- Manufacturer
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Size | Propagation Delay | Connectivity | Turn On Delay Time | Architecture | Data Bus Width | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Core Architecture | Number of Gates | Boundary Scan | RAM (words) | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Cores | Bus Compatibility | Number of Equivalent Gates | Flash Size | UV Erasable | Height Seated (Max) | Length | Width | RoHS Status |
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 XA7Z010-1CLG400I Xilinx Inc. | 1120 | - | Datasheet | 10 Weeks | - | - | 400-LFBGA, CSPBGA | YES | 400 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Automotive grade | -40°C~100°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | - | Active | 4 (72 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | 667MHz | NOT SPECIFIED | - | - | - | Not Qualified | - | - | 11.8V | - | - | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 32b | - | - | - | - | ARM | - | - | - | Artix™-7 FPGA, 28K Logic Cells | - | - | - | - | - | - | - | N | 1.6mm | 17mm | - | ROHS3 Compliant | ||
 A2F200M3F-PQ208I Microchip Technology | In Stock | - | - | - | - | - | 208-BFQFP | YES | - | 208-PQFP (28x28) | 208 | A2F200 | 80 MHz | 64 kB | 24 | MICROSEMI CORP | - | - | A2F200M3F-PQ208I | 80 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 113 I/O | - | 2000 LE | - | - | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 20 | 5.61 | N | No | - | 1.575 V | 1.425 V | 1.5 V | SmartFusion | - | -40°C ~ 100°C (TJ) | Tray | - | A2F200 | e0 | - | - | - | - | - | Tin/Lead (Sn/Pb) | - | 8542.39.00.01 | CMOS | QUAD | GULL WING | 225 | - | 0.5 mm | compliant | - | - | - | S-PQFP-G208 | 66 | Not Qualified | - | - | 1.5,1.8,2.5,3.3 V | - | - | - | - | - | 80MHz | 64KB | - | ARM® Cortex®-M3 | DMA, POR, WDT | - | 256 kB | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | MCU, FPGA | - | 66 | 4608 CLBS, 200000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 200000 | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | 4608 | 4608 | 1 Core | - | 200000 | 256KB | - | - | 28 mm | 28 mm | - | ||
M2S060TS-1VFG400I Microchip Technology | In Stock | - | - | - | - | - | 400-LFBGA | - | - | 400-VFBGA (17x17) | - | M2S060 | - | 64 kB | 90 | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | 207 | 4710 LAB | 56520 LE | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion2 | - | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | - | 1 Core | - | - | 256KB | - | - | - | - | - | ||
A2F200M3F-1CS288I Microchip Technology | In Stock | - | - | - | - | - | 288-TFBGA, CSPBGA | YES | - | 288-CSP (11x11) | 288 | A2F200 | 100 MHz | 64 kB | 176 | MICROSEMI CORP | - | - | A2F200M3F-1CS288I | 100 MHz | - | Microchip Technology | - | Yes | - | - | MCU - 31, FPGA - 78 | - | 2000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 20 | 1.56 | N | No | - | 1.575 V | 1.425 V | 1.5 V | SmartFusion | - | -40°C ~ 100°C (TJ) | Tray | - | A2F200 | e0 | - | - | - | - | - | TIN LEAD SILVER | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 235 | - | 0.5 mm | compliant | - | - | - | S-PBGA-B288 | 78 | Not Qualified | - | - | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | - | - | - | - | 100MHz | 64KB | - | ARM® Cortex®-M3 | DMA, POR, WDT | - | 256 kB | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | - | MCU, FPGA | - | 78 | 4608 CLBS, 200000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | - | 4608 | 4608 | 1 Core | - | 200000 | 256KB | - | - | 11 mm | 11 mm | - | ||
XCZU4EV-2FBVB900E Xilinx Inc. | 600 | - | Datasheet | 11 Weeks | - | - | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 10AS016E4F27E3SG Intel | In Stock | - | Datasheet | 8 Weeks | - | - | 672-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 240 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | 672 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B672 | 240 | Not Qualified | - | 0.93V | 0.9V | - | 0.87V | - | - | - | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | 240 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 160K Logic Elements | - | - | 160000 | - | - | - | - | - | 3.25mm | 27mm | 27mm | RoHS Compliant | ||
XA7Z010-1CLG400Q Xilinx Inc. | 3000 | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 400-LFBGA, CSPBGA | - | 400 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | - | Active | 4 (72 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | 667MHz | NOT SPECIFIED | - | - | - | Not Qualified | 1V | - | 11.8V | - | - | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 32b | - | - | - | - | ARM | - | - | - | Artix™-7 FPGA, 28K Logic Cells | - | - | - | - | - | - | - | N | 1.6mm | 17mm | - | ROHS3 Compliant | ||
5ASXFB5H4F40I3N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | 1517-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 208, FPGA - 540 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | - | Arria V SX | e1 | - | Active | 3 (168 Hours) | - | - | TIN SILVER COPPER | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.15V | 1mm | - | - | NOT SPECIFIED | 5ASXFB5 | S-PBGA-B1517 | - | - | - | 1.18V | - | - | 1.12V | - | - | - | 1.05GHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 670MHz | - | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 462K Logic Elements | - | - | - | - | - | - | - | - | 2.7mm | 40mm | 40mm | RoHS Compliant | ||
