- Manufacturer
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- Package / Case
- Number of I/Os
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- Core Processor
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- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Connectivity | Architecture | Data Bus Width | Core Architecture | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Bus Compatibility | UV Erasable | Height Seated (Max) | Length | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 BCM3379KPBG Broadcom Limited | In Stock | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Obsolete | 1 (Unlimited) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | RoHS Compliant | ||
 XC7Z020-1CLG400I Xilinx Inc. | 5235 | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 400-LFBGA, CSPBGA | YES | 400 | - | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | 30 | XC7Z020 | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | No | ROHS3 Compliant | ||
XC7Z010-1CLG400I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 400-LFBGA, CSPBGA | YES | 400 | - | 130 | -40°C~100°C TJ | Tray | 2008 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | 30 | XC7Z010 | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | No | ROHS3 Compliant | ||
XC7Z020-1CLG400C Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 400-LFBGA, CSPBGA | YES | 400 | - | 130 | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | - | XC7Z020 | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | No | ROHS3 Compliant | ||
 XC7Z045-2FFG900I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 900-BBGA, FCBGA | YES | - | ROMless | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | - | S-PBGA-B900 | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | - | 3.35mm | 31mm | No | ROHS3 Compliant | ||
 XC7Z030-2FFG676I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 676-BBGA, FCBGA | YES | 676 | - | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z030 | 676 | - | - | 1V | 1.05V | 11.8V | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 3.24mm | 27mm | No | ROHS3 Compliant | ||
XC7Z010-1CLG400C Xilinx Inc. | 6665 | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 400-LFBGA, CSPBGA | YES | 400 | - | 130 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | - | XC7Z010 | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | No | ROHS3 Compliant | ||
 XC7Z020-1CLG484I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 484-LFBGA, CSPBGA | YES | 484 | - | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | yes | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | - | XC7Z020 | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 19mm | No | ROHS3 Compliant | ||
 XC7Z030-2FBG484I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 484-BBGA, FCBGA | YES | 484 | - | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 800MHz | 30 | XC7Z030 | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.54mm | 23mm | No | ROHS3 Compliant | ||
XCZU19EG-2FFVC1760I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | 1760-BBGA, FCBGA | - | - | - | 512 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
XC7Z100-2FFG900I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 900-BBGA, FCBGA | - | 900 | - | 212 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z100 | - | - | - | - | 1.05V | - | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | - | 256000 | Kintex™-7 FPGA, 444K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | - | 3.35mm | 31mm | No | ROHS3 Compliant | ||
XC7Z030-2FBG676I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 676-BBGA, FCBGA | YES | 676 | - | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z030 | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.54mm | 27mm | No | ROHS3 Compliant | ||
XC7Z015-1CLG485C Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 484-LFBGA, CSPBGA | YES | 485 | - | 130 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 667MHz | NOT SPECIFIED | - | - | - | Not Qualified | - | - | - | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 1 | 256000 | Artix™-7 FPGA, 74K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | - | - | - | ROHS3 Compliant | ||
XC7Z030-1FBG676I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 676-BBGA, FCBGA | YES | 676 | - | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z030 | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.54mm | 27mm | No | ROHS3 Compliant | ||
XC7Z020-2CLG400E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 400-LFBGA, CSPBGA | YES | 400 | - | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 766MHz | 30 | XC7Z020 | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | No | ROHS3 Compliant | ||
XC7Z020-2CLG484I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 484-LFBGA, CSPBGA | YES | 484 | - | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 766MHz | - | XC7Z020 | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 19mm | No | ROHS3 Compliant | ||
 XC7Z010-1CLG225I Xilinx Inc. | 151 | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 225-LFBGA, CSPBGA | YES | 225 | - | 86 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | 30 | XC7Z010 | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.5mm | 13mm | No | ROHS3 Compliant | ||
XC7Z020-1CLG484C Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 484-LFBGA, CSPBGA | YES | 2 | - | 130 | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | 30 | XC7Z020 | - | S-PBGA-B484 | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3.3V | 1.2V | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | - | Artix™-7 FPGA, 85K Logic Cells | - | - | 1.6mm | 19mm | No | ROHS3 Compliant | ||
XC7Z030-1FFG676I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 676-BBGA, FCBGA | YES | 676 | - | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z030 | 676 | - | - | 1V | 1.05V | 11.8V | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 3.24mm | 27mm | No | ROHS3 Compliant | ||
 XC7Z030-2SBG485I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 484-FBGA, FCBGA | - | 485 | - | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 800MHz | NOT SPECIFIED | - | - | - | Not Qualified | - | 1.05V | 11.8V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | - | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 2.44mm | 19mm | - | ROHS3 Compliant |