- Manufacturer
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Size | Propagation Delay | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Core Architecture | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Bus Compatibility | Flash Size | UV Erasable | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S005S-1FGG484T2 Microchip Technology | In Stock | - | - | - | - | - | - | BGA-484 | - | - | 484-FPBGA (23x23) | - | M2S005 | 64 kB | 191 kbit | 60 | MICROSEMI CORP | - | - | M2S005S-1FGG484T2 | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | - | SMD/SMT | 209 I/O | 505 LAB | 6060 LE | - | Tray | - | - | , | - | - | - | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | - | - | 0 to 85 °C | Tray | - | SmartFusion2 | e1 | Yes | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | - | 250 | - | - | compliant | - | - | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR | - | 128 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | 1 | - | FPGA - 5K Logic Modules | - | - | 1 Core | - | 128KB | - | - | - | - | - | ||
M2S025-VFG400I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | - | VFPBGA-400 | - | - | - | - | - | 64 kB | - | 90 | - | - | - | - | 166 MHz | - | - | - | Yes | - | SMD/SMT | - | 2308 LAB | 27696 LE | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | - | - | - | - | - | 0.227784 oz | - | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 256 kB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | ||
 XCZU3CG-1SFVC784E Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU3EG-2SFVC784I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 784-BFBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | 784 | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.85V | - | - | - | NOT SPECIFIED | - | R-PBGA-B784 | - | - | - | 0.876V | - | - | 0.825V | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XA7Z020-1CLG400I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | 400-LFBGA, CSPBGA | - | 400 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Automotive grade | -40°C~100°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | - | Active | 4 (72 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | 667MHz | NOT SPECIFIED | - | - | - | Not Qualified | 1V | - | 11.8V | - | - | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | - | - | - | Artix™-7 FPGA, 85K Logic Cells | - | - | - | - | - | N | 1.6mm | 17mm | - | ROHS3 Compliant | ||
M2S025T-1FGG484I Microchip Technology | In Stock | - | - | - | - | - | - | FPBGA-484 | - | - | 484-FPBGA (23x23) | - | M2S025 | 64 kB | - | 60 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 267 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | - | - | -40 to 100 °C | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | 1 | - | FPGA - 25K Logic Modules | - | - | 1 Core | - | 256KB | - | - | - | - | - | ||
M2S010-1VFG400 Microchip Technology | In Stock | - | - | - | - | - | - | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | 400 | M2S010 | 64 kB | - | 90 | MICROSEMI CORP | - | - | M2S010-1VFG400 | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | 195 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | - | SmartFusion2 | e1 | - | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | - | 0.8 mm | compliant | - | - | - | S-PBGA-B400 | 195 | Not Qualified | - | - | 1.2 V | OTHER | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 10K Logic Modules | - | 12084 | 1 Core | - | 256KB | - | - | 17 mm | 17 mm | - | ||
 5CSTFD6D5F31I7N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | 896-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 288 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V ST | e1 | - | Active | 3 (168 Hours) | 896 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | - | - | NOT SPECIFIED | 5CSTFD6 | S-PBGA-B896 | 288 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | - | - | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 288 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 110K Logic Elements | - | 110000 | - | - | - | - | 2mm | 31mm | 31mm | RoHS Compliant | ||
XCZU4CG-1FBVB900E Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XC7Z020-L1CLG484I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | 484-LFBGA, CSPBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | 667MHz | NOT SPECIFIED | - | S-PBGA-B484 | - | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | 130 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | ARM | YES | - | 256000 | Artix™-7 FPGA, 85K Logic Cells | 106400 | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | 1.6mm | 19mm | 19mm | ROHS3 Compliant | ||
M2S050-1VFG400I Microchip Technology | In Stock | - | - | - | - | - | - | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | 400 | M2S050 | 64 kB | - | 90 | MICROSEMI CORP | - | - | M2S050-1VFG400I | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | 207 | 4695 LAB | 56340 LE | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | e1 | - | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | - | 0.8 mm | compliant | - | - | - | S-PBGA-B400 | 207 | Not Qualified | - | - | 1.2 V | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 50K Logic Modules | - | 56340 | 1 Core | - | 256KB | - | - | 17 mm | 17 mm | - | ||
A2F500M3G-CS288 Microchip Technology | In Stock | - | - | - | - | - | - | 288-TFBGA, CSPBGA | - | - | 288-CSP (11x11) | - | A2F500 | 64 kB | - | 176 | - | - | - | - | 80 MHz | - | Microchip Technology | - | Yes | - | - | MCU - 31, FPGA - 78 | - | 6000 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion | - | - | - | 0°C ~ 85°C (TJ) | Tray | - | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 80MHz | 64KB | - | ARM® Cortex®-M3 | DMA, POR, WDT | - | 512 kB | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | - | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | - | 1 Core | - | 512KB | - | - | - | - | - | ||
M2S005S-1VFG400T2 Microchip Technology | In Stock | - | - | - | - | - | - | BGA-400 | - | - | 400-VFBGA (17x17) | - | M2S005 | 64 kB | 191 kbit | 90 | - | - | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | - | SMD/SMT | 171 I/O | 505 LAB | 6060 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | 0.652216 oz | - | 0 to 85 °C | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR | - | 128 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | 1 | - | FPGA - 5K Logic Modules | - | - | 1 Core | - | 128KB | - | - | - | - | - | ||
M2S010TS-1VF256I Microchip Technology | In Stock | - | - | - | Production (Last Updated: 1 month ago) | - | - | VFPBGA-256 | YES | - | 256-FPBGA (14x14) | 256 | M2S010 | 64 kB | - | 119 | MICROSEMI CORP | - | - | M2S010TS-1VF256I | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 138 | 1007 LAB | 12084 LE | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | e0 | - | - | - | - | - | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | - | 0.8 mm | not_compliant | - | - | - | S-PBGA-B256 | 138 | Not Qualified | - | - | 1.2 V | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 10K Logic Modules | - | 12084 | 1 Core | - | 256KB | - | - | 14 mm | 14 mm | - | ||
 XC7Z045-L2FFG676I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | 676-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | - | 800MHz | NOT SPECIFIED | - | S-PBGA-B676 | - | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | 100 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | ARM | YES | - | 256000 | Kintex™-7 FPGA, 350K Logic Cells | 437200 | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | 3.37mm | 27mm | 27mm | ROHS3 Compliant | ||
 5CSEMA4U23I7N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | 5CSEMA4 | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | - | - | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 40K Logic Elements | - | 40000 | - | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
XC7Z012S-2CLG485I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | - | 484-LFBGA, CSPBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 150 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 485 | - | Matte Tin (Sn) | - | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B485 | - | - | - | 1.05V | - | - | 0.95V | - | - | - | 766MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | YES | - | 256000 | Artix™-7 FPGA, 55K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | 1.6mm | 19mm | 19mm | ROHS3 Compliant | ||
XCZU17EG-2FFVC1760E Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 1760-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 512 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
5CSXFC5C6U23I7N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SX | - | - | Active | 3 (168 Hours) | 672 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | 5CSXFC5 | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | - | - | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 85K Logic Elements | - | 85000 | - | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
 XCZU2CG-1SBVA484I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 484-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 82 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant |