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Categories

Sockets for ICs, Transistors - Adapters

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357 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Contact Plating

Mount

Mounting Type

Package / Case

Number of Pins

Housing Material

Body Material

Contact Material - Mating

Contact Material - Post

Board Material

Contact Finish Mating

Contact Materials

Voltage Rated

Operating Temperature

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Termination

ECCN Code

Connector Type

Number of Positions

Max Operating Temperature

Min Operating Temperature

Number of Rows

Gender

Additional Feature

Current Rating (Amps)

Pitch

Orientation

Depth

Current Rating

Pitch - Mating

Lead Pitch

Number of Contacts

Contact Finish - Post

PCB Contact Pattern

Body Breadth

Lead Length

Body Depth

Contact Style

Row Spacing

PCB Contact Row Spacing

Device Socket Type

Termination Post Length

Pitch - Post

Convert From (Adapter End)

Convert To (Adapter End)

Features

Height

Length

Width

Contact Finish Thickness - Mating

Contact Finish Thickness - Post

Material Flammability Rating

REACH SVHC

RoHS Status

Flammability Rating

Lead Free

1107254-20
1107254-20

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

20

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Beryllium Copper

Brass

-

Gold

-

-

-

2006

Correct-A-Chip® 1107254

e3

yes

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

2

-

SOCKET ADAPTER

-

-

-

-

3A

0.100 2.54mm

2.54mm

20

Tin

RECTANGULAR

0.7 inch

3.302mm

0.3 inch

RND PIN-SKT

-

0.3 mm

IC SOCKET

0.130 3.30mm

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.3 (7.62mm) Row Spacing

-

-

-

-

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

-

ROHS3 Compliant

UL94 V-0

-

20-666000-00
20-666000-00

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Surface Mount

Surface Mount

-

20

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

2006

Correct-A-Chip® 666000

e0

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

UL 94V-0

-

-

-

-

-

0.050 1.27mm

-

20

Tin-Lead

-

-

2.032mm

-

-

-

-

IC SOCKET

0.080 2.03mm

0.050 1.27mm

SOIC

SOWIC

-

-

-

-

-

200.0μin 5.08μm

-

-

Non-RoHS Compliant

-

-

10-666000-00
10-666000-00

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Surface Mount

Surface Mount

-

10

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

2006

Correct-A-Chip® 666000

e0

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

UL 94V-0

-

-

-

-

-

0.050 1.27mm

-

10

Tin-Lead

-

-

2.032mm

-

-

-

-

IC SOCKET

0.080 2.03mm

0.050 1.27mm

SOIC

SOWIC

-

-

-

-

-

200.0μin 5.08μm

-

-

Non-RoHS Compliant

-

-

22-304504-18
22-304504-18

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

22

-

-

-

Brass

FR4 Epoxy Glass

-

-

-

-

2009

Correct-A-Chip® 304504

e0

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

SOCKET ADAPTER

-

-

-

-

-

0.050 1.27mm

-

22

Tin-Lead

-

-

3.175mm

-

-

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

SOIC

DIP, 0.4 (10.16mm) Row Spacing

-

-

-

-

-

200.0μin 5.08μm

-

-

Non-RoHS Compliant

-

Lead Free

14-350000-10-HT
14-350000-10-HT

Aries Electronics

In Stock

-

Datasheet

6 Weeks

-

Through Hole

Through Hole

-

14

POLYAMIDE

-

-

Brass

Polyimide (PI)

