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Thermal - Heat Sinks

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10000 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Material

Weight

Shape

Package Cooled

Material Finish

Base Product Number

Designed for

Factory Pack QuantityFactory Pack Quantity

Fin Style

For Use With

Heatsink Material

Mfr

Mounting Styles

Package

Part # Aliases

Product Status

RoHS

Tradename

Unit Weight

Operating Temperature

Series

Type

Color

Voltage

Attachment Method

Thermal Resistance @ Forced Air Flow

Platform

Dimensions - Overall

Thermal Resistance @ Natural

Power Dissipation @ Temperature Rise

Product

Connection Type

Features

Wick Type

Working Fluid

Power - Cooling

Power Input

Flow Rate

Fluid Capacity

Thermal Resistance @ GPM

Thermal Resistance

Minimum Bend Radius

Diameter

Height

Length

Width

Ratings

127787
127787

Wakefield-Vette

In Stock

-

-

Aluminum

-

Rectangular, Fins

-

-

-

-

25

-

-

-

Wakefield-Vette

-

Box

-

Active

Details

-

1.056 lbs

-

1277

Top Mount, Extrusion

-

-

Adhesive

-

-

-

1.16°C/W

-

Extrusions

-

-

-

-

-

-

-

-

-

-

-

-

-

3 ft

1.625 (41.28mm)

-

127783
127783

Wakefield-Vette

In Stock

-

-

Aluminum

-

Rectangular, Fins

-

-

-

-

25

-

-

-

Wakefield-Vette

-

Box

-

Active

Details

-

1.056 lbs

-

1277

H Style

-

-

Bolt On

-

-

-

0.58°C/W

-

Extrusions

-

-

-

-

-

-

-

-

-

-

-

-

-

3 ft

4.000 (101.60mm)

