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Attribute column

Categories

Embedded - System On Chip (SoC)

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7695 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Lifecycle Status

Package / Case

Surface Mount

Supplier Device Package

Number of Terminals

Base Product Number

Data RAM Size

Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

L1 Cache Data Memory

L1 Cache Instruction Memory

Manufacturer Part Number

Maximum Clock Frequency

Maximum Operating Temperature

Mfr

Minimum Operating Temperature

Moisture Sensitive

Moisture Sensitivity Levels

Mounting Styles

MSL

Number of I/Os

Number of Logic Array Blocks - LABs

Number of Logic Elements

Operating Temperature-Max

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Product Status

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Shipping Restrictions

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Typical Operating Supply Voltage

Unit Weight

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

Base Part Number

JESD-30 Code

Number of Outputs

Qualification Status

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Clock Frequency

Program Memory Size

Connectivity

Architecture

Number of Inputs

Seated Height-Max

Programmable Logic Type

Total RAM Bits

Boundary Scan

Speed Grade

RAM (words)

Primary Attributes

Number of Logic Cells

Number of Cores

Bus Compatibility

Flash Size

Height Seated (Max)

Length

Width

RoHS Status

XCZU5EG-1SFVC784I
XCZU5EG-1SFVC784I

Xilinx Inc.

326

-

Datasheet

11 Weeks

-

784-BFBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

252

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

-

-

-

-

-

-

ROHS3 Compliant

XC7Z014S-2CLG484I
XC7Z014S-2CLG484I

Xilinx Inc.

989

-

Datasheet

10 Weeks

-

484-LFBGA, CSPBGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

200

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2016

Zynq®-7000

e3

yes

Active

3 (168 Hours)

484

Matte Tin (Sn)

-

8542.31.00.01

-

BOTTOM

BALL

NOT SPECIFIED

1V

0.8mm

-

NOT SPECIFIED

-

S-PBGA-B484

-

-

-

1.05V

-

-

0.95V

766MHz

256KB

-

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

800MHz

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

YES

-

256000

Artix™-7 FPGA, 65K Logic Cells

-

-

CAN; ETHERNET; I2C; SPI; UART; USB

-

1.6mm

19mm

19mm

ROHS3 Compliant

M2S025T-FCSG325
M2S025T-FCSG325

Microchip Technology

In Stock

-

-

-

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

M2S025

64 kB

176

MICROSEMI CORP

-

-

M2S025T-FCSG325

166 MHz

-

Microchip Technology

-

Yes

3

-

MSL 3 - 168 hours

180

2308 LAB

27696 LE

85 °C

Tray

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

40

5.78

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

2.5, 3.3 V

0.111027 oz

0 to 85 °C

Tray

-

SmartFusion2

e1

-

-

-

-

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

-

0.5 mm

compliant

-

-

S-PBGA-B325

180

Not Qualified

-

-

1.2 V

OTHER

-

166MHz

64KB

-

ARM® Cortex®-M3

DDR, PCIe, SERDES

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

592Kbit

-

STD

-

FPGA - 25K Logic Modules

27696

1 Core

-

256KB

-

11 mm

11 mm

-

XCZU7EG-3FFVC1156E
XCZU7EG-3FFVC1156E

Xilinx Inc.

55

-

Datasheet

11 Weeks

-

1156-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

360

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

600MHz, 667MHz, 1.5GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

-

-

-

-

-

-

ROHS3 Compliant

XCZU9CG-1FFVB1156I
XCZU9CG-1FFVB1156I

Xilinx Inc.

