- Manufacturer
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Core Architecture | Boundary Scan | RAM (words) | Primary Attributes | Number of Logic Cells | Bus Compatibility | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 XC7Z020-1CLG400CES Xilinx Inc. | 652 | - | Datasheet | 7 Weeks | 400-LFBGA, CSPBGA | - | 400-CSPBGA (17x17) | 130 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | - | Obsolete | 3 (168 Hours) | - | 85°C | 0°C | - | - | - | - | - | - | - | 667MHz | - | XC7Z020 | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | ARM | - | - | Artix™-7 FPGA, 85K Logic Cells | - | - | - | - | - | RoHS Compliant | ||
 5CSEBA6U23C6N Intel | 2152 | - | Datasheet | 8 Weeks | 672-FBGA | YES | - | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | Active | 3 (168 Hours) | 672 | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | NOT SPECIFIED | 5CSEBA6 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | - | 925MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 110K Logic Elements | 110000 | - | 1.85mm | 23mm | 23mm | RoHS Compliant | ||
 XCZU6EG-2FFVB1156E Xilinx Inc. | 2000 | - | Datasheet | 11 Weeks | 1156-BBGA, FCBGA | - | - | 328 | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
 10AS057H2F34E2LG Intel | In Stock | - | Datasheet | 12 Weeks | 1152-BBGA, FCBGA | YES | - | 492 | 0°C~100°C TJ | Tray | - | Arria 10 SX | - | Active | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | - | NOT SPECIFIED | - | S-PBGA-B1152 | 492 | Not Qualified | 0.93V | 0.9V | 0.87V | - | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 570K Logic Elements | 570000 | - | 3.65mm | 35mm | 35mm | RoHS Compliant | ||
XCZU9EG-L2FFVB1156E Xilinx Inc. | 300 | - | Datasheet | 11 Weeks | 1156-BBGA, FCBGA | YES | - | 328 | 0°C~100°C TJ | Bulk | 2013 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B1156 | - | - | 0.742V | - | 0.698V | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
 XCZU9EG-L1FFVC900I Xilinx Inc. | 30 | - | Datasheet | 11 Weeks | 900-BBGA, FCBGA | YES | - | 204 | -40°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | 900 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B900 | - | - | 0.742V | - | 0.698V | - | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
 XC7Z100-2FF900I Xilinx Inc. | 2000 | - | Datasheet | 10 Weeks | 900-BBGA, FCBGA | - | - | 212 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | - | Active | 4 (72 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Kintex™-7 FPGA, 444K Logic Cells | - | - | - | - | - | Non-RoHS Compliant | ||
XCZU11EG-2FFVC1156I Xilinx Inc. | 44 | - | Datasheet | 11 Weeks | 1156-BBGA, FCBGA | - | - | 360 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
XCZU6CG-1FFVC900I Xilinx Inc. | 450 | - | Datasheet | 11 Weeks | 900-BBGA, FCBGA | - | - | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
10AS057H2F34E1SG Intel | In Stock | - | Datasheet | - | 1152-BBGA, FCBGA | YES | - | 492 | 0°C~100°C TJ | Tray | - | Arria 10 SX | - | Discontinued | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | - | NOT SPECIFIED | - | S-PBGA-B1152 | 492 | Not Qualified | 0.93V | 0.9V | 0.87V | - | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 570K Logic Elements | 570000 | - | 3.65mm | 35mm | 35mm | RoHS Compliant | ||
 XC7Z015-1CL485I Xilinx Inc. | 2990 | - | Datasheet | 10 Weeks | 484-LFBGA, CSPBGA | YES | - | 130 | -40°C~100°C TJ | Bulk | 2010 | Zynq®-7000 | no | Active | 2A (4 Weeks) | 485 | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B485 | - | - | 1.05V | - | 0.95V | - | 667MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | YES | 256000 | Artix™-7 FPGA, 74K Logic Cells | - | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | 1.6mm | 19mm | 19mm | Non-RoHS Compliant | ||
 XCZU7EG-L2FFVF1517E Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | 1517-BBGA, FCBGA | YES | - | 464 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B1517 | - | - | 0.742V | - | 0.698V | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
 XCZU4EG-L1SFVC784I Xilinx Inc. | 100 | - | Datasheet | 11 Weeks | 784-BFBGA, FCBGA | YES | - | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | 784 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B784 | - | - | 0.742V | - | 0.698V | - | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
XCZU5EV-1FBVB900E Xilinx Inc. | 155 | - | Datasheet | 11 Weeks | 900-BBGA, FCBGA | - | - | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
 5CSEBA4U19A7N Intel | 2196 | - | Datasheet | 8 Weeks | 484-FBGA | YES | - | MCU - 151, FPGA - 66 | -40°C~125°C TJ | Tray | - | Automotive, AEC-Q100, Cyclone® V SE | - | Active | 3 (168 Hours) | 484 | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | - | 700MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | FPGA - 40K Logic Elements | 40000 | - | 1.9mm | 19mm | 19mm | RoHS Compliant | ||
XAZU2EG-1SFVC784Q Xilinx Inc. | 36463 | - | Datasheet | 11 Weeks | 784-BFBGA, FCBGA | YES | - | 128 | -40°C~125°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | 784 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B784 | - | - | - | - | - | - | 500MHz, 1.2GHz | 1.2MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | 3.32mm | 23mm | 23mm | ROHS3 Compliant | ||
XCZU7EV-2FFVF1517I Xilinx Inc. | 400 | - | Datasheet | 11 Weeks | 1517-BBGA, FCBGA | - | - | 464 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
XCZU5EV-L2SFVC784E Xilinx Inc. | 808 | - | Datasheet | 11 Weeks | 784-BFBGA, FCBGA | YES | - | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | Active | 4 (72 Hours) | 784 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B784 | - | - | 0.742V | - | 0.698V | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
XCZU5EV-3SFVC784E Xilinx Inc. | 356 | - | Datasheet | 11 Weeks | 784-BFBGA, FCBGA | - | - | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | 600MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant | ||
XCZU5EG-2SFVC784E Xilinx Inc. | 343 | - | Datasheet | 11 Weeks | 784-BFBGA, FCBGA | - | 784-FCBGA (23x23) | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | - | ROHS3 Compliant |