- Manufacturer
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Connectivity | Architecture | Data Bus Width | Number of Inputs | Programmable Logic Type | Core Architecture | Boundary Scan | RAM (words) | Primary Attributes | Number of Logic Cells | Bus Compatibility | UV Erasable | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 XCZU6EG-2FFVC900I Xilinx Inc. | 227 | - | Datasheet | 11 Weeks | - | - | 900-BBGA, FCBGA | - | - | - | 204 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
 XCZU7EG-2FFVC1156I Xilinx Inc. | 50 | - | Datasheet | 11 Weeks | - | - | 1156-BBGA, FCBGA | - | - | - | 360 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU6EG-2FFVB1156I Xilinx Inc. | 2000 | - | Datasheet | 11 Weeks | - | - | 1156-BBGA, FCBGA | - | - | - | 328 | - | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
 XCZU5CG-1SFVC784E Xilinx Inc. | 1000 | - | Datasheet | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | 252 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU4CG-2SFVC784I Xilinx Inc. | 2480 | - | Datasheet | 11 Weeks | - | - | 784-BFBGA, FCBGA | YES | - | - | 252 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | 784 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | - | - | - | NOT SPECIFIED | S-PBGA-B784 | - | - | - | - | - | - | - | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
 10AS066H3F34I2LG Intel | In Stock | - | Datasheet | 8 Weeks | - | - | 1152-BBGA, FCBGA | YES | - | - | 492 | - | -40°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | - | - | NOT SPECIFIED | S-PBGA-B1152 | 492 | Not Qualified | - | 0.93V | 0.9V | 0.87V | - | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 492 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 660K Logic Elements | 660000 | - | - | 3.65mm | 35mm | 35mm | RoHS Compliant | ||
 XCZU3CG-1SBVA484I Xilinx Inc. | 2000 | - | Datasheet | 11 Weeks | - | - | 484-BFBGA, FCBGA | - | - | - | 82 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU2EG-L1SBVA484I Xilinx Inc. | 3000 | - | Datasheet | 11 Weeks | - | - | 484-BFBGA, FCBGA | YES | - | - | 82 | - | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | 484 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | - | NOT SPECIFIED | R-PBGA-B484 | - | - | - | 0.742V | - | 0.698V | - | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU6EG-L1FFVB1156I Xilinx Inc. | 234 | - | Datasheet | 11 Weeks | - | - | 1156-BBGA, FCBGA | YES | - | - | 328 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | - | NOT SPECIFIED | R-PBGA-B1156 | - | - | - | 0.742V | - | 0.698V | - | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
 XCZU4CG-2FBVB900E Xilinx Inc. | 1000 | - | Datasheet | 11 Weeks | - | - | 900-BBGA, FCBGA | - | - | - | 204 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 533MHz, 1.3GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU5CG-2SFVC784I Xilinx Inc. | 474 | - | Datasheet | 11 Weeks | - | - | 784-BFBGA, FCBGA | YES | - | - | 252 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | 784 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | - | - | - | NOT SPECIFIED | S-PBGA-B784 | - | - | - | - | - | - | - | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU7EV-3FBVB900E Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | 900-BBGA, FCBGA | - | - | - | 204 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 600MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
 XC7Z045-2FF900I Xilinx Inc. | 635 | - | Datasheet | 10 Weeks | - | - | 900-BBGA, FCBGA | YES | - | - | 130 | - | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | - | - | Active | 4 (72 Hours) | 900 | - | - | GPIO WITH FOUR 32-BIT BANKS | 8542.39.00.01 | BOTTOM | BALL | - | - | - | compliant | - | - | S-PBGA-B900 | - | - | - | - | - | - | - | 800MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | YES | 256000 | Kintex™-7 FPGA, 350K Logic Cells | - | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | - | - | - | - | Non-RoHS Compliant | ||
XCZU5EV-2SFVC784I Xilinx Inc. | 195 | - | Datasheet | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | 252 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU7EV-3FFVC1156E Xilinx Inc. | 4500 | - | Datasheet | 11 Weeks | - | - | 1156-BBGA, FCBGA | - | - | - | 360 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 600MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
 XA7Z010-1CLG225Q Xilinx Inc. | 3000 | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 225-LFBGA, CSPBGA | - | 225 | - | 86 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | - | Active | 3 (168 Hours) | 225 | EAR99 | TIN SILVER COPPER | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | 667MHz | NOT SPECIFIED | - | - | Not Qualified | 1V | - | 11.8V | - | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | ARM | - | - | Artix™-7 FPGA, 28K Logic Cells | - | - | N | 1.5mm | 13mm | - | ROHS3 Compliant | ||
XCZU4EG-3SFVC784E Xilinx Inc. | 155 | - | Datasheet | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | 252 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 600MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU3EG-L2SFVC784E Xilinx Inc. | 349 | - | Datasheet | 11 Weeks | - | - | 784-BFBGA, FCBGA | YES | - | - | 252 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | 784 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | - | NOT SPECIFIED | R-PBGA-B784 | - | - | - | 0.742V | - | 0.698V | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU3EG-2SBVA484I Xilinx Inc. | 115 | - | Datasheet | 11 Weeks | - | - | 484-BFBGA, FCBGA | - | - | 484-FCBGA (19x19) | 82 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU9CG-2FFVC900E Xilinx Inc. | 657 | - | Datasheet | 11 Weeks | - | - | 900-BBGA, FCBGA | - | - | - | 204 | - | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC CG | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 533MHz, 1.3GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | - | ROHS3 Compliant |