-

In Stock

-

-

Copper

-

Round

-

-

HP-CWS

-

5000

Pipe

-

Copper

Aavid, Thermal Division of Boyd Corporation

-

Bulk

678680

Active

Details

-

-

-55°C ~ 180°C

HP-CWS

Copper-Water Heat Pipes

-

-

Epoxy or Solder

-

-

-

-

-

Heatpipes

-

-

Sintered

-

99.0W @ 200mm

-

-

-

-

-

-

8 mm

-

200 mm

-

-

In Stock

-

-

Copper

-

Round

-

-

HP-CWS

-

250

Pipe

-

Copper

Aavid, Thermal Division of Boyd Corporation

-

Bulk

651275 682446

Active

Details

-

-

-55°C ~ 180°C

HP-CWS

Copper-Water Heat Pipes

-

-

Epoxy or Solder

-

-

-

-

-

Heatpipes

-

-

Sintered

-

199.0W @ 100mm

-

-

-

-

-

-

8 mm

-

100 mm

-

-

In Stock

-

-

Copper

-

Round

-

-

HP-CWS

-

5000

-

-

-

Aavid, Thermal Division of Boyd Corporation

-

Bulk

678657

Active

Details

-

-

-55°C ~ 180°C

HP-CWS

Copper-Water Heat Pipes

-

-

Epoxy or Solder

-

-

-

-

-

Heatpipes

-

-

Sintered

-

35.0W @ 75mm

-

-

-

-

-

-

0.118 (3.00mm) OD

-

75 mm

-

-

In Stock

-

-

-

-

-

-

-

-

-

1

-

-

-

Sunon Fans

-

Box

-

Active

Details

-

6.349313 oz

-

CM036

Thermal Module

-

-

Bolt On

-

-

5.25 L x 2.25 W x 0.61 H (133.4mm x 57.2mm x 15.6mm)

-

-

Liquid Cold Plates

-

-

-

-

500 W

-

-

-

-

-

-

-

15.6 mm

133.4 mm

57.2 mm

-

FHS-A090025S43
FHS-A090025S43

Delta Electronics

In Stock

-

-

-

-

-

-

-

-

DHA-B Standard Cooler

60

-

-

-

-

-

-

-

-

Details

-

24 lbs

-

FHS

-

-

-

-

-

-

-

-

-

Heatsinks

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

HSS15-B20-P40
HSS15-B20-P40

CUI Devices

In Stock

-

-

Aluminum Alloy

-

Rectangular

TO-220

Black Anodized

-

TO-220

5040

Formed Fin

-

Aluminum Alloy

CUI Devices

PCB Mount

Box

-

Active

-

-

-

-

HSS

Board Level, Vertical

Black

-

Bolt On and PC Pin

8.50°C/W @ 200 LFM

-

-

15.16°C/W

5.0W @ 75°C

Heatsinks

-

-

-

-

-

-

-

-

-

18.6 C/W

-

-

12.7 mm

28.1 mm

23.4 mm

-

HSB14-353518
HSB14-353518

CUI Devices

In Stock

-

-

Aluminum Alloy

-

Square, Pin Fins

BGA

Black Anodized

-

BGA

1280

Vertical Fin

-

Aluminum Alloy

CUI Devices

Adhesive

Box

-

Active

-

-

-

-

HSB

Top Mount

Black

-

Adhesive

3.60°C/W @ 200 LFM

-

-

8.97°C/W

8.4W @ 75°C

Heatsinks

-

-

-

-

-

-

-

-

-

12.7 C/W

-

-

18 mm

35 mm

35 mm

-

THS-BD7-BTL
THS-BD7-BTL

ADLINK Technology

In Stock

-

-

-

-

-

-

-

-

Express-BD7

1

-

Express-BD7 COM Express Basic Size Type 7 Module

-

-

Through Hole

-

-

-

Details

COM Express

-

-

Express-BD7

Top Mount

-

-

-

-

-

-

-

-

Heatsinks

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

HSS20-B20-NP
HSS20-B20-NP

CUI Devices

In Stock

-

-

Aluminum Alloy

-

Rectangular, Fins

TO-218, TO-220

Black Anodized

-

TO-220

-

Twisted Fin

-

Aluminum

CUI Devices

PCB

Bag

-

Active

Details

-

-

-

HSS

Top Mount

Black

-

Bolt On

11.20°C/W @ 200 LFM

-

-

26.40°C/W

2.84W @ 75°C

Heatsinks

-

-

-

-

-

-

-

-

-

31.2 C/W

-

-

19 mm

22 mm

19 mm

-

HSE05-171933
HSE05-171933

CUI Devices

In Stock

-

-

Aluminum Alloy

-

Rectangular, Angled Fins

TO-218, TO-220

Black Anodized

-

TO-220, TO-218

-

Angled Fin

-

Aluminum

CUI Devices

PCB

Box

-

Active

Details

-

-

-

HSE

Board Level

Black

-

PC Pin

6.90°C/W @ 200 LFM

-

-

18.83°C/W

3.98W @ 75°C

Heatsinks

-

-

-

-

-

-

-

-

-

22.6 C/W

-

-

32.5 mm

19.4 mm

17 mm

-

HSB26-343408
HSB26-343408

CUI Devices

In Stock

-

-

Aluminum Alloy

-

Square, Pin Fins

BGA

Black Anodized

-

BGA

-

Vertical Fin

-

Aluminum

CUI Devices

Adhesive

Box

-

Active

Details

-

-

-

HSB

BGA Heatsink

Black

-

Adhesive

5.30°C/W @ 200 LFM

-

-

15.19°C/W

4.94W @ 75°C

Heatsinks

-

-

-

-

-

-

-

-

-

17.9 C/W

-

-

8 mm

33.5 mm

33.5 mm

-

HSE07-753045
HSE07-753045

CUI Devices

In Stock

-

-

Aluminum Alloy

-

Rectangular, Fins

TO-218, TO-220

Black Anodized

-

TO-220, TO-218

-

Extruded Radial Fin

-

Aluminum

CUI Devices

PCB

Bag

-

Active

Details

-

-

-

HSE

Extruded Heatsink

Black

-

Clip

2.10°C/W @ 200 LFM

-

-

4.85°C/W

15.46W @ 75°C

Heatsinks

-

-

-

-

-

-

-

-

-

5.5 C/W

-

-

45 mm

70 mm

30 mm

-

HSB25-282810
HSB25-282810

CUI Devices

In Stock

-

-

Aluminum Alloy

-

Square, Pin Fins

BGA

Black Anodized

-

BGA

-

Vertical Fin

-

Aluminum

CUI Devices

Adhesive

Box

-

Active

Details

-

-

-

HSB

BGA Heatsink

Black

-

Push Pin

5.10°C/W @ 200 LFM

-

-

15.41°C/W

4.87W @ 75°C

Heatsinks

-

-

-

-

-

-

-

-

-

18.2 C/W

-

-

10 mm

28.5 mm

28.5 mm

-

HSB24-252510
HSB24-252510

CUI Devices

In Stock

-

-

Aluminum Alloy

-

Square, Pin Fins

BGA

Black Anodized

-

BGA

-

Vertical Fin

-

Aluminum

CUI Devices

Adhesive

Box

-

Active

Details

-

-

-

HSB

BGA Heatsink

Black

-

Adhesive

6.50°C/W @ 200 LFM

-

-

18.10°C/W

4.14W @ 75°C

Heatsinks

-

-

-

-

-

-

-

-

-

21.3 C/W

-

-

10 mm

25 mm

25 mm

-

In Stock

-

-

-

-

-

-

-

-

-

1000

-

-

-

-

-

-

0S516-20-B-ML516-STD 405071

-

Details

Max Clip

-

-

Extrusions - Max Clip

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

HSB23-232325
HSB23-232325

CUI Devices

In Stock

-

-

Aluminum Alloy

-

Square, Pin Fins

BGA

Black Anodized

-

BGA

-

Vertical Fin

-

Aluminum

CUI Devices

Adhesive

Box

-

Active

Details

-

-

-

HSB

BGA Heatsink

Black

-

Adhesive

3.80°C/W @ 200 LFM

-

-

12.23°C/W

6.13W @ 75°C

Heatsinks

-

-

-

-

-

-

-

-

-

16.1 C/W

-

-

25 mm

23 mm

23 mm

-

HSS28-B20-P39
HSS28-B20-P39

CUI Devices

In Stock

-

-

Aluminum Alloy

-

Square, Fins

TO-218, TO-220

Black Anodized

-

TO-220

-

Straight Fin

-

Aluminum

CUI Devices

PCB

Bag

-

Active

Details

-

-

-

HSS

Stamped Heatsink

Black

-

Bolt On and PC Pin

12.00°C/W @ 200 LFM

-

-

27.66°C/W

2.71W @ 75°C

Heatsinks

-

-

-

-

-

-

-

-

-

32.7 C/W

-

-

9.5 mm

19 mm

19 mm

-

HSE12-B20-NP
HSE12-B20-NP

CUI Devices

In Stock

-

-

Aluminum Alloy

-

Rectangular

TO-218, TO-220

Black Anodized

-

TO-220, TO-218

-

Formed Fin

-

Aluminum

CUI Devices

PCB

Bag

-

Active

Details

-

-

-

HSE

Extruded Heatsink

Black

-

Bolt On

19.20°C/W @ 200 LFM

-

-

38.75°C/W

1.94W @ 75°C

Heatsinks

-

-

-

-

-

-

-

-

-

41.6 C/W

-

-

4.5 mm

25 mm

12 mm

-