Tin

-

-

-

2005

Correct-A-Chip® 350000

-

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

SOCKET ADAPTER

-

-

-

-

-

0.050 1.27mm

-

14

Tin-Lead

-

-

3.175mm

-

-

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

SOIC

DIP, 0.3 (7.62mm) Row Spacing

High Temperature

-

-

-

-

200.0μin 5.08μm

-

-

Non-RoHS Compliant

-

-

1106396-20
1106396-20

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

20

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Beryllium Copper

Brass

-

Gold

-

-

-

2007

Correct-A-Chip® 1106396

e3

yes

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

2

-

SOCKET ADAPTER

-

-

-

-

3A

0.100 2.54mm

2.54mm

20

Tin

RECTANGULAR

-

3.302mm

-

RND PIN-SKT

-

0.6 mm

IC SOCKET

0.130 3.30mm

0.100 2.54mm

DIP, 0.3 (7.62mm) Row Spacing

DIP, 0.6 (15.24mm) Row Spacing

-

-

-

-

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

-

ROHS3 Compliant

UL94 V-0

-

1107254-18
1107254-18

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

18

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Beryllium Copper

Brass

-

Gold

-

-

-

2006

Correct-A-Chip® 1107254

e3

yes

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

2

-

SOCKET ADAPTER

-

-

-

-

3A

0.100 2.54mm

2.54mm

18

Tin

RECTANGULAR

0.7 inch

3.302mm

0.3 inch

RND PIN-SKT

-

0.3 mm

IC SOCKET

0.130 3.30mm

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.3 (7.62mm) Row Spacing

-

-

-

-

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

-

ROHS3 Compliant

UL94 V-0

-

14-354000-20
14-354000-20

Aries Electronics

In Stock

-

Datasheet

5 Weeks

Gold, Tin

Surface Mount

Surface Mount

-

14

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Beryllium Copper

Brass

-

Gold

-

-

-

2006

Correct-A-Chip® 354000

e3

-

Active

1 (Unlimited)

Solder

EAR99

-

-

105°C

-55°C

2

-

STANDARD: UL 94V-0

-

-

-

-

3A

0.100 2.54mm

-

14

-

-

-

-

-

-

7.62 mm

-

IC SOCKET

-

0.050 1.27mm

DIP, 0.3 (7.62mm) Row Spacing

SOIC

-

-

-

-

10.0μin 0.25μm

10.0μin 0.25μm

UL94 V-0

-

ROHS3 Compliant

UL94 V-0

-

1107254-08
1107254-08

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

-

8

Polyamide (PA46), Nylon 4/6, Glass Filled

-

Beryllium Copper

Brass

-

Gold

-

-

-

2006

Correct-A-Chip® 1107254

e0

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

2

-

SOCKET ADAPTER, UL 94V-0

-

-

-

-

3A

0.100 2.54mm

2.54mm

8

Tin

-

-

3.302mm

-

-

-

-

IC SOCKET

0.130 3.30mm

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.3 (7.62mm) Row Spacing

-

-

-

-

30.0μin 0.76μm

200.0μin 5.08μm

UL94 V-0

-

ROHS3 Compliant

UL94 V-0

-

14-35W000-10
14-35W000-10

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

-

Through Hole

SOIC

14

-

-

-

Brass

FR4 Epoxy Glass

NOT SPECIFIED

-

-

-

2003

Correct-A-Chip® 35W000

-

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

-

-

-

-

-

-

0.050 1.27mm

-

14

Tin-Lead

-

-

-

-

-

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

SOIC-W

DIP, 0.3 (7.62mm) Row Spacing

-

1.58mm

17.8mm

-

-

-

-

-

Non-RoHS Compliant

-

Lead Free

96-208M50
96-208M50

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

-

Through Hole

-

208

-

-

Copper

Brass

FR4 Epoxy Glass

Tin

-

-

-

2006

Correct-A-Chip® 96-208M50

-

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

SOCKET ADAPTER

-

-

-

-

-

0.020 0.50mm

-

208

Tin-Lead

-

-

-

-

-

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

QFP

PGA

-

1.58mm

43.2mm

-

-

200.0μin 5.08μm

-

-

Non-RoHS Compliant

-

Contains Lead

47
Datasheet

8 Weeks

Gold

Wire

Through Hole

-

28

Polysulfone (PSU), Glass Filled

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2001

Textool™

-

-

Active

1 (Unlimited)

Solder

-

-

28

150°C

-55°C

-

Female

-

1A

2.54mm

-

-

1A

0.100 2.54mm

-

28

Gold

-

-

-

-

-

-

-

-

-

0.100 2.54mm

DIP, 0.6 (15.24mm) Row Spacing

DIP, 0.6 (15.24mm) Row Spacing

-

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

-

RoHS Compliant

UL94 V-0

Lead Free

In Stock

-

Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

64

Polysulfone (PSU), Glass Filled

Glass, Polysulfone

Beryllium Copper

Beryllium Copper

-

Gold

Copper

1kV

-55°C~125°C

2001

Textool™

-

-

Active

1 (Unlimited)

Solder

-

-

64

150°C

-55°C

-

Female

-

1A

1.78mm

Straight

6.9mm

1A

0.070 1.78mm

-

64

Gold

-

-

-

-

-

20.32 mm

-

-

0.130 3.30mm

0.070 1.78mm

DIP, 0.8 (20.32mm) Row Spacing

DIP, 0.8 (20.32mm) Row Spacing

Closed Frame

-

72.5mm

38.5mm

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

-

RoHS Compliant

UL94 V-0

Lead Free

47
Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

16

Polysulfone (PSU), Glass Filled

-

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2001

Textool™

-

-

Active

1 (Unlimited)