824

-

Datasheet

11 Weeks

-

1156-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

328

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale+™ MPSoC CG

-

-

Active

4 (72 Hours)

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

500MHz, 1.2GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

-

-

-

-

-

-

ROHS3 Compliant

5CSEMA4U23C8N
5CSEMA4U23C8N

Intel

39

-

Datasheet

8 Weeks

-

672-FBGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

MCU - 181, FPGA - 145

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~85°C TJ

Tray

2018

Cyclone® V SE

-

-

Active

3 (168 Hours)

672

-

-

8542.39.00.01

-

BOTTOM

BALL

NOT SPECIFIED

1.1V

0.8mm

-

NOT SPECIFIED

-

S-PBGA-B672

145

Not Qualified

-

1.13V

1.11.2/3.32.5V

-

1.07V

600MHz

64KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

FPGA - 40K Logic Elements

40000

-

-

-

1.85mm

23mm

23mm

RoHS Compliant

XCZU15EG-2FFVC900I
XCZU15EG-2FFVC900I

Xilinx Inc.

540

-

Datasheet

11 Weeks

-

900-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

204

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

533MHz, 600MHz, 1.3GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

-

-

-

-

-

-

ROHS3 Compliant

M2S025-VFG256I
M2S025-VFG256I

Atmel (Microchip Technology)

In Stock

-

-

-

-

-

-

-

-

-

64 kB

119

-

-

-

-

166 MHz

+ 100 C

-

- 40 C

Yes

-

SMD/SMT

-

138 I/O

2308 LAB

27696 LE

-

-

-

-

-

-

-

-

-

-

-

-

Details

-

-

-

-

-

-

0.241494 oz

-

Tray

-

SmartFusion2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

1.2 V

-

-

-

-

-

-

-

-

-

-

256 kB

-

-

-

-

-

-

-

-

-

-

-

1 Core

-

-

-

-

-

-

XCZU2EG-1SFVA625E
XCZU2EG-1SFVA625E

Xilinx Inc.

In Stock

-

Datasheet

11 Weeks

-

625-BFBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

180

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2013

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

-

-

-

-

-

-

ROHS3 Compliant

10AS027E3F29E2SG
10AS027E3F29E2SG

Intel

In Stock

-

Datasheet

8 Weeks

-

780-BBGA, FCBGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

360

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

-

Arria 10 SX

-

-

Active

3 (168 Hours)

780

-

-

8542.39.00.01

-

BOTTOM

BALL

NOT SPECIFIED

0.9V

1mm

-

NOT SPECIFIED

-

S-PBGA-B780

360

Not Qualified

-

0.93V

0.9V

-

0.87V

1.5GHz

256KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

-

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

360

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

FPGA - 270K Logic Elements

270000

-

-

-

3.35mm

29mm

29mm

RoHS Compliant

5CSEMA5F31I7N
5CSEMA5F31I7N

Intel

In Stock

-

Datasheet

8 Weeks

-

896-BGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

MCU - 181, FPGA - 288

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2018

Cyclone® V SE

e1

-

Active

3 (168 Hours)

896

Tin/Silver/Copper (Sn/Ag/Cu)

-

8542.39.00.01

-

BOTTOM

BALL

NOT SPECIFIED

1.1V

1mm

-

NOT SPECIFIED

5CSEMA5

S-PBGA-B896

288

Not Qualified

-

1.13V

1.11.2/3.32.5V

-

1.07V

800MHz

64KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

FPGA - 85K Logic Elements

85000

-

-

-

2mm

31mm

31mm

RoHS Compliant

XCZU2EG-L1SFVC784I
XCZU2EG-L1SFVC784I

Xilinx Inc.

2000

-

Datasheet

11 Weeks

-

784-BFBGA, FCBGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

252

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

-

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

784

-

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

8542.31.00.01

-

BOTTOM

BALL

NOT SPECIFIED

0.72V

-

-

NOT SPECIFIED

-

R-PBGA-B784

-

-

-

0.742V

-

-

0.698V

500MHz, 600MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

-

-

-

-

-

-

ROHS3 Compliant

5CSEMA6F31C7N
5CSEMA6F31C7N

Intel

2285

-

Datasheet

8 Weeks

-

896-BGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

MCU - 181, FPGA - 288

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~85°C TJ

Tray

2018

Cyclone® V SE

e1

-

Active

3 (168 Hours)

896

Tin/Silver/Copper (Sn/Ag/Cu)

-

8542.39.00.01

-

BOTTOM

BALL

NOT SPECIFIED

1.1V

1mm

-

NOT SPECIFIED

5CSEMA6

S-PBGA-B896

288

Not Qualified

-

1.13V

1.11.2/3.32.5V

-

1.07V

800MHz

64KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

FPGA - 110K Logic Elements

110000

-

-

-

2mm

31mm

31mm

RoHS Compliant

XCZU7EV-1FBVB900I
XCZU7EV-1FBVB900I

Xilinx Inc.

