- Manufacturer
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Base Product Number | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Mfr | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Product Status | RoHS | Shipping Restrictions | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Size | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Boundary Scan | RAM (words) | Primary Attributes | Number of Logic Cells | Number of Cores | Bus Compatibility | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 5CSEBA5U23I7 Intel | 2238 | - | Datasheet | 8 Weeks | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | - | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 85K Logic Elements | 85000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
 XC7Z030-1SB485I Xilinx Inc. | 2048 | - | Datasheet | 11 Weeks | - | 484-FBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | -40°C~100°C TJ | Bulk | 2009 | Zynq®-7000 | - | no | Active | 2A (4 Weeks) | 485 | - | GPIO WITH FOUR 32-BIT BANKS | 8542.39.00.01 | BOTTOM | BALL | - | - | - | - | - | S-PBGA-B485 | - | - | - | - | - | 667MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | YES | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | - | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | - | - | - | - | ROHS3 Compliant | ||
 5CSEBA5U19C8N Intel | In Stock | - | Datasheet | 8 Weeks | - | 484-FBGA | YES | - | - | - | - | - | - | - | - | - | - | MCU - 151, FPGA - 66 | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 484 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA5 | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 600MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 85K Logic Elements | 85000 | - | - | - | 1.9mm | 19mm | 19mm | RoHS Compliant | ||
 XCZU7EV-L2FFVF1517E Xilinx Inc. | 110 | - | Datasheet | 11 Weeks | - | 1517-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | 464 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B1517 | - | - | 0.742V | - | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 10AS048H4F34E3SG Intel | In Stock | - | Datasheet | 11 Weeks | - | 1152-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | 492 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | - | S-PBGA-B1152 | 492 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 125MHz | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 480K Logic Elements | 480000 | - | - | - | 3.65mm | 35mm | 35mm | RoHS Compliant | ||
 10AS016C4U19I3SG Intel | In Stock | - | Datasheet | 8 Weeks | - | 484-BFBGA | YES | - | - | - | - | - | - | - | - | - | - | 192 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | 484 | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 0.8mm | NOT SPECIFIED | - | S-PBGA-B484 | 192 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 160K Logic Elements | 160000 | - | - | - | 3.25mm | 19mm | 19mm | RoHS Compliant | ||
5CSEMA2U23C8N Intel | 3000 | - | Datasheet | 8 Weeks | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | - | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 600MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 25K Logic Elements | 25000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
10AS027H3F34I2LG Intel | 3000 | - | Datasheet | 8 Weeks | - | 1152-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | 384 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | - | S-PBGA-B1152 | 384 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 270K Logic Elements | 270000 | - | - | - | 3.65mm | 35mm | 35mm | RoHS Compliant | ||
XCZU7EG-1FBVB900I Xilinx Inc. | 1452 | - | Datasheet | 11 Weeks | - | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XC7Z014S-1CLG484C Xilinx Inc. | 3000 | - | Datasheet | 10 Weeks | - | 484-LFBGA, CSPBGA | YES | - | - | - | - | - | - | - | - | - | - | 200 | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 484 | Matte Tin (Sn) | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | NOT SPECIFIED | - | S-PBGA-B484 | - | - | 1.05V | - | 0.95V | 667MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | YES | 256000 | Artix™-7 FPGA, 65K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 19mm | 19mm | ROHS3 Compliant | ||
 XCZU6CG-1FFVB1156E Xilinx Inc. | 632 | - | Datasheet | 11 Weeks | - | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | 328 | - | - | - | - | - | - | 0°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
M2S025T-1FGG484M Microchip Technology | In Stock | - | - | - | Production (Last Updated: 2 months ago) | FPBGA-484 | - | 484-FPBGA (23x23) | M2S025 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 2308 LAB | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TJ) | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | FPGA - 25K Logic Modules | - | 1 Core | - | 256KB | - | - | - | - | ||
5CSEBA4U23C6N Intel | 39 |
| Datasheet | 8 Weeks | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | - | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 925MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 40K Logic Elements | 40000 | - | - | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
 XCZU6EG-2FFVC900E Xilinx Inc. | 995 | - | Datasheet | 11 Weeks | - | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | yes | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU7EG-3FBVB900E Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 600MHz, 667MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
5CSEBA6U19I7N Intel | 2388 | - | Datasheet | 8 Weeks | - | 484-FBGA | YES | - | - | - | - | - | - | - | - | - | - | MCU - 151, FPGA - 66 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 484 | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA6 | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 110K Logic Elements | 110000 | - | - | - | 1.9mm | 19mm | 19mm | RoHS Compliant | ||
XCZU4EG-2FBVB900E Xilinx Inc. | 950 | - | Datasheet | 11 Weeks | - | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | yes | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XCZU4EG-2SFVC784I Xilinx Inc. | 860 | - | Datasheet | 11 Weeks | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU11EG-1FFVC1760E Xilinx Inc. | 410 | - | Datasheet | 11 Weeks | - | 1760-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | 512 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU3EG-L1SFVC784I Xilinx Inc. | 4 | - | Datasheet | 11 Weeks | - | 784-BFBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | 784 | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | - | R-PBGA-B784 | - | - | 0.742V | - | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant |