- Manufacturer
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Data RAM Size | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Architecture | Data Bus Width | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Core Architecture | Number of Gates | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Cores | Bus Compatibility | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 5CSXFC6D6F31C7N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | 896-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 288 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | - | - | Active | 3 (168 Hours) | 896 | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | - | - | NOT SPECIFIED | 5CSXFC6 | S-PBGA-B896 | 288 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | - | - | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 288 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 110K Logic Elements | - | - | 110000 | - | - | - | - | 2mm | 31mm | 31mm | - | RoHS Compliant | ||
 5CSEBA4U19C8SN Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | 484-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 151, FPGA - 66 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 484 | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 66 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | - | - | 600MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 66 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 40K Logic Elements | - | - | 40000 | - | - | - | - | 1.9mm | 19mm | 19mm | - | RoHS Compliant | ||
5CSEBA2U19I7SN Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | 484-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 151, FPGA - 66 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 484 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | 5CSEBA2 | S-PBGA-B484 | 66 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | - | - | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 66 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 25K Logic Elements | - | - | 25000 | - | - | - | - | 1.9mm | 19mm | 19mm | - | RoHS Compliant | ||
 XCZU15EG-2FFVB1156I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 328 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XCZU4EV-2SFVC784E Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | yes | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 5CSXFC6C6U23C7N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | - | - | Active | 3 (168 Hours) | 672 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | 5CSXFC6 | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | - | - | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 110K Logic Elements | - | - | 110000 | - | - | - | - | 1.85mm | 23mm | 23mm | - | RoHS Compliant | ||
5CSEBA2U23A7N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~125°C TJ | Tray | - | Automotive, AEC-Q100, Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | - | - | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 25K Logic Elements | - | - | 25000 | - | - | - | - | 1.85mm | 23mm | 23mm | - | RoHS Compliant | ||
 M2S090-1FGG484 Microchip Technology | In Stock | - | - | - | - | - | - | FPBGA-484 | - | 484-FPBGA (23x23) | - | M2S090 | - | 64 kB | - | - | 60 | - | - | - | - | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | SMD/SMT | 267 | 7193 LAB | 86316 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | 1.2000 V | - | 0 to 85 °C | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | - | - | 1 | - | FPGA - 90K Logic Modules | - | - | - | 1 Core | - | - | 512KB | - | - | - | - | - | ||
 XC7Z045-3FBG676E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | - | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROMless | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.39.00.01 | - | BOTTOM | BALL | 245 | 1V | 1mm | - | 1GHz | 30 | XC7Z045 | S-PBGA-B676 | - | - | 1V | 1.05V | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | - | ARM | - | YES | -3 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | - | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | 2.54mm | 27mm | - | No | ROHS3 Compliant | ||
XCZU4EV-2SFVC784I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XC7Z015-L1CLG485I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | 484-LFBGA, CSPBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | 667MHz | NOT SPECIFIED | - | S-PBGA-B485 | - | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | 120 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | ARM | - | YES | - | 256000 | Artix™-7 FPGA, 74K Logic Cells | 92400 | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | 1.6mm | 19mm | 19mm | - | ROHS3 Compliant | ||
XC7Z035-1FFG676C Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | - | 676-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | - | 667MHz | NOT SPECIFIED | - | S-PBGA-B676 | - | - | - | 1.05V | - | - | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | ARM | - | YES | - | 256000 | Kintex™-7 FPGA, 275K Logic Cells | - | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | 3.37mm | 27mm | 27mm | - | ROHS3 Compliant | ||
M2S050-FGG484 Atmel (Microchip Technology) | In Stock | - | - | - | - | - | - | BGA-484 | - | - | - | - | - | 64 kB | 1.314 Mbit | 64 kB | 60 | - | - | - | - | 166 MHz | - | + 85 C | - | - | - | 0 C | Yes | - | SMD/SMT | 267 I/O | 4695 LAB | 56340 LE | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | 256 kB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | - | ||
XCZU4CG-1SFVC784I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XCZU9EG-2FFVC900I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | - | 900-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | e1 | - | Active | 4 (72 Hours) | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
M2S005S-TQG144I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | - | TQFP-144 | - | - | - | - | - | 64 kB | - | - | 60 | - | - | - | - | 166 MHz | - | - | - | - | - | - | Yes | - | SMD/SMT | - | 505 LAB | 6060 LE | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0.046530 oz | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 128 kB | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | - | ||
A2F500M3G-1FG256 Microchip Technology | In Stock | - | - | - | - | - | - | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | A2F500 | 100 MHz | 64 kB | - | - | 90 | MICROSEMI CORP | - | - | A2F500M3G-1FG256 | 100 MHz | 1.575 V | + 85 C | - | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 117 I/O | - | 6000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | - | 0 to 85 °C | Tray | - | A2F500 | - | - | - | - | - | - | TIN LEAD/TIN LEAD SILVER | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | - | 1 mm | compliant | - | - | - | S-PBGA-B256 | 66 | Not Qualified | - | - | 1.5,1.8,2.5,3.3 V | OTHER | - | - | - | - | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | - | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | 66 | 11520 CLBS, 500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 500000 | - | 1 | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | 11520 | 11520 | 1 Core | - | 500000 | 512KB | - | 17 mm | 17 mm | - | - | ||
 XC7Z020-L1CLG400I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | 400-LFBGA, CSPBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 400 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | 667MHz | NOT SPECIFIED | - | S-PBGA-B400 | - | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | ARM | - | YES | - | 256000 | Artix™-7 FPGA, 85K Logic Cells | 106400 | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | 1.6mm | 17mm | 17mm | - | ROHS3 Compliant | ||
M2S060-1FCS325I Microchip Technology | In Stock | - | - | - | Production (Last Updated: 2 months ago) | - | - | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | - | 64 kB | - | - | 176 | MICROSEMI CORP | - | - | M2S060-1FCS325I | 166 MHz | - | - | - | Microchip Technology | - | - | Yes | - | - | 200 | 4710 LAB | 56520 LE | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | - | - | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | e0 | - | - | - | - | - | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | - | 0.5 mm | not_compliant | - | - | - | S-PBGA-B325 | 200 | Not Qualified | - | - | 1.2 V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 200 | - | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | 56520 | 1 Core | - | - | 256KB | - | 11 mm | 11 mm | - | - | ||
XC7Z030-L2FFG676I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | 676-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | - | 800MHz | NOT SPECIFIED | - | S-PBGA-B676 | - | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | 100 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | ARM | - | YES | - | 256000 | Kintex™-7 FPGA, 125K Logic Cells | 157200 | - | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | 3.24mm | 27mm | 27mm | - | ROHS3 Compliant |