Solder

-

DIP, Socket

16

150°C

-55°C

-

Female

-

1A

2.54mm

-

-

1A

0.100 2.54mm

-

16

Gold

-

-

-

-

-

7.62 mm

-

-

0.130 3.30mm

0.100 2.54mm

DIP, 0.3 (7.62mm) Row Spacing

DIP, 0.3 (7.62mm) Row Spacing

Closed Frame

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

-

RoHS Compliant

UL94 V-0

Lead Free

36-651000-10
36-651000-10

Aries Electronics

In Stock

-

Datasheet

6 Weeks

-

-

Through Hole

-

36

-

-

Copper

Brass

FR4 Epoxy Glass

Tin

-

-

105°C

2012

Correct-A-Chip® 651000

e3

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

SOCKET ADAPTER

-

-

-

-

-

0.026 0.65mm

-

36

Tin-Lead

-

-

-

-

-

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

SSOP

DIP, 0.6 (15.24mm) Row Spacing

-

-

-

-

-

200.0μin 5.08μm

-

-

Non-RoHS Compliant

-

-

47
Datasheet

8 Weeks

Gold

Through Hole

Through Hole

-

40

Polysulfone (PSU), Glass Filled

Glass, Polysulfone

Beryllium Copper

Beryllium Copper

-

Gold

Copper

-

-55°C~125°C

2001

Textool™

-

-

Active

1 (Unlimited)

Solder

-

-

40

150°C

-55°C

-

Female

-

1A

2.54mm

Straight

-

1A

0.100 2.54mm

-

40

Gold

-

-

-

-

-

25.4 mm

-

-

0.130 3.30mm

0.100 2.54mm

DIP, 1.0 (25.40mm) Row Spacing

DIP, 1.0 (25.40mm) Row Spacing

Closed Frame

-

-

-

30.0μin 0.76μm

30.0μin 0.76μm

UL94 V-0

-

RoHS Compliant

UL94 V-0

Lead Free

18-35W000-10
18-35W000-10

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

-

Through Hole

-

18

-

-

-

Brass

FR4 Epoxy Glass

NOT SPECIFIED

-

-

-

2003

Correct-A-Chip® 35W000

-

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

-

-

-

-

-

-

0.050 1.27mm

-

18

Tin-Lead

-

-

-

-

-

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

SOIC-W

DIP, 0.3 (7.62mm) Row Spacing

-

1.58mm

22.9mm

-

-

-

-

-

Non-RoHS Compliant

-

Lead Free

LCQT-QFP0.5-52
LCQT-QFP0.5-52

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

Through Hole

Through Hole

QFP

52

Polyester

-

-

Brass

FR4 Epoxy Glass

-

-

-

-55°C~125°C

-

Correct-A-Chip®

-

-

Active

1 (Unlimited)

Solder

-

-

-

125°C

-55°C

-

-

-

-

-

-

-

-

0.020 0.50mm

-

-

Gold

-

-

5.9944mm

-

-

-

-

-

0.236 6.00mm

0.100 2.54mm

Multiple Packages

QFP

-

-

-

-

-

Flash

UL94 V-0

No SVHC

ROHS3 Compliant

UL94 V-0

Lead Free

32-655000-10
32-655000-10

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

-

Through Hole

-

32

-

-

Copper

Brass

FR4 Epoxy Glass

Silver

-

-

-

2006

Correct-A-Chip® 655000

e3

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

SOCKET ADAPTER

-

-

-

-

-

0.020 0.50mm

-

32

Tin-Lead

-

-

-

-

-

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

TSOP

DIP, 0.6 (15.24mm) Row Spacing

-

1.58mm

40.6mm

-

-

200.0μin 5.08μm

-

-

Non-RoHS Compliant

-

Lead Free

28-450001-10
28-450001-10

Aries Electronics

In Stock

-

Datasheet

5 Weeks

-

-

Through Hole

-

28

-

-

-

-

FR4 Epoxy Glass

TIN LEAD

-

-

-

2006

Correct-A-Chip® 450001

e0

-

Active

1 (Unlimited)

Solder

EAR99

-

-

-

-

-

-

SOCKET ADAPTER

-

-

-

-

-

0.050 1.27mm

-

28

-

-

-

-

-

-

-

-

IC SOCKET

0.125 3.18mm

0.100 2.54mm

SOJ

DIP, 0.4 (10.16mm) Row Spacing

-

1.58mm

35.6mm

-

-

-

-

-

Non-RoHS Compliant

-

Lead Free