- Manufacturer
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Clock Frequency | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Gates | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Bus Compatibility | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
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 A2F200M3F-1FG484I Microchip Technology | In Stock | - | - | - | - | FPBGA-484 | - | 484-FPBGA (23x23) | - | A2F200 | - | 64 kB | 60 | - | - | - | - | 100 MHz | - | + 100 C | Microchip Technology | - | - 40 C | Yes | - | SMD/SMT | 161 I/O | - | 2000 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | - | - | - | - | SmartFusion | - | -40°C ~ 100°C (TJ) | Tray | - | A2F200 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | 200000 | - | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | - | 1 Core | - | - | 256KB | - | - | - | - | ||
M2S060T-1FCSG325 Microchip Technology | In Stock | - | - | - | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | - | 64 kB | 176 | MICROSEMI CORP | - | - | M2S060T-1FCSG325 | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | - | 200 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | 0°C ~ 85°C (TJ) | Tray | - | SmartFusion2 | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | - | 0.5 mm | compliant | - | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | - | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 60K Logic Modules | - | 56520 | 1 Core | - | - | 256KB | - | 11 mm | 11 mm | - | ||
A2F500M3G-1CS288 Microchip Technology | In Stock | - | - | - | - | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F500 | 100 MHz | 64 kB | 176 | MICROSEMI CORP | - | - | A2F500M3G-1CS288 | 100 MHz | - | - | Microchip Technology | - | - | Yes | - | - | MCU - 31, FPGA - 78 | - | 6000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | - | 0°C ~ 85°C (TJ) | Tray | - | A2F500 | e0 | - | - | - | - | TIN LEAD SILVER | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | NOT SPECIFIED | - | 0.5 mm | compliant | - | - | S-PBGA-B288 | 78 | Not Qualified | - | 1.5,1.8,2.5,3.3 V | OTHER | - | - | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | - | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | - | 500000 | 512KB | - | 11 mm | 11 mm | - | ||
M2S050-1FGG896 Microchip Technology | In Stock | - | - | - | - | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | M2S050 | - | 64 kB | 27 | MICROSEMI CORP | - | - | M2S050-1FGG896 | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 377 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | 0°C ~ 85°C (TJ) | Tray | - | SmartFusion2 | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | - | 1 mm | compliant | - | - | S-PBGA-B896 | 377 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 50K Logic Modules | - | 56340 | 1 Core | - | - | 256KB | - | 31 mm | 31 mm | - | ||
M2S025-1VF400 Microchip Technology | In Stock | - | - | - | - | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S025 | - | 64 kB | 90 | MICROSEMI CORP | - | - | M2S025-1VF400 | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | SMD/SMT | 207 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | 0 to 85 °C | Tray | - | SmartFusion2 | e0 | - | - | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | - | 0.8 mm | not_compliant | - | - | S-PBGA-B400 | 160 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 1 | - | FPGA - 25K Logic Modules | - | 23988 | 1 Core | - | - | 256KB | - | 17 mm | 17 mm | - | ||
M2S025TS-1FCS325I Microchip Technology | In Stock | - | - | - | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2S025 | - | 64 kB | 176 | MICROSEMI CORP | - | - | M2S025TS-1FCS325I | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 180 | 2308 LAB | 27696 LE | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | e0 | - | - | - | - | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | - | 0.5 mm | not_compliant | - | - | S-PBGA-B325 | 180 | Not Qualified | - | 1.2 V | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | - | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 25K Logic Modules | - | 27696 | 1 Core | - | - | 256KB | - | 11 mm | 11 mm | - | ||
M2S025TS-FCS325I Microchip Technology | In Stock | - | - | - | Production (Last Updated: 2 months ago) | FCBGA-325 | - | 325-FCBGA (11x11) | - | M2S025 | - | 64 kB | 176 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 180 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | - | 1 Core | - | - | 256KB | - | - | - | - | ||
