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Categories

Sockets for ICs, Transistors - Adapters

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357 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Contact Plating

Mount

Mounting Type

Package / Case

Number of Pins

Housing Material

Weight

Contact Material - Mating

Contact Material - Post

Board Material

Contact Finish Mating

Contact Materials

Operating Temperature

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Termination

ECCN Code

Number of Positions

Max Operating Temperature

Min Operating Temperature

Number of Rows

Gender

Additional Feature

Current Rating (Amps)

Pitch

Current Rating

Pitch - Mating

Lead Pitch

Number of Contacts

Contact Finish - Post

Lead Length

Row Spacing

Device Socket Type

Termination Post Length

Pitch - Post

Convert From (Adapter End)

Convert To (Adapter End)

Features

Height

Length

Contact Finish Thickness - Mating

Contact Finish Thickness - Post

Material Flammability Rating

RoHS Status

Flammability Rating

Lead Free

48-655000-10
48-655000-10

Aries Electronics

In Stock

-

Datasheet

-

Silver

Through Hole

Through Hole

TSOP

48

-

-

Copper

Brass

FR4 Epoxy Glass

Silver

-

-

2006

Correct-A-Chip® 655000

-

-

Obsolete

1 (Unlimited)

Solder

-

48

-

-

-

-

-

-

-

-

0.020 0.50mm

-

-

Tin-Lead

3.175mm

-

-

0.125 3.18mm

0.100 2.54mm

TSOP

DIP, 0.6 (15.24mm) Row Spacing

-

-

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

-

In Stock

-

Datasheet

6 Weeks

Gold

Wire

Through Hole

-

42

Polysulfone (PSU), Glass Filled

453.59237g

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-55°C~125°C

2011

Textool™

-

-

Obsolete

1 (Unlimited)

Wire Wrap

-

42

150°C

-55°C

-

-

-

1A

2.54mm

1A

0.100 2.54mm

-

42

Gold

-

-

-

0.620 15.75mm

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.6 (15.24mm) Row Spacing

Closed Frame

6.9mm

68.1mm

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

RoHS Compliant

UL94 V-0

Lead Free

28-650000-11-RC-P
28-650000-11-RC-P

Aries Electronics

In Stock

-

Datasheet

5 Weeks

Gold

Through Hole

Through Hole

-

28

-

-

-

Brass

FR4 Epoxy Glass

Gold

-

-

2009

Correct-A-Chip® 650000

-

-

Active

1 (Unlimited)

Solder

-

-

-

-

-

-

-

-

-

-

0.050 1.27mm

-

-

Gold

3.175mm

-

-

0.125 3.18mm

0.100 2.54mm

SOIC

DIP, 0.6 (15.24mm) Row Spacing

-

-

-

-

10.0μin 0.25μm

-

ROHS3 Compliant

-

-

32-652000-10-P
32-652000-10-P

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

PLCC

32

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

2012

Correct-A-Chip® 652000

-

-

Active

1 (Unlimited)

Solder

-

-

-

-

-

-

-

1A

-

1A

0.050 1.27mm

-

-

Tin-Lead

3.175mm

-

-

0.125 3.18mm

0.100 2.54mm

PLCC

DIP, 0.6 (15.24mm) Row Spacing

-

-

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

Lead Free

28-652000-11-RC
28-652000-11-RC

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

28

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

2012

Correct-A-Chip® 652000

e4

yes

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

UL 94V-0

-

-

1A

0.050 1.27mm

-

28

Gold

3.175mm

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

PLCC

DIP, 0.6 (15.24mm) Row Spacing

-

-

-

-

10.0μin 0.25μm

-

ROHS3 Compliant

-

Lead Free

24-35W000-10
24-35W000-10

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

-

Through Hole

SOIC

24

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

2003

Correct-A-Chip® 35W000

e0

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

-

-

-

0.050 1.27mm

-

24

Tin-Lead

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

SOIC-W

DIP, 0.3 (7.62mm) Row Spacing

-

1.58mm

30.5mm

-

-

-

Non-RoHS Compliant

-

Lead Free

64-304121-00
64-304121-00

Aries Electronics

In Stock

-

Datasheet

-

-

-

Through Hole

-

64

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

2006

-

e0

-

Obsolete

Not Applicable

Solder

EAR99

-

-

-

-

-

SOCKET ADAPTER

-

-

-

0.031 0.80mm

-

64

Tin-Lead

-

-

IC SOCKET

0.090 2.29mm

0.031 0.80mm

TQFP

QFP

-

-

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

Lead Free

97-68340-P
97-68340-P

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

-

Through Hole

-

144

-

-

Copper

Brass

FR4 Epoxy Glass

Tin

-

105°C

2008

Correct-A-Chip® 68340

-

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

SOCKET ADAPTER

-

-

-

0.026 0.65mm

-

144

-

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

QFP

PGA

-

-

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

Lead Free

32-450001-10
32-450001-10

Aries Electronics

In Stock

-

Datasheet

5 Weeks

Tin

-

Through Hole

SOIC

32

-

-

-

-

FR4 Epoxy Glass

-

Brass

-

2006

Correct-A-Chip® 450001

e0

-

Active

1 (Unlimited)

Solder

EAR99

-

105°C

-55°C

2

-

SOCKET ADAPTER

-

-

-

0.050 1.27mm

-

32

-

-

10.16 mm

IC SOCKET

0.125 3.18mm

0.100 2.54mm

SOJ

DIP, 0.4 (10.16mm) Row Spacing

-

1.58mm

-

-

-

-

Non-RoHS Compliant

-

Contains Lead

181
Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

48

Polysulfone (PSU), Glass Filled

453.59237g

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-55°C~125°C

2011

Textool™

-

-

Active

1 (Unlimited)

Solder

-

48

150°C

-55°C

-

Female

-

1A

2.54mm

1A

0.100 2.54mm

-

48

Gold

-

-

-

0.130 3.30mm

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.6 (15.24mm) Row Spacing

Closed Frame

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

RoHS Compliant

UL94 V-0

Lead Free

08-350000-10-HT
08-350000-10-HT

Aries Electronics

In Stock

-

Datasheet

6 Weeks

-

-

Through Hole

-

8

POLYAMIDE

-

-

Brass

Polyimide (PI)

Tin

-

-

2006

Correct-A-Chip® 350000

e0

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

2

-

-

-

-

-

0.050 1.27mm

2.54mm

8

Tin-Lead

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

SOIC

DIP, 0.3 (7.62mm) Row Spacing

-

-

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

-

In Stock

-

Datasheet

5 Weeks

-

-

Through Hole

-

16

-

-

-

Brass

FR4 Epoxy Glass

Gold

-

-

-

Correct-A-Chip® 307349

-

-

Active

1 (Unlimited)

Solder

-

-

-

-

-

-

-

-

-

-

0.050 1.27mm

-

-

-

-

-

-

0.125 3.18mm

0.100 2.54mm

PLCC

DIP, 0.3 (7.62mm) Row Spacing

-

-

-

-

10.0μin 0.25μm

-

ROHS3 Compliant

-

-

28-350002-11-RC-P
28-350002-11-RC-P

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

SOIC

28

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

2013

Correct-A-Chip® 350000

-

-

Active

1 (Unlimited)

Solder

-

-

-

-

-

-

-

-

-

-

0.050 1.27mm

-

-

Gold

3.175mm

-

-

0.125 3.18mm

0.100 2.54mm

SOIC

DIP, 0.3 (7.62mm) Row Spacing

-

-

-

-

10.0μin 0.25μm

-

ROHS3 Compliant

-

-

68-505-110-RC-P
68-505-110-RC-P

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

PLCC

68

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

2013

Correct-A-Chip® 505

-

-

Active

1 (Unlimited)

Solder

-

-

-

-

-

-

-

-

-

-

0.050 1.27mm

-

-

Tin-Lead

3.81mm

-

-

0.150 3.81mm

0.050 1.27mm

PLCC

PGA

-

-

-

-

200.0μin 5.08μm

-

ROHS3 Compliant

-

-

84-505-110-P
84-505-110-P

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

84

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

2013

Correct-A-Chip® 505

e0

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

-

-

-

0.050 1.27mm

-

84

Tin-Lead

3.81mm

-

IC SOCKET

0.150 3.81mm

0.050 1.27mm

PLCC

PGA

-

-

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

-

In Stock

-

Datasheet

-

-

-

Through Hole

-

16

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

Correct-A-Chip® 35W000

-

-

Active

1 (Unlimited)

Solder

-

-

-

-

-

-

-

-

-

-

0.050 1.27mm

-

-

Gold

-

-

-

0.125 3.18mm

0.100 2.54mm

SOIC-W

DIP, 0.3 (7.62mm) Row Spacing

-

-

-

-

10.0μin 0.25μm

-

ROHS3 Compliant

-

-

14-35W000-11-RC
14-35W000-11-RC

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

SOIC

14

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

2012

Correct-A-Chip® 35W000

e4

yes

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

SOCKET ADAPTER

-

-

-

0.050 1.27mm

-

14

Gold

3.175mm

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

SOIC-W

DIP, 0.3 (7.62mm) Row Spacing

-

-

-

-

10.0μin 0.25μm

-

ROHS3 Compliant

-

-

14-354000-21-RC
14-354000-21-RC

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Surface Mount

Surface Mount

-

14

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Beryllium Copper

Brass

-

Gold

-

-

2009

Correct-A-Chip® 354000

e4

yes

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

STANDARD: UL 94V-0

-

-

3A

0.100 2.54mm

-

14

-

2.286mm

-

IC SOCKET

0.089 2.28mm

0.050 1.27mm

DIP, 0.3 (7.62mm) Row Spacing

SOIC

-

-

-

10.0μin 0.25μm

10.0μin 0.25μm

UL94 V-0

ROHS3 Compliant

UL94 V-0

-

24-650000-10-P
24-650000-10-P

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

SOIC

24

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

2010

Correct-A-Chip® 650000

-

-

Active

1 (Unlimited)

Solder

-

-

-

-

-

-

-

-

-

-

0.050 1.27mm

-

-

Tin-Lead

3.175mm

-

-

0.125 3.18mm

0.100 2.54mm

SOIC

DIP, 0.6 (15.24mm) Row Spacing

-

-

-

-

-

-

Non-RoHS Compliant

-

-

95-132I25-P
95-132I25-P

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

132

-

-

Copper

Brass

FR4 Epoxy Glass

Tin

-

-

2009

Correct-A-Chip® 95-132I25

e3

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

SOCKET ADAPTER

-

-

-

0.025 0.64mm

-

132

Tin-Lead

3.175mm

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

QFP

PGA

-

-

-

-

200.0μin 5.08μm

-

Non-RoHS Compliant

-

-