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Categories

Embedded - System On Chip (SoC)

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7695 Results

Product

Inventory

Pricing(USD)

Quantity

Datasheet

RoHS

Factory Lead Time

Lifecycle Status

Package / Case

Surface Mount

Number of Pins

Supplier Device Package

Number of Terminals

Base Product Number

Data RAM Size

Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

L1 Cache Data Memory

L1 Cache Instruction Memory

Manufacturer Part Number

Maximum Clock Frequency

Memory Types

Mfr

Moisture Sensitive

Moisture Sensitivity Levels

Mounting Styles

Number of I/Os

Number of Logic Array Blocks - LABs

Number of Logic Elements

Operating Temperature-Max

Operating Temperature-Min

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Product Status

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Shipping Restrictions

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reach Compliance Code

Frequency

Time@Peak Reflow Temperature-Max (s)

Base Part Number

JESD-30 Code

Number of Outputs

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Interface

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Program Memory Size

Connectivity

Architecture

Data Bus Width

Number of Inputs

Seated Height-Max

Programmable Logic Type

Core Architecture

Max Frequency

Primary Attributes

Number of Logic Cells

Number of Cores

Flash Size

Height Seated (Max)

Length

Width

RoHS Status

XCZU5CG-L2SFVC784E
XCZU5CG-L2SFVC784E

Xilinx Inc.

92

-

Datasheet

11 Weeks

-

784-BFBGA, FCBGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

252

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC CG

-

-

Active

4 (72 Hours)

784

-

-

-

-

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

8542.31.00.01

-

BOTTOM

BALL

-

0.72V

-

-

-

-

-

S-PBGA-B784

-

-

-

-

-

-

-

533MHz, 1.3GHz

256KB

MICROPROCESSOR CIRCUIT

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

XCZU3EG-1SBVA484E
XCZU3EG-1SBVA484E

Xilinx Inc.

583

-

Datasheet

11 Weeks

-

484-BFBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

82

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

-

-

-

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

5CSXFC6D6F31C8N
5CSXFC6D6F31C8N

Intel

3000

-

Datasheet

8 Weeks

-

896-BGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

MCU - 181, FPGA - 288

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~85°C TJ

Tray

2018

Cyclone® V SX

e1

-

Active

3 (168 Hours)

896

-

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

8542.39.00.01

-

BOTTOM

BALL

NOT SPECIFIED

1.1V

1mm

-

-

NOT SPECIFIED

5CSXFC6

S-PBGA-B896

288

Not Qualified

1.13V

1.11.2/3.32.5V

-

1.07V

-

600MHz

64KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

288

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

FPGA - 110K Logic Elements

110000

-

-

-

-

-

RoHS Compliant

XCZU4EG-1FBVB900E
XCZU4EG-1FBVB900E

Xilinx Inc.

2480

-

Datasheet

11 Weeks

-

900-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

204

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

-

-

-

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

XCZU6EG-3FFVB1156E
XCZU6EG-3FFVB1156E

Xilinx Inc.

260

-

Datasheet

11 Weeks

-

1156-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

328

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

-

-

-

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

600MHz, 1.5GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

XCZU7CG-1FFVC1156I
XCZU7CG-1FFVC1156I

Xilinx Inc.

828

-

Datasheet

11 Weeks

-

1156-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

360

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC CG

-

-

Active

4 (72 Hours)

-

-

-

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

500MHz, 1.2GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

XCZU5EV-1SFVC784I
XCZU5EV-1SFVC784I

Xilinx Inc.

200

-

Datasheet

11 Weeks

-

784-BFBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

252

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EV

-

-

Active

4 (72 Hours)

-

-

-

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

XCZU7EV-2FBVB900E
XCZU7EV-2FBVB900E

Xilinx Inc.

1500

-

Datasheet

11 Weeks

-

900-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

204

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EV

-

yes

Active

4 (72 Hours)

-

-

-

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

533MHz, 600MHz, 1.3GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

XC7Z030-2SB485I
XC7Z030-2SB485I

Xilinx Inc.

2473

-

Datasheet

11 Weeks

-

484-FBGA, FCBGA

-

485

485-FCBGA (19x19)

-

-

-

-

-

-

-

-

-

ROMless

-

-

-

-

130

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2009

Zynq®-7000

-

-

Active

3 (168 Hours)

-

-

-

100°C

-40°C

-

-

-

-

-

-

-

-

-

800MHz

-

-

-

-

-

-

-

-

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

800MHz

256KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32b

-

-

-

ARM

800MHz

Kintex™-7 FPGA, 125K Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

XCZU9CG-1FFVC900I
XCZU9CG-1FFVC900I

Xilinx Inc.

600

-

Datasheet

11 Weeks

-

900-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

204

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale+™ MPSoC CG

-

-

Active

4 (72 Hours)

-

-

-

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

500MHz, 1.2GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

XCZU4CG-1SFVC784E
XCZU4CG-1SFVC784E

Xilinx Inc.

