- Manufacturer
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
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- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | RoHS | Shipping Restrictions | Tradename | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Size | Propagation Delay | Connectivity | Architecture | Data Bus Width | Core Architecture | Number of Gates | Max Frequency | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of Registers | Number of Cores | Bus Compatibility | UV Erasable | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 XC7Z010-2CLG400I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 400-LFBGA, CSPBGA | YES | 400 | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 766MHz | 30 | XC7Z010 | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | - | YES | -2 | 256000 | Artix™-7 FPGA, 28K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | - | No | ROHS3 Compliant | ||
 XC7Z030-1FBG676C Xilinx Inc. | 5120 |
| Datasheet | 10 Weeks | Copper, Silver, Tin | - | 676-BBGA, FCBGA | YES | 676 | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z030 | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | - | YES | -1 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.54mm | 27mm | - | No | ROHS3 Compliant | ||
XC7Z020-2CLG400I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 400-LFBGA, CSPBGA | YES | 400 | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 766MHz | 30 | XC7Z020 | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | - | YES | -2 | 256000 | Artix™-7 FPGA, 85K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | - | No | ROHS3 Compliant | ||
XC7Z035-2FFG676I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 676-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | - | S-PBGA-B676 | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | 100 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | ARM | - | - | YES | 2 | - | Kintex™-7 FPGA, 275K Logic Cells | 343800 | - | - | - | 3.37mm | - | - | - | ROHS3 Compliant | ||
XC7Z045-2FFG676I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | ROMless | - | - | - | 130 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B676 | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | - | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 3.37mm | 27mm | - | No | ROHS3 Compliant | ||
 XC7Z035-2FFG900I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | - | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | - | S-PBGA-B900 | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | 100 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | ARM | - | - | YES | 2 | - | Kintex™-7 FPGA, 275K Logic Cells | 343800 | - | - | - | 3.35mm | 31mm | 31mm | - | ROHS3 Compliant | ||
XC7Z045-3FFG900E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 900-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | ROMless | - | - | - | 130 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 1GHz | 30 | XC7Z045 | S-PBGA-B900 | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | - | YES | -3 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 3.35mm | 31mm | - | No | ROHS3 Compliant | ||
 XC7Z015-2CLG485I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 484-LFBGA, CSPBGA | - | 485 | 485-CSBGA (19x19) | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | - | - | Active | 3 (168 Hours) | - | - | - | 100°C | -40°C | - | - | - | - | - | - | - | 766MHz | - | - | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 766MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | 766MHz | - | - | - | Artix™-7 FPGA, 74K Logic Cells | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 A2F500M3G-FGG484 Atmel (Microchip Technology) | In Stock | - | - | - | - | - | FPBGA-484 | - | - | - | 64 kB | 60 | - | - | 80 MHz | + 85 C | - | 0 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Details | This product may require additional documentation to export from the United States. | SmartFusion | - | - | Tray | - | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | - | - | - | 16.5 mA | - | - | - | - | - | - | 512 kB | - | - | - | - | - | 500000 | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | ||
 XC7Z030-1FBG484I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 484-BBGA, FCBGA | YES | 484 | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 667MHz | 30 | XC7Z030 | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | - | YES | -1 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.54mm | 23mm | - | No | ROHS3 Compliant | ||
XC7Z010-2CLG400E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 400-LFBGA, CSPBGA | YES | 400 | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 766MHz | - | XC7Z010 | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | - | YES | -2 | 256000 | Artix™-7 FPGA, 28K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | - | No | ROHS3 Compliant | ||
A2F500M3G-FGG484I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | FPBGA-484 | - | - | - | 64 kB | 60 | - | - | 80 MHz | + 100 C | - | - 40 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Details | - | SmartFusion | 0.062696 oz | - | Tray | - | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | - | - | - | 16.5 mA | - | - | - | - | - | - | 512 kB | - | - | - | - | - | 500000 | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | ||
 XC7Z010-1CLG225C Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 225-LFBGA, CSPBGA | YES | 225 | - | - | - | - | - | - | - | - | - | - | - | 86 | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | 30 | XC7Z010 | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | - | YES | -1 | 256000 | Artix™-7 FPGA, 28K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.5mm | 13mm | - | No | ROHS3 Compliant | ||
XC7Z035-1FFG676I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 676-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1V | - | 667MHz | NOT SPECIFIED | - | S-PBGA-B676 | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | 120 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | ARM | - | - | YES | 1 | 256000 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 3.37mm | 27mm | 27mm | - | ROHS3 Compliant | ||
XC7Z045-2FFG676E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | ROMless | - | - | - | 130 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B676 | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | - | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 3.37mm | 27mm | - | No | ROHS3 Compliant | ||
A2F200M3F-FGG256I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | FPBGA-256 | - | - | - | 64 kB | 90 | - | - | 80 MHz | + 100 C | - | - 40 C | Yes | SMD/SMT | 117 I/O | - | 2000 LE | Details | - | SmartFusion | 0.690329 oz | - | Tray | - | A2F200 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.5 V | - | - | - | - | - | - | 7 mA | - | - | - | - | - | - | 256 kB | - | - | - | - | - | 200000 | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | ||
XC7Z007S-2CLG400E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | 400-LFBGA, CSPBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | 100 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 400 | - | Matte Tin (Sn) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B400 | - | - | 1.05V | - | 0.95V | - | - | - | - | 766MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | YES | - | 256000 | Artix™-7 FPGA, 23K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | 17mm | - | ROHS3 Compliant | ||
XC7Z045-2FFG900E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 900-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | ROMless | - | - | - | 130 | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B900 | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | - | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 3.35mm | 31mm | - | No | ROHS3 Compliant | ||
 XC7Z030-1SBG485C Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 484-FBGA, FCBGA | YES | 485 | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 667MHz | NOT SPECIFIED | - | - | Not Qualified | - | 1.05V | 11.8V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | - | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | - | YES | -1 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | N | 2.44mm | 19mm | - | - | ROHS3 Compliant | ||
XC7Z007S-1CLG225C Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | 225-LFBGA, CSPBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | 54 | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2016 | Zynq®-7000 | e1 | yes | Active | 3 (168 Hours) | 225 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 30 | - | S-PBGA-B225 | - | - | 1.05V | - | 0.95V | - | - | - | - | 667MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | ARM | - | - | YES | - | 256000 | Artix™-7 FPGA, 23K Logic Cells | - | - | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | - | 1.5mm | 13mm | 13mm | - | ROHS3 Compliant |