- Manufacturer
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Base Product Number | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Memory Types | Mfr | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Product Status | RoHS | Shipping Restrictions | Operating Temperature | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Max Operating Temperature | Min Operating Temperature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Programmable Logic Type | Core Architecture | Max Frequency | Boundary Scan | RAM (words) | Primary Attributes | Number of Logic Cells | Number of Cores | Bus Compatibility | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 M2S050TS-1FGG484I Microchip Technology | 2295 |
| - | - | FPBGA-484 | - | 484-FPBGA (23x23) | M2S050 | 64 kB | 60 | - | - | 166 MHz | - | Microchip Technology | Yes | SMD/SMT | 267 | 4695 LAB | 56340 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | 1 Core | - | 256KB | - | - | - | - | ||
 XCZU15EG-1FFVB1156E Xilinx Inc. | 1392 | - | Datasheet | 11 Weeks | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | 328 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 5CSEBA6U23C8N Intel | In Stock | - | Datasheet | 8 Weeks | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | Active | 3 (168 Hours) | 672 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | NOT SPECIFIED | 5CSEBA6 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | - | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 110K Logic Elements | 110000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
 XCZU2EG-1SBVA484I Xilinx Inc. | 520 | - | Datasheet | 11 Weeks | 484-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | 82 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
5CSEBA4U23C7N Intel | 39 | - | Datasheet | 8 Weeks | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | Active | 3 (168 Hours) | 672 | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | - | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 40K Logic Elements | 40000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
 5CSEBA6U19A7N Intel | In Stock | - | Datasheet | 8 Weeks | 484-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | MCU - 151, FPGA - 66 | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2018 | Automotive, AEC-Q100, Cyclone® V SE | - | Active | 3 (168 Hours) | 484 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | NOT SPECIFIED | 5CSEBA6 | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | - | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 66 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 110K Logic Elements | 110000 | - | - | - | 1.9mm | 19mm | 19mm | RoHS Compliant | ||
 XC7Z045-2FF676I Xilinx Inc. | 902 | - | Datasheet | 10 Weeks | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | ROMless | - | - | - | 130 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | no | Active | 4 (72 Hours) | 676 | - | - | 8542.39.00.01 | BOTTOM | BALL | - | - | - | 800MHz | - | - | S-PBGA-B676 | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | ARM | - | YES | 256000 | Kintex™-7 FPGA, 350K Logic Cells | - | - | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | - | - | - | - | Non-RoHS Compliant | ||
 XC7Z100-1FF900I Xilinx Inc. | 677 | - | Datasheet | 10 Weeks | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | - | Active | 4 (72 Hours) | - | 100°C | -40°C | - | - | - | - | - | - | 667MHz | - | - | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | ARM | 667MHz | - | - | Kintex™-7 FPGA, 444K Logic Cells | - | - | - | - | - | - | - | Non-RoHS Compliant | ||
5CSEBA6U23I7SN Intel | 677 | - | Datasheet | 8 Weeks | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | - | Active | 3 (168 Hours) | 672 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | NOT SPECIFIED | 5CSEBA6 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | - | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 110K Logic Elements | 110000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
5CSEMA5U23C8N Intel | In Stock | - | Datasheet | 8 Weeks | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | Active | 3 (168 Hours) | 672 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | NOT SPECIFIED | 5CSEMA5 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | - | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 85K Logic Elements | 85000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
5CSXFC5C6U23C7N Intel | In Stock | - | Datasheet | 8 Weeks | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | - | Active | 3 (168 Hours) | 672 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | NOT SPECIFIED | 5CSXFC5 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | - | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 85K Logic Elements | 85000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
XCZU9CG-2FFVB1156I Xilinx Inc. | 90 | - | Datasheet | 11 Weeks | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | 328 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU19EG-2FFVC1760E Xilinx Inc. | 100 | - | Datasheet | 11 Weeks | 1760-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | 512 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
5CSXFC4C6U23C8N Intel | 2787 | - | Datasheet | 8 Weeks | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | - | Active | 3 (168 Hours) | 672 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | NOT SPECIFIED | 5CSXFC4 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | - | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | FPGA - 40K Logic Elements | 40000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
 XCZU5EV-1SFVC784E Xilinx Inc. | 1000 | - | Datasheet | 11 Weeks | 784-BFBGA, FCBGA | - | 784-FCBGA (23x23) | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | Active | 4 (72 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU5CG-2SFVC784E Xilinx Inc. | 931 | - | Datasheet | 11 Weeks | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | yes | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
M2S150TS-1FCVG484I Microchip Technology | 2389 |
| - | - | 484-BFBGA | - | 484-FBGA (19x19) | M2S150 | 64 kB | 84 | - | - | 166 MHz | - | Microchip Technology | Yes | - | 273 | 12177 LAB | 146124 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | 1 Core | - | 512KB | - | - | - | - | ||
M2S150TS-FCVG484 Microchip Technology | 2408 |
| - | - | 484-BFBGA | - | 484-FBGA (19x19) | M2S150 | 64 kB | 84 | - | - | 166 MHz | - | Microchip Technology | Yes | - | 273 | 12177 LAB | 146124 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | 1 Core | - | 512KB | - | - | - | - | ||
M2S150T-FCS536 Microchip Technology | 2994 |
| - | - | 536-LFBGA, CSPBGA | - | 536-CSPBGA (16x16) | M2S150 | 64 kB | 90 | - | - | 166 MHz | - | Microchip Technology | Yes | - | 293 | 12177 LAB | 146124 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | 1 Core | - | 512KB | - | - | - | - | ||
M2S005S-FG484I Microchip Technology | 26 |
| - | - | FPBGA-484 | - | 484-FPBGA (23x23) | M2S005 | 64 kB | 60 | - | - | 166 MHz | - | Microchip Technology | Yes | SMD/SMT | 209 | 505 LAB | 6060 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | FPGA - 5K Logic Modules | - | 1 Core | - | 128KB | - | - | - | - |