 XC7Z030-1FB484I Xilinx Inc. | 2955 | - | Datasheet | 11 Weeks | - | - | 484-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Bulk | 2009 | Zynq®-7000 | - | no | Active | 2A (4 Weeks) | 484 | - | - | GPIO WITH FOUR 32-BIT BANKS | 8542.39.00.01 | - | BOTTOM | BALL | - | - | - | - | - | - | - | S-PBGA-B484 | - | - | - | - | - | - | - | - | - | - | 667MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | YES | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | - | - | - | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | - | - | - | - | - | - | ROHS3 Compliant | ||
 5CSEMA6F31C8N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | 896-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 288 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | e1 | - | Active | 3 (168 Hours) | 896 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | - | - | NOT SPECIFIED | 5CSEMA6 | S-PBGA-B896 | 288 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | - | - | 600MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | 288 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 110K Logic Elements | - | - | 110000 | - | - | - | - | - | 2mm | 31mm | 31mm | RoHS Compliant | ||
M2S060TS-VFG400I Microchip Technology | In Stock | - | - | - | - | - | 400-LFBGA | YES | - | 400-VFBGA (17x17) | 400 | M2S060 | - | 64 kB | 90 | MICROSEMI CORP | - | - | M2S060TS-VFG400I | 166 MHz | - | Microchip Technology | - | Yes | 3 | - | 207 | 4710 LAB | 56520 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | - | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | e1 | - | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | - | 0.8 mm | compliant | - | 40 | - | S-PBGA-B400 | 207 | Not Qualified | - | - | 1.2 V | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | - | 207 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 60K Logic Modules | - | - | 56520 | 1 Core | - | - | 256KB | - | - | 17 mm | 17 mm | - | ||
 5CSEBA5U23C8N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | e1 | - | Active | 3 (168 Hours) | 672 | - | TIN SILVER COPPER | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | - | - | 600MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | 145 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 85K Logic Elements | - | - | 85000 | - | - | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
 XCZU4EG-L2SFVC784E Xilinx Inc. | 97 | - | Datasheet | 11 Weeks | - | - | 784-BFBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | 784 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | - | NOT SPECIFIED | - | R-PBGA-B784 | - | - | - | 0.742V | - | - | 0.698V | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
5CSXFC2C6U23I7N Intel | 2243 | - | Datasheet | 8 Weeks | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SX | - | - | Active | 3 (168 Hours) | 672 | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | 5CSXFC2 | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | - | - | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | 145 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 25K Logic Elements | - | - | 25000 | - | - | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
XCZU5EG-2SFVC784I Xilinx Inc. | 2065 | - | Datasheet | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
5CSXFC6C6U23A7N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | 5CSXFC6 | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | - | - | 700MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | 145 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 110K Logic Elements | - | - | 110000 | - | - | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
M2S025TS-1VFG400I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | VFPBGA-400 | - | - | - | - | - | - | 64 kB | 90 | - | - | - | - | 166 MHz | - | - | - | Yes | - | SMD/SMT | - | 2308 LAB | 27696 LE | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 256 kB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | - | ||
5CSXFC5D6F31C6N Intel | 2892 | - | Datasheet | 8 Weeks | - | - | 896-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 288 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | - | - | Active | 3 (168 Hours) | 896 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | - | - | NOT SPECIFIED | 5CSXFC5 | S-PBGA-B896 | 288 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | - | - | 925MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | 288 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 85K Logic Elements | - | - | 85000 | - | - | - | - | - | 2mm | 31mm | 31mm | RoHS Compliant | ||
 XC7Z100-L2FFG900I Xilinx Inc. | 950 | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 900-BBGA, FCBGA | - | 900 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | 245 | 1V | 1mm | - | 800MHz | 30 | - | - | - | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | 120 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 120 ps | MCU, FPGA | - | - | - | - | - | ARM | - | YES | 256000 | Kintex™-7 FPGA, 444K Logic Cells | 554800 | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | - | 3.35mm | 31mm | 31mm | ROHS3 Compliant | ||
 10AS066H3F34E2LG Intel | In Stock | - | Datasheet | 8 Weeks | - | - | 1152-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 492 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B1152 | 492 | Not Qualified | - | 0.93V | 0.9V | - | 0.87V | - | - | - | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | 492 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 660K Logic Elements | - | - | 660000 | - | - | - | - | - | 3.65mm | 35mm | 35mm | RoHS Compliant |