

3.175mm

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

PLCC

DIP, 0.3 (7.62mm) Row Spacing

-

-

-

-

-

-

-

Non-RoHS Compliant

-

-

264-1300-29-0602J
264-1300-29-0602J

3M

In Stock

-

Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

64

Polysulfone (PSU), Glass Filled

-

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2011

Textool™

-

Active

1 (Unlimited)

Solder

-

64

150°C

-55°C

-

Female

-

1A

2.54mm

-

-

1A

0.070 1.78mm

-

64

Gold

-

-

-

-

0.130 3.30mm

0.070 1.78mm

DIP, 0.8 (20.32mm) Row Spacing

DIP, 0.8 (20.32mm) Row Spacing

Closed Frame

6.9mm

72.5mm

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

RoHS Compliant

UL94 V-0

Lead Free

264-4493-09-0602J
264-4493-09-0602J

3M

47
Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

64

Polysulfone (PSU), Glass Filled

-

Glass, Polysulfone

Beryllium Copper

Beryllium Copper

-

Gold

Copper

1kV

-55°C~125°C

2001

Textool™

-

Active

1 (Unlimited)

Solder

-

64

150°C

-55°C

-

Female

-

1A

2.54mm

Straight

6.9mm

1A

0.070 1.78mm

-

64

Gold

-

-

22.86 mm

-

0.130 3.30mm

0.070 1.78mm

DIP, 0.9 (22.86mm) Row Spacing

DIP, 0.9 (22.86mm) Row Spacing

-

-

100.3mm

43.2mm

30.0μin 0.76μm

300.0μin 7.62μm

UL94 V-0

RoHS Compliant

UL94 V-0

Lead Free

220-3342-09-0602J
220-3342-09-0602J

3M

10
Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

20

Polysulfone (PSU), Glass Filled

-

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2001

Textool™

-

Active

1 (Unlimited)

Solder

-

20

150°C

-55°C

-

Female

-

1A

2.54mm

-

-

1A

0.100 2.54mm

-

20

Gold

-

-

-

-

0.130 3.30mm

0.100 2.54mm

DIP, 0.3 (7.62mm) Row Spacing

DIP, 0.3 (7.62mm) Row Spacing

Closed Frame

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

RoHS Compliant

UL94 V-0

Lead Free

290-1294-09-0602J
290-1294-09-0602J

3M

In Stock

-

Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

90

Polysulfone (PSU), Glass Filled

680.388555g

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2011

Textool™

-

Active

1 (Unlimited)

Solder

-

90

150°C

-55°C

-

Female

-

1A

2.54mm

-

-

1A

0.070 1.78mm

-

90

Gold

-

1GOhm

-

-

0.130 3.30mm

0.070 1.78mm

DIP, 0.9 (22.86mm) Row Spacing

DIP, 0.9 (22.86mm) Row Spacing

Closed Frame

6.9mm

95.7mm

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

RoHS Compliant

UL94 V-0

Lead Free

240-1280-29-0602J
240-1280-29-0602J

3M

70
Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

40

Polysulfone (PSU), Glass Filled

-

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2001

Textool™

-

Active

1 (Unlimited)

Solder

-

40

150°C

-55°C

-

Female

-

1A

2.54mm

-

-

1A

0.100 2.54mm

-

40

Gold

-

-

-

-

0.130 3.30mm

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.6 (15.24mm) Row Spacing

Closed Frame

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

RoHS Compliant

UL94 V-0

Lead Free

214-3339-09-0602J
214-3339-09-0602J

3M

69
Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

14

Polysulfone (PSU), Glass Filled

-

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2001

Textool™

-

Active

1 (Unlimited)

Solder

-

14

150°C

-55°C

-

Female

-

1A

2.54mm

-

-

1A

0.100 2.54mm

-

14

Gold

-

-

-

-

0.130 3.30mm

0.100 2.54mm

DIP, 0.3 (7.62mm) Row Spacing

DIP, 0.3 (7.62mm) Row Spacing

-

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

RoHS Compliant

UL94 V-0

Lead Free

264-4493-19-0602J
264-4493-19-0602J

3M

47
Datasheet

8 Weeks

Gold

Through Hole, Wire

Through Hole

-

64

Polysulfone (PSU), Glass Filled

-

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2011

Textool™

-

Active

1 (Unlimited)

Wire Wrap

-

64

150°C

-55°C

-

-

-

1A

2.54mm

-

43.2mm

1A

0.100 2.54mm

-

64

Gold

-

1GOhm

-

-

0.620 15.75mm

0.100 2.54mm

DIP, 0.9 (22.86mm) Row Spacing

DIP, 0.9 (22.86mm) Row Spacing

-

-

100.3mm

6.9mm

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

RoHS Compliant

UL94 V-0

Lead Free

222-3343-09-0602J
222-3343-09-0602J

3M

50
Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

22

Polysulfone (PSU), Glass Filled

-

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2001

Textool™

-

Active

1 (Unlimited)

Solder

-

22

150°C

-55°C

-

Female

-

1A

2.54mm

-

-

-

0.100 2.54mm

-

22

Gold

-

-

-

-

0.130 3.30mm

0.100 2.54mm

DIP, 0.4 (10.16mm) Row Spacing

DIP, 0.4 (10.16mm) Row Spacing

-

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

RoHS Compliant

-

Lead Free

222-3343-19-0602J
222-3343-19-0602J

3M

In Stock

-

Datasheet

8 Weeks

Gold

Wire

Through Hole

-

22

Polysulfone (PSU), Glass Filled

453.59237g

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2011

Textool™

-

Active

1 (Unlimited)

Wire Wrap

-

22

150°C

-55°C

-

-

-

1A

2.54mm

-

-

-

0.100 2.54mm

-

22

Gold

-

-

-

-

0.620 15.75mm

0.100 2.54mm

DIP, 0.4 (10.16mm) Row Spacing

DIP, 0.4 (10.16mm) Row Spacing

Closed Frame

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

RoHS Compliant

-

Lead Free

290-1294-29-0602J
290-1294-29-0602J

3M

In Stock

-

Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

90

Polysulfone (PSU), Glass Filled

-

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2011

Textool™

-

Active

1 (Unlimited)

Solder

-

90

150°C

-55°C

-

Female

-

1A

2.54mm

-

-

1A

0.070 1.78mm

-

90

Gold

-

1GOhm

-

-

0.130 3.30mm

0.070 1.78mm

DIP, 0.9 (22.86mm) Row Spacing

DIP, 0.9 (22.86mm) Row Spacing

Closed Frame

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

RoHS Compliant

UL94 V-0

Lead Free

248-1282-19-0602J
248-1282-19-0602J

3M

In Stock

-

Datasheet

8 Weeks

Gold

Wire

Through Hole

-

48

Polysulfone (PSU), Glass Filled

-

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2011

Textool™

-

Active

1 (Unlimited)

Wire Wrap

-

48

150°C

-55°C

-

Female

-

1A

2.54mm

-

-

1A

0.100 2.54mm

-

48

Gold

-

-

-

-

0.620 15.75mm

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.6 (15.24mm) Row Spacing

Closed Frame

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

RoHS Compliant

UL94 V-0

Lead Free

248-1282-39-0602J
248-1282-39-0602J

3M

In Stock

-

Datasheet

8 Weeks

Gold

Wire

Through Hole

-

48

Polysulfone (PSU), Glass Filled

-

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2009

Textool™

-

Active

1 (Unlimited)

Wire Wrap

-

48

150°C

-55°C

-

Female

-

1A

2.54mm

-

-

1A

0.100 2.54mm

-

48

Gold

-

1GOhm

-

-

0.620 15.75mm

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.6 (15.24mm) Row Spacing

Closed Frame

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

RoHS Compliant

UL94 V-0

Lead Free

97-AQ132D
97-AQ132D

Aries Electronics

In Stock

-

Datasheet

5 Weeks

Tin

-

Through Hole

-

132

-

-

-

-

Brass

FR4 Epoxy Glass

Gold

-

-

-

2009

Correct-A-Chip® 97-AQ132D

e0

Active

1 (Unlimited)

Solder

EAR99

-

-

-

1

-

SOCKET ADAPTER

-

-

-

-

-

0.025 0.64mm

1.27mm

132

Tin-Lead

-

-

-

IC SOCKET

0.125 3.18mm

-

PQFP

PGA

-

1.58mm

34.3mm

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

Lead Free

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