- Manufacturer
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Core Architecture | Boundary Scan | RAM (words) | Primary Attributes | Number of Logic Cells | Number of Cores | Bus Compatibility | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 XCZU7EV-2FFVC1156E Xilinx Inc. | 251 | - | Datasheet | 11 Weeks | - | - | - | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 360 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XC7Z014S-1CLG400I Xilinx Inc. | 1000 | - | Datasheet | 10 Weeks | - | - | - | 400-LFBGA, CSPBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 125 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 400 | - | Matte Tin (Sn) | - | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B400 | - | - | - | 1.05V | - | - | 0.95V | - | 667MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | YES | 256000 | Artix™-7 FPGA, 65K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||
 XC7Z035-L2FFG676I Xilinx Inc. | 733 | - | Datasheet | 10 Weeks | - | - | - | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B676 | - | - | - | 1.05V | - | - | 0.95V | - | 800MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | YES | 256000 | Kintex™-7 FPGA, 275K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 3.37mm | 27mm | 27mm | ROHS3 Compliant | ||
 5CSEBA2U23C7N Intel | 3000 | - | Datasheet | 8 Weeks | - | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Elements | 25000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
 M2S060TS-1FG484M Atmel (Microchip Technology) | In Stock | - | - | - | - | - | - | BGA-484 | - | - | - | - | 64 kB | 1314 kbit | 60 | - | - | - | - | 166 MHz | + 125 C | - | - 55 C | Yes | - | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | 0.326090 oz | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | 256 kB | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | ||
M2S050T-1FGG484M Microchip Technology | In Stock | - | - | - | Production (Last Updated: 2 months ago) | - | - | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S050 | 64 kB | - | 60 | MICROSEMI CORP | - | - | M2S050T-1FGG484M | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | 267 | 4695 LAB | 56340 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -55°C ~ 125°C (TJ) | Tray | - | SmartFusion2 | e1 | - | - | - | - | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | - | 1 mm | compliant | - | 40 | - | S-PBGA-B484 | 267 | Not Qualified | - | - | 1.2 V | MILITARY | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 50K Logic Modules | 56340 | 1 Core | - | 256KB | - | 23 mm | 23 mm | - | ||
5CSEBA4U23C8SN Intel | 229 | - | Datasheet | 8 Weeks | - | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 600MHz | 64KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 40K Logic Elements | 40000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
XCZU15EG-1FFVB1156I Xilinx Inc. | 2500 | - | Datasheet | 11 Weeks | - | - | - | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 328 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XCZU2CG-1SFVC784I Xilinx Inc. | 861 | - | Datasheet | 11 Weeks | - | - | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
M2S090TS-1FG676I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | - | BGA-676 | - | - | - | - | 64 kB | - | 40 | - | - | - | - | 166 MHz | - | - | - | Yes | - | SMD/SMT | - | 7193 LAB | 86316 LE | - | - | - | - | - | - | - | - | - | - | - | - | N | - | - | - | - | - | - | 1.071118 oz | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 512 kB | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | ||
5CSXFC6C6U23C6N Intel | 5 | - | Datasheet | 8 Weeks | - | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | - | - | Active | 3 (168 Hours) | 672 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | 5CSXFC6 | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 925MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 110K Logic Elements | 110000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
XCZU4EV-L1SFVC784I Xilinx Inc. | 17 | - | Datasheet | 11 Weeks | - | - | - | 784-BFBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | 784 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | - | NOT SPECIFIED | - | R-PBGA-B784 | - | - | - | 0.742V | - | - | 0.698V | - | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
M2S025-1FCSG325 Microchip Technology | In Stock | - | - | - | Production (Last Updated: 2 months ago) | - | - | FCBGA-325 | - | 325-FCBGA (11x11) | - | M2S025 | 64 kB | - | 176 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | SMD/SMT | 180 | 2308 LAB | 27696 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | 1 Core | - | 256KB | - | - | - | - | ||
 XC7Z007S-2CLG225E Xilinx Inc. | 3000 | - | Datasheet | 10 Weeks | - | - | - | 225-LFBGA, CSPBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 54 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e1 | yes | Active | 3 (168 Hours) | 225 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | 260 | 1V | 0.8mm | - | - | 30 | - | S-PBGA-B225 | - | - | - | 1.05V | - | - | 0.95V | - | 766MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | YES | 256000 | Artix™-7 FPGA, 23K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.5mm | 13mm | 13mm | ROHS3 Compliant | ||
 XC7Z012S-1CLG485C Xilinx Inc. | 3000 | - | Datasheet | 10 Weeks | - | - | - | 484-LFBGA, CSPBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 150 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 485 | - | Matte Tin (Sn) | - | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B485 | - | - | - | 1.05V | - | - | 0.95V | - | 667MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | YES | 256000 | Artix™-7 FPGA, 55K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 19mm | 19mm | ROHS3 Compliant | ||
XC7Z010-L1CLG225I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | 225-LFBGA, CSPBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 86 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 667MHz | 30 | - | S-PBGA-B225 | - | - | 1V | 1.05V | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | YES | 256000 | Artix™-7 FPGA, 28K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.5mm | 13mm | - | ROHS3 Compliant | ||
XCZU4CG-2SFVC784E Xilinx Inc. | 520 | - | Datasheet | 11 Weeks | - | - | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 533MHz, 1.3GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
5CSEBA4U23C8N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 600MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 40K Logic Elements | 40000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
5CSXFC2C6U23C7N Intel | 120 | - | Datasheet | 8 Weeks | - | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | - | - | Active | 3 (168 Hours) | 672 | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 25K Logic Elements | 25000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
 5CSXFC6D6F31C6N Intel | 2582 | - | Datasheet | 8 Weeks | - | - | - | 896-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 288 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | - | - | Active | 3 (168 Hours) | 896 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | - | - | NOT SPECIFIED | 5CSXFC6 | S-PBGA-B896 | 288 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 925MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 288 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 110K Logic Elements | 110000 | - | - | - | 2mm | 31mm | 31mm | RoHS Compliant |