- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | ROM(word) | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Number of ADC Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Number of Timers | Co-Processors/DSP | ROM Programmability | Number of Cores | Number of PWM Channels | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | On Chip Data RAM Width | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Number of USB Channels | Number of Ethernet Channels | Height | Height Seated (Max) | Length | Width | Thickness | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 MCIMX6Q5EYM12AD NXP USA Inc. | 889 |
| Datasheet | 15 Weeks | - | - | - | 624-LFBGA, FCBGA | YES | - | - | - | - | - | - | -20°C~105°C TJ | Tray | 2002 | i.MX6Q | e1 | - | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR | ARM® Cortex®-A9 | - | 24MHz | 64 | - | - | - | - | - | - | 26 | - | YES | YES | - | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | - | Multimedia; NEON™ SIMD | - | - | - | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | SATA 3Gbps (1) | - | - | - | 1.6mm | 21mm | - | - | ROHS3 Compliant | - | ||
 AM3505AZCNAC Texas Instruments | 10 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | Copper, Silver, Tin | - | 491-LFBGA | YES | 491 | - | 186 | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.2V | 0.65mm | 600MHz | - | AM3505 | 491 | - | - | 1.2V | - | - | - | 1.248V | I2S, USB | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 16 | - | - | 16b | - | - | 12 | - | ARM | YES | YES | - | - | FLOATING POINT | YES | 65536 | 1.8V 3.3V | 4 | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | - | - | Multimedia; NEON™ SIMD | - | 1 | - | - | - | - | - | Cryptography | LCD | - | - | - | - | 1.3mm | - | 17mm | 17mm | 900μm | ROHS3 Compliant | Lead Free | ||
 AT91SAM9G45B-CU Microchip Technology | 3 | - | Datasheet | 12 Weeks | - | Copper, Silver, Tin | Surface Mount | 324-TFBGA | - | 324 | ROM | 160 | 65536 | - | Yes | -40°C~85°C TA | Tray | 2009 | SAM9G | - | yes | Active | 3 (168 Hours) | 324 | - | - | - | BOTTOM | BALL | - | 1V | - | 400MHz | - | AT91SAM9G45 | - | - | - | - | - | - | - | - | EBI/EMI, Ethernet, I2C, MMC, SPI, UART, USART, USB | 3.6V | 900mV | 64kB | Internal | - | 64kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | - | 32 | YES | YES | 32b | - | - | 7 | - | ARM | - | - | - | - | - | - | - | 1.8V 3.3V | - | 8 | 10/100Mbps | 1 Core 32-Bit | No | LPDDR, LPSDR, DDR2, SDR, SRAM | USB 2.0 (3) | AC97, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | FLASH | - | 4 | - | - | - | - | - | LCD, Touchscreen | - | - | 2 | 1 | 800μm | - | 15.05mm | 15.05mm | - | ROHS3 Compliant | - | ||
 OMAPL137DZKB3 Texas Instruments | 1170 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | Copper, Silver, Tin | Surface Mount | 256-BGA | - | 256 | Cache | - | - | - | - | 0°C~90°C TJ | Tray | - | OMAP-L1x | e1 | yes | Active | 3 (168 Hours) | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.2V | - | 375MHz | - | OMAPL137 | - | - | - | 1.2V | - | - | - | - | SPI, USB | 1.32V | 1.14V | 32kB | - | - | 128kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | - | - | - | - | - | 16b | - | - | - | - | ARM | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 3.3V | 3 | - | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | - | 3 | Signal Processing; C674x, System Control; CP15 | - | 1 | - | - | NO | SINGLE | - | - | LCD | - | - | - | - | 2.05mm | - | 17mm | 17mm | 1.36mm | ROHS3 Compliant | Lead Free | ||
 MPC8270CVVUPEA NXP USA Inc. | 2307 | - | Datasheet | 18 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | - | - | -40°C~105°C TA | Tray | 1997 | MPC82xx | e1 | - | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | - | 40 | MPC8270 | - | S-PBGA-B480 | - | - | 1.6V | 1.53.3V | 1.45V | - | - | - | - | - | - | 450MHz | - | MICROPROCESSOR, RISC | PowerPC G2_LE | - | - | 32 | - | - | - | - | - | - | 32 | - | YES | YES | - | 64 | FLOATING POINT | YES | - | 3.3V | - | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | ROHS3 Compliant | - | ||
 MCIMX283CVM4B NXP USA Inc. | 11400 | - | Datasheet | 15 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2002 | i.MX28 | e1 | - | Active | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | MCIMX283 | - | S-PBGA-B289 | - | - | 1.55V | - | 1.35V | - | - | - | - | - | - | 454MHz | - | MULTIFUNCTION PERIPHERAL | ARM926EJ-S | - | 24MHz | - | - | - | - | - | - | - | - | - | YES | - | - | - | - | - | 128000 | 1.8V 3.3V | - | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 4 | - | Data; DCP | - | - | - | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | - | - | - | Boot Security, Cryptography, Hardware ID | Keypad, LCD, Touchscreen | - | - | - | - | - | 1.37mm | 14mm | - | - | ROHS3 Compliant | - | ||
 MPC8308VMAGDA NXP USA Inc. | 5000 | - | - | 10 Weeks | - | - | - | 473-LFBGA | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 473 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | - | - | - | 40 | MPC8308 | - | S-PBGA-B473 | - | - | - | - | - | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC e300c3 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
AM4378BZDN100 Texas Instruments | 30000 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | Surface Mount | 491-LFBGA | - | 491 | - | - | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 1.325V | - | 1GHz | - | AM4378 | 491 | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | 32b | - | - | - | - | ARM | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 3.3V | 6 | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | - | - | Multimedia; NEON™ SIMD | - | 1 | - | - | - | - | - | Crypto Accelerator | TSC, WXGA | - | - | - | - | 1.3mm | - | 17mm | 17mm | 900μm | ROHS3 Compliant | Lead Free | ||
AM4378BZDNA100 Texas Instruments | 2000 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | - | Surface Mount | 491-LFBGA | - | 491 | - | - | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 1.325V | - | 1GHz | - | AM4378 | 491 | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | 32b | - | - | - | - | ARM | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 3.3V | 6 | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | - | - | Multimedia; NEON™ SIMD | - | 1 | - | - | - | - | - | Crypto Accelerator | TSC, WXGA | - | - | - | - | 1.3mm | - | 17mm | 17mm | 900μm | ROHS3 Compliant | Lead Free | ||
 AT91SAM9G25-CFU Microchip Technology | 1200 |
| Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | 247-LFBGA | - | 247 | ROM | 105 | - | - | Yes | -40°C~85°C TA | Tray | 2004 | SAM9G | - | yes | Active | 3 (168 Hours) | 247 | - | - | - | BOTTOM | BALL | - | 1V | 0.5mm | 400MHz | - | AT91SAM9G25 | - | - | - | - | - | 11.8/3.33.3V | - | - | 2-Wire, CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SPI, UART, USART, USB | 1.1V | 900mV | 64kB | Internal | - | 32kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, POR, PWM, WDT | - | 32 | YES | YES | 32b | YES | NO | 6 | 26 | ARM | - | - | - | - | - | - | - | 1.8V 3.3V | - | - | 10/100Mbps | 1 Core 32-Bit | No | DDR2, SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | FLASH | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.37mm | 10mm | - | - | ROHS3 Compliant | - | ||
 P2020NSN2MFC NXP USA Inc. | 5000 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | - | 40 | P2020 | - | S-PBGA-B689 | - | - | 1.1V | 1.05V | 1V | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 100MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | - | 16 | FLOATING POINT | YES | - | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.46mm | 31mm | - | - | ROHS3 Compliant | - | ||
 MPC8245LVV266D NXP USA Inc. | 70 | - | Datasheet | 12 Weeks | - | - | - | 352-LBGA | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 1998 | MPC82xx | e1 | - | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC8245 | - | S-PBGA-B352 | - | - | 2.1V | 23.3V | 1.7V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | PowerPC 603e | - | 66MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | - | 32 | FLOATING POINT | YES | - | 3.3V | - | - | - | 1 Core 32-Bit | No | SDRAM | - | I2C, I2O, PCI, UART | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.65mm | 35mm | - | - | ROHS3 Compliant | - | ||
AM4376BZDNA80 Texas Instruments | 30 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | - | Surface Mount | 491-LFBGA | - | 491 | - | - | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 1.26V | - | 800MHz | - | AM4376 | 491 | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | 32b | - | - | - | - | ARM | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 3.3V | 6 | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | - | - | Multimedia; NEON™ SIMD | - | 1 | - | - | - | - | - | Crypto Accelerator | TSC, WXGA | - | - | - | - | 1.3mm | - | 17mm | 17mm | 900μm | ROHS3 Compliant | Lead Free | ||
