- Manufacturer
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Size | Propagation Delay | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Core Architecture | Boundary Scan | Speed Grade | Number of Transceivers | RAM (words) | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Bus Compatibility | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
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 XCZU27DR-2FFVG1517I5180 Xilinx | In Stock | - | - | - | - | - | - | FBGA-1517 | - | - | - | - | 256 kB | 13 Mb | 1 | - | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | - | - | - | + 100 C | - | - | - 40 C | - | - | SMD/SMT | 597 I/O | 53160 LAB | 930300 LE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 850 mV | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 16 Transceiver | - | - | - | - | 6 Core | - | - | - | - | - | - | ||
 XC7Z030-L2SBG485I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | 484-FBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | 800MHz | NOT SPECIFIED | - | - | S-PBGA-B485 | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | 100 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | ARM | YES | - | - | 256000 | Kintex™-7 FPGA, 125K Logic Cells | 157200 | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.44mm | 19mm | 19mm | ROHS3 Compliant | ||
M2S025TS-VFG400I Microchip Technology | In Stock | - | - | - | Production (Last Updated: 2 months ago) | - | - | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S025 | 64 kB | - | 90 | MICROSEMI CORP | - | - | M2S025TS-VFG400I | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | 207 | 2308 LAB | 27696 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | - | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | e1 | - | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | - | 0.8 mm | compliant | - | 40 | - | - | S-PBGA-B400 | 207 | Not Qualified | - | - | 1.2 V | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 25K Logic Modules | - | 27696 | 1 Core | - | 256KB | - | 17 mm | 17 mm | - | ||
M2S025TS-FCS325 Microchip Technology | In Stock | - | - | - | Production (Last Updated: 2 months ago) | - | - | 325-TFBGA, FCBGA | - | 325-FCBGA (11x11) | - | M2S025 | 64 kB | - | 176 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 180 | 2308 LAB | 27696 LE | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | - | 1 Core | - | 256KB | - | - | - | - | ||
M2S050TS-1FCS325 Microchip Technology | In Stock | - | - | - | Production (Last Updated: 2 months ago) | - | - | FCBGA-325 | - | 325-FCBGA (11x11) | - | M2S050 | 64 kB | - | 176 | - | - | - | - | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 200 | 4695 LAB | 56340 LE | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | - | 1 Core | - | 256KB | - | - | - | - | ||
 5CSEBA2U23C8SN Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | - | - | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | 1.07V | - | - | - | 600MHz | 64KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 25K Logic Elements | - | 25000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
 XC7Z030-L2FBG484I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | - | 484-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | 250 | 1V | 1mm | not_compliant | 800MHz | 30 | - | - | S-PBGA-B484 | - | - | - | 1.05V | - | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | ARM | YES | - | - | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.54mm | 23mm | 23mm | ROHS3 Compliant | ||
 XCZU7EV-1FFVC1156I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 360 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XCZU4CG-L1SFVC784I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 784-BFBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | 784 | - | - | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | - | NOT SPECIFIED | - | - | S-PBGA-B784 | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XCZU9EG-2FFVC900E Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XCZU2CG-1SBVA484E Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 484-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 82 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
M2S150TS-1FCV484I Microchip Technology | In Stock | - | - | - | - | - | - | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | 64 kB | - | 84 | MICROSEMI CORP | - | - | M2S150TS-1FCV484I | 166 MHz | - | - | Microchip Technology | - | - | Yes | - | - | 273 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | - | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | e0 | No | - | - | - | - | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | - | BOTTOM | BALL | 240 | - | 0.8 mm | not_compliant | - | - | - | - | S-PBGA-B484 | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 512 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 150K Logic Modules | - | - | 1 Core | - | 512KB | - | 19 mm | 19 mm | - | ||
 10AS016E3F29E2LG Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | 780-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 288 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | 780 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | - | - | NOT SPECIFIED | - | - | S-PBGA-B780 | 288 | Not Qualified | - | 0.93V | 0.9V | 0.87V | - | - | - | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 288 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 160K Logic Elements | - | 160000 | - | - | - | 3.35mm | 29mm | 29mm | RoHS Compliant | ||
5CSEMA6U23I7N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | 5CSEMA6 | - | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | 1.07V | - | - | - | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 110K Logic Elements | - | 110000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
 5CSEBA2U19C8SN Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | 484-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 151, FPGA - 66 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 484 | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | - | - | S-PBGA-B484 | 66 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | 1.07V | - | - | - | 600MHz | 64KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 66 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 25K Logic Elements | - | 25000 | - | - | - | 1.9mm | 19mm | 19mm | RoHS Compliant | ||
 XC7Z014S-1CLG400C Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | - | 400-LFBGA, CSPBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 125 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 400 | - | Matte Tin (Sn) | - | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | - | NOT SPECIFIED | - | - | S-PBGA-B400 | - | - | - | 1.05V | - | 0.95V | - | - | - | 667MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | YES | - | - | 256000 | Artix™-7 FPGA, 65K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||
M2S150TS-1FCS536 Microchip Technology | In Stock | - | - | - | - | - | - | 536-LFBGA, CSPBGA | - | 536-CSPBGA (16x16) | - | M2S150 | 64 kB | - | 90 | - | - | - | - | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | - | - | 293 | 12177 LAB | 146124 LE | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | 0 to 85 °C | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 536 | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 512 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | 1 | - | - | FPGA - 150K Logic Modules | - | - | 1 Core | - | 512KB | - | - | - | - | ||
 XCZU3EG-1SFVA625E Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 625-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 180 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XC7Z030-2FF676I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | - | - | Active | 4 (72 Hours) | 676 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | - | - | - | - | 800MHz | - | XC7Z030 | - | S-PBGA-B676 | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | YES | - | - | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | - | - | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | - | - | - | - | Non-RoHS Compliant | ||
M2S060-FGG484 Atmel (Microchip Technology) | In Stock | - | - | - | - | - | - | - | - | - | - | - | 64 kB | - | 60 | - | - | - | - | 166 MHz | - | - | - | - | - | Yes | - | - | - | 4710 LAB | 56520 LE | - | - | - | - | - | - | - | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 256 kB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - |