- Manufacturer
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | RoHS | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Architecture | Data Bus Width | Number of Inputs | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Bus Compatibility | UV Erasable | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 XC7Z035-1FBG676C Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 676-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 676 | - | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | BOTTOM | BALL | NOT SPECIFIED | 1V | - | 667MHz | NOT SPECIFIED | - | - | S-PBGA-B676 | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | 120 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | ARM | YES | 1 | 256000 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.54mm | 27mm | 27mm | - | ROHS3 Compliant | ||
XC7Z035-1FBG676I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 667MHz | NOT SPECIFIED | - | - | S-PBGA-B676 | - | - | - | 1.05V | - | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | ARM | YES | - | 256000 | Kintex™-7 FPGA, 275K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.54mm | 27mm | 27mm | - | ROHS3 Compliant | ||
 5CSEBA2U19I7N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | 484-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 151, FPGA - 66 | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 484 | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | NOT SPECIFIED | 5CSEBA2 | - | S-PBGA-B484 | 66 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | 1.07V | - | - | - | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 66 | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 25K Logic Elements | - | 25000 | - | - | - | 1.9mm | 19mm | 19mm | - | RoHS Compliant | ||
XC7Z030-2FBG676E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 676-BBGA, FCBGA | YES | 676 | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z030 | - | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.54mm | 27mm | - | No | ROHS3 Compliant | ||
 XC7Z010-3CLG225E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | 225-LFBGA, CSPBGA | YES | 225 | - | - | - | - | - | - | - | - | - | - | - | 86 | - | - | - | - | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 866MHz | 30 | XC7Z010 | - | - | - | - | - | 1.05V | - | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | YES | -3 | 256000 | Artix™-7 FPGA, 28K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.5mm | 13mm | - | No | ROHS3 Compliant | ||
 XC7Z020-3CLG484E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 484-LFBGA, CSPBGA | YES | 484 | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 866MHz | 30 | XC7Z020 | - | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | YES | -3 | 256000 | Artix™-7 FPGA, 85K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 19mm | - | No | ROHS3 Compliant | ||
 M2S010-TQG144I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | TQFP-144 | - | - | 64 kB | 400 kbit | 60 | - | - | 166 MHz | + 100 C | - | - 40 C | Yes | SMD/SMT | 84 I/O | 1007 LAB | 12084 LE | Details | 0.035380 oz | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | 256 kB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | ||
 XC7Z035-2FFG900E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | - | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | - | - | S-PBGA-B900 | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | 100 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | ARM | YES | 2 | - | Kintex™-7 FPGA, 275K Logic Cells | 343800 | - | - | - | - | 3.35mm | 31mm | 31mm | - | ROHS3 Compliant | ||
 XC7Z010-3CLG400E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 400-LFBGA, CSPBGA | YES | 400 | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 866MHz | 30 | XC7Z010 | - | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | YES | -3 | 256000 | Artix™-7 FPGA, 28K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | - | No | ROHS3 Compliant | ||
XC7Z035-2FFG676E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 676-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | - | - | S-PBGA-B676 | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | 110 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | ARM | YES | 2 | - | Kintex™-7 FPGA, 275K Logic Cells | 343800 | - | - | - | - | 3.37mm | - | - | - | ROHS3 Compliant | ||
 XC7Z030-3FBG484E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 484-BBGA, FCBGA | YES | 484 | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 1GHz | 30 | XC7Z030 | - | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | YES | -3 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.54mm | 23mm | - | No | ROHS3 Compliant | ||
XC7Z045-1FFG676I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | ROMless | - | - | - | 130 | - | - | - | - | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | 676 | S-PBGA-B676 | - | - | 1V | 1.05V | 11.8V | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | N | 3.37mm | 27mm | - | No | ROHS3 Compliant | ||
M2S010-TQG144 Atmel (Microchip Technology) | In Stock | - | - | - | - | - | TQFP-144 | - | - | 64 kB | 400 kbit | 60 | - | - | 166 MHz | + 85 C | - | 0 C | Yes | SMD/SMT | 84 I/O | 1007 LAB | 12084 LE | Details | 0.035380 oz | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | 256 kB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | ||
XC7Z035-L2FBG676I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | - | - | S-PBGA-B676 | - | - | - | 1.05V | - | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | ARM | YES | - | 256000 | Kintex™-7 FPGA, 275K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.54mm | 27mm | 27mm | - | ROHS3 Compliant | ||
M2S005-VFG256I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | VFPBGA-256 | - | - | 64 kB | 191 kbit | 119 | - | - | 166 MHz | + 100 C | - | - 40 C | Yes | SMD/SMT | 161 I/O | 505 LAB | 6060 LE | Details | - | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | 128 kB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | ||
XC7Z045-1FFG900C Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 900-BBGA, FCBGA | YES | 900 | - | - | - | - | - | - | - | ROMless | - | - | - | 130 | - | - | - | - | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | - | - | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3.3V | 1.2V | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | 190000 | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 3.35mm | 31mm | - | No | ROHS3 Compliant | ||
XC7Z035-3FFG676E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | - | - | S-PBGA-B676 | - | - | - | 1.05V | - | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | ARM | YES | - | 256000 | Kintex™-7 FPGA, 275K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 3.37mm | 27mm | 27mm | - | ROHS3 Compliant | ||
XC7Z030-1FFG676C Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 676-BBGA, FCBGA | YES | 676 | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z030 | - | - | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 3.24mm | 27mm | - | No | ROHS3 Compliant | ||
XC7Z015-2CLG485E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 484-LFBGA, CSPBGA | - | 485 | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 766MHz | NOT SPECIFIED | - | - | - | - | Not Qualified | - | 1.05V | 11.8V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | YES | - | 256000 | Artix™-7 FPGA, 74K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | N | 1.6mm | 19mm | - | - | ROHS3 Compliant | ||
XC7Z045-1FBG676I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | - | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | ROMless | - | - | - | 130 | - | - | - | - | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | - | S-PBGA-B676 | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.54mm | 27mm | - | No | ROHS3 Compliant |