1386

-

Datasheet

11 Weeks

-

784-BFBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

252

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC CG

-

-

Active

4 (72 Hours)

-

-

-

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

500MHz, 1.2GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

XCZU9EG-1FFVC900I
XCZU9EG-1FFVC900I

Xilinx Inc.

301

-

Datasheet

11 Weeks

-

900-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

204

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

-

-

-

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

XAZU3EG-1SFVC784Q
XAZU3EG-1SFVC784Q

Xilinx Inc.

2000

-

Datasheet

11 Weeks

-

784-BFBGA, FCBGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

128

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~125°C TJ

Tray

-

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

784

-

-

-

-

-

8542.31.00.01

-

BOTTOM

BALL

NOT SPECIFIED

0.85V

0.8mm

-

-

NOT SPECIFIED

-

S-PBGA-B784

-

-

-

-

-

-

-

500MHz, 1.2GHz

1.8MB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, I2C, SPI, UART/USART, USB

MPU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

-

-

3.32mm

23mm

23mm

ROHS3 Compliant

XCZU4CG-L2SFVC784E
XCZU4CG-L2SFVC784E

Xilinx Inc.

667

-

Datasheet

11 Weeks

-

784-BFBGA, FCBGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

252

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC CG

-

-

Active

4 (72 Hours)

784

-

-

-

-

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

8542.31.00.01

-

BOTTOM

BALL

-

0.72V

-

-

-

-

-

S-PBGA-B784

-

-

-

-

-

-

-

500MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

XCZU6CG-2FFVC900E
XCZU6CG-2FFVC900E

Xilinx Inc.

300

-

Datasheet

11 Weeks

-

900-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

204

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC CG

-

yes

Active

4 (72 Hours)

-

-

-

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

533MHz, 1.3GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

M2S050TS-1FGG484M
M2S050TS-1FGG484M

Microchip Technology

2633
  • 1:$438.876091
  • 10:$414.034049
  • 100:$390.598159
  • 500:$368.488829
    • View all price
-

-

Production (Last Updated: 2 months ago)

FPBGA-484

YES

-

484-FPBGA (23x23)

484

M2S050

64 kB

60

MICROSEMI CORP

-

-

M2S050TS-1FGG484M

166 MHz

-

Microchip Technology

Yes

3

SMD/SMT

267

4695 LAB

56340 LE

125 °C

-55 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

40

5.81

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

-55°C ~ 125°C (TJ)

Tray

-

SmartFusion2

e1

-

-

-

-

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

-

-

-

8542.39.00.01

CMOS

BOTTOM

BALL

250

-

1 mm

compliant

-

-

-

S-PBGA-B484

267

Not Qualified

-

1.2 V

MILITARY

-

-

166MHz

64KB

-

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

267

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

-

-

FPGA - 50K Logic Modules

56340

1 Core

256KB

-

23 mm

23 mm

-

XCZU11EG-2FFVB1517I
XCZU11EG-2FFVB1517I

Xilinx Inc.

In Stock

-

Datasheet

11 Weeks

-

1517-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

488

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

-

-

-

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

533MHz, 600MHz, 1.3GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

XCZU9EG-1FFVB1156E
XCZU9EG-1FFVB1156E

Xilinx Inc.

220

-

Datasheet

11 Weeks

-

1156-BBGA, FCBGA

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

328

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

0°C~100°C TJ

Tray

2013

Zynq® UltraScale+™ MPSoC EG

-

-

Active

4 (72 Hours)

-

-

-

-

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

-

-

-

NOT SPECIFIED

-

-

-

-

-

-

-

-

-

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

-

-

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

-

-

-

-

-

ROHS3 Compliant

5CSEBA4U19I7N
5CSEBA4U19I7N

Intel

39

-

Datasheet

8 Weeks

-

484-FBGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

MCU - 151, FPGA - 66

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2018

Cyclone® V SE

-

-

Active

3 (168 Hours)

484

-

-

-

-

-

8542.39.00.01

-

BOTTOM

BALL

NOT SPECIFIED

1.1V

0.8mm

-

-

NOT SPECIFIED

5CSEBA4

S-PBGA-B484

66

Not Qualified

1.13V

1.11.2/3.32.5V

-

1.07V

-

800MHz

64KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

66

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

FPGA - 40K Logic Elements

40000

-

-

1.9mm

19mm

19mm

RoHS Compliant

5CSEBA5U23I7
5CSEBA5U23I7

Intel

2238

-

Datasheet

8 Weeks

-

672-FBGA

YES

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

MCU - 181, FPGA - 145

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-40°C~100°C TJ

Tray

2018

Cyclone® V SE

-

-

Active

3 (168 Hours)

672

-

-

-

-

-

8542.39.00.01

-

BOTTOM

BALL

NOT SPECIFIED

1.1V

0.8mm

-

-

NOT SPECIFIED

-

S-PBGA-B672

145

Not Qualified

1.13V

1.11.2/3.32.5V

-

1.07V

-

800MHz

64KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

145

-

FIELD PROGRAMMABLE GATE ARRAY

-

-

FPGA - 85K Logic Elements

85000

-

-

1.85mm

23mm

23mm

RoHS Compliant

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