P2020NSE2MFC NXP USA Inc. | 1 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | - | 40 | P2020 | - | S-PBGA-B689 | - | - | 1.1V | 1.05V | 1V | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 100MHz | 32 | - | - | - | - | - | - | - | - | YES | YES | - | - | FIXED POINT | YES | - | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | Security; SEC 3.3 | - | - | - | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | - | - | 2.46mm | 31mm | - | - | ROHS3 Compliant | - | ||
 MCIMX6Q6AVT10AE NXP USA Inc. | 10000 | - | Datasheet | 12 Weeks | - | - | - | 624-FBGA, FCBGA | - | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | - | Multimedia; NEON™ SIMD | - | - | - | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | SATA 3Gbps (1) | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
MCIMX283DVM4B NXP USA Inc. | 1061 | - | Datasheet | 15 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | - | -20°C~70°C TA | Tray | 2002 | i.MX28 | e1 | - | Active | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | MCIMX283 | - | S-PBGA-B289 | - | - | 1.55V | - | 1.35V | - | - | - | - | - | - | 454MHz | - | MULTIFUNCTION PERIPHERAL | ARM926EJ-S | - | 24MHz | - | - | - | - | - | - | - | - | - | YES | - | - | - | - | - | 128000 | 1.8V 3.3V | - | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 4 | - | Data; DCP | - | - | - | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | - | - | - | Boot Security, Cryptography, Hardware ID | Keyboard, LCD, Touchscreen | - | - | - | - | - | 1.37mm | 14mm | - | - | ROHS3 Compliant | - | ||
 MPC8314VRAGDA NXP USA Inc. | 13 | - | Datasheet | 10 Weeks | - | - | - | 620-BBGA Exposed Pad | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8314 | - | S-PBGA-B620 | - | - | 1.05V | 13.3V | 0.95V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.46mm | 29mm | - | - | ROHS3 Compliant | - | ||
 MCIMX233CAG4C NXP USA Inc. | 810 |
| Datasheet | 15 Weeks | - | - | - | 128-LQFP | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2004 | i.MX23 | e3 | - | Active | 3 (168 Hours) | - | 5A992 | Matte Tin (Sn) | 8542.31.00.01 | - | - | 260 | - | - | - | 40 | MCIMX233 | - | - | - | - | - | - | - | - | - | - | - | - | - | 454MHz | - | MICROPROCESSOR | ARM926EJ-S | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.0V 2.5V 2.7V 3.0V 3.3V | - | - | - | 1 Core 32-Bit | No | DRAM | USB 2.0 + PHY (1) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | - | Data; DCP | - | - | - | - | - | - | - | Cryptography, Hardware ID | LCD, Touchscreen | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX356AJQ5C NXP USA Inc. | 159 |
| Datasheet | 15 Weeks | - | - | - | 400-LFBGA | YES | - | - | 3 | - | Automotive grade | - | -40°C~85°C TA | Tray | 2008 | i.MX35 | - | - | Active | 3 (168 Hours) | 400 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | NOT SPECIFIED | MCIMX356 | - | S-PBGA-B400 | Not Qualified | - | 1.47V | - | 1.33V | - | - | - | - | - | - | 532MHz | - | - | ARM1136JF-S | - | - | - | - | - | - | - | - | - | - | - | YES | - | AEC-Q100 | - | - | - | - | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | - | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART | - | - | Multimedia; GPU, IPU, VFP | - | - | - | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; SPI; UART; USB | - | - | - | Secure Fusebox, Secure JTAG | Keypad, KPP, LCD | - | - | - | - | - | 1.6mm | 17mm | - | - | ROHS3 Compliant | - | ||
 ATSAMA5D225C-D1M-CU Microchip Technology | 9822 | - | Datasheet | 4 Weeks | - | - | - | 196-TFBGA, CSBGA | YES | - | - | - | - | - | - | -40°C~85°C TA | Tray | - | SAMA5D2 | e2 | - | Active | 3 (168 Hours) | 196 | - | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | 8542.31.00.01 | BOTTOM | BALL | - | 1.8V | 0.75mm | - | - | ATSAMA5D225 | - | S-PBGA-B196 | - | - | 1.9V | - | 1.7V | - | - | - | - | - | - | 500MHz | 128kB | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | - | 24MHz | 16 | - | - | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | 65536 | 3.3V | - | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | 9 | - | Multimedia; NEON™ MPE | - | - | - | - | - | - | 16 | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 51 | - | - | - | - | 1.2mm | 11mm | - | - | ROHS3 Compliant | - |