395

-

Datasheet

11 Weeks

-

900-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

204

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EV

-

-

Active

4 (72 Hours)

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

-

-

-

-

-

-

ROHS3 Compliant

XCZU3EG-1SFVC784E
XCZU3EG-1SFVC784E

Xilinx Inc.

1150

-

Datasheet

11 Weeks

-

784-BFBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

252

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

-

-

-

-

-

-

ROHS3 Compliant

XCZU9EG-L1FFVB1156I
XCZU9EG-L1FFVB1156I

Xilinx Inc.

226

-

Datasheet

11 Weeks

-

1156-BBGA, FCBGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

328

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Bulk

2013

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

-

-

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

8542.31.00.01

-

BOTTOM

BALL

NOT SPECIFIED

0.72V

-

-

NOT SPECIFIED

-

R-PBGA-B1156

-

-

-

0.742V

-

-

0.698V

500MHz, 600MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

-

-

-

-

-

-

ROHS3 Compliant

XCZU3CG-L1SFVC784I
XCZU3CG-L1SFVC784I

Xilinx Inc.

90

-

Datasheet

11 Weeks

-

784-BFBGA, FCBGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

252

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC CG

-

-

Active

4 (72 Hours)

784

-

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

8542.31.00.01

-

BOTTOM

BALL

NOT SPECIFIED

0.72V

-

-

NOT SPECIFIED

-

S-PBGA-B784

-

-

-

-

-

-

-

500MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

-

-

-

-

-

-

ROHS3 Compliant

5CSEBA5U19A7N
5CSEBA5U19A7N

Intel

In Stock

-

Datasheet

8 Weeks

-

484-FBGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

MCU - 151, FPGA - 66

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~125°C TJ

Tray

2018

Automotive, AEC-Q100, Cyclone® V SE

-

-

Active

3 (168 Hours)

484

-

-

8542.39.00.01

-

BOTTOM

BALL

NOT SPECIFIED

1.1V

0.8mm

-

NOT SPECIFIED

5CSEBA5

S-PBGA-B484

66

Not Qualified

-

1.13V

1.11.2/3.32.5V

-

1.07V

700MHz

64KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

66

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

FPGA - 85K Logic Elements

85000

-

-

-

1.9mm

19mm

19mm

RoHS Compliant

XCZU15EG-2FFVB1156E
XCZU15EG-2FFVB1156E

Xilinx Inc.

2000

-

Datasheet

11 Weeks

-

1156-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

328

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

-

yes

Active

4 (72 Hours)

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

533MHz, 600MHz, 1.3GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

-

-

-

-

-

-

ROHS3 Compliant

XC7Z014S-2CLG400E
XC7Z014S-2CLG400E

Xilinx Inc.

39

-

Datasheet

10 Weeks

-

400-LFBGA, CSPBGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

125

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2016

Zynq®-7000

e3

yes

Active

3 (168 Hours)

400

Matte Tin (Sn)

-

8542.31.00.01

-

BOTTOM

BALL

NOT SPECIFIED

1V

0.8mm

-

NOT SPECIFIED

-

S-PBGA-B400

-

-

-

1.05V

-

-

0.95V

766MHz

256KB

-

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

800MHz

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

YES

-

256000

Artix™-7 FPGA, 65K Logic Cells

-

-

CAN; ETHERNET; I2C; SPI; UART; USB

-

1.6mm

17mm

17mm

ROHS3 Compliant

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