M2S090TS-1FCS325 Microchip Technology | In Stock | - | - | - | - | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | - | 64 kB | 176 | MICROSEMI CORP | - | - | M2S090TS-1FCS325 | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 180 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | 0°C ~ 85°C (TJ) | Tray | - | SmartFusion2 | e0 | - | - | - | - | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | - | 0.5 mm | not_compliant | - | - | R-PBGA-B325 | 180 | Not Qualified | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | - | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 90K Logic Modules | - | 86316 | 1 Core | - | - | 512KB | - | 13.5 mm | 11 mm | - | ||
M2S060TS-1FGG676I Microchip Technology | In Stock | - | - | - | Production (Last Updated: 2 months ago) | 676-BGA | - | 676-FBGA (27x27) | - | M2S060 | - | 64 kB | 40 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 387 | 4710 LAB | 56520 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | 1 Core | - | - | 256KB | - | - | - | - | ||
 XCZU2EG-1SBVA484E Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | 484-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 82 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
M2S060TS-FG676I Microchip Technology | In Stock | - | - | - | - | 676-BGA | - | 676-FBGA (27x27) | - | M2S060 | - | 64 kB | 40 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 387 | 4710 LAB | 56520 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | 1 Core | - | - | 256KB | - | - | - | - | ||
 5CSXFC5D6F31C7N Intel | In Stock | - | Datasheet | 8 Weeks | - | 896-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 288 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | e1 | - | Active | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | - | NOT SPECIFIED | 5CSXFC5 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 85K Logic Elements | - | 85000 | - | - | - | - | 2mm | 31mm | 31mm | RoHS Compliant | ||
XCZU4CG-1FBVB900I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XC7Z012S-1CLG485I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | 484-LFBGA, CSPBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 150 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 485 | Matte Tin (Sn) | - | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B485 | - | - | 1.05V | - | - | 0.95V | - | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | YES | - | 256000 | Artix™-7 FPGA, 55K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | 1.6mm | 19mm | 19mm | ROHS3 Compliant | ||
 10AS066K3F35E2SG Intel | In Stock | - | Datasheet | 8 Weeks | - | 1152-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 396 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | - | NOT SPECIFIED | - | S-PBGA-B1152 | 396 | Not Qualified | 0.93V | 0.9V | - | 0.87V | - | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 660K Logic Elements | - | 660000 | - | - | - | - | 3.5mm | 35mm | 35mm | RoHS Compliant | ||
 5CSEBA5U19I7N Intel | In Stock | - | Datasheet | 8 Weeks | - | 484-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 151, FPGA - 66 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | e1 | - | Active | 3 (168 Hours) | 484 | TIN SILVER COPPER | - | 8542.39.00.01 | - | BOTTOM | BALL | 260 | 1.1V | 0.8mm | - | 40 | 5CSEBA5 | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 622MHz | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 85K Logic Elements | - | 85000 | - | - | - | - | 1.9mm | 19mm | 19mm | RoHS Compliant | ||
5CSEMA5F31C6N Intel | In Stock | - | Datasheet | 8 Weeks | - | 896-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 288 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | e1 | - | Active | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | - | NOT SPECIFIED | 5CSEMA5 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 85K Logic Elements | - | 85000 | - | - | - | - | 2mm | 31mm | 31mm | RoHS Compliant | ||
 5CSEBA4U23I7N Intel | In Stock | - | Datasheet | 8 Weeks | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | e1 | - | Active | 3 (168 Hours) | 672 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | BOTTOM | BALL | 260 | 1.1V | 0.8mm | - | NOT SPECIFIED | 5CSEBA4 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 40K Logic Elements | - | 40000 | - | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
 XCZU6CG-1FFVC900E Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
5CSEBA2U19C7N Intel | In Stock | - | Datasheet | 8 Weeks | - | 484-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 151, FPGA - 66 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 484 | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 25K Logic Elements | - | 25000 | - | - | - | - | 1.9mm | 19mm | 19mm | RoHS Compliant |