- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | ROM(word) | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Number of Timers/Counters | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Number of ADC Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | ROM Programmability | Number of Cores | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 AT91SAM9G45C-CU-999 Microchip Technology | 20000 | - | Datasheet | 10 Weeks | - | Copper, Silver, Tin | Surface Mount | 324-TFBGA | - | 324 | ROM | 160 | 65536 | Yes | -40°C~85°C TA | Cut Tape (CT) | 2010 | SAM9G | - | yes | Active | 3 (168 Hours) | 324 | - | - | - | BOTTOM | BALL | - | 1V | - | 400MHz | - | AT91SAM9G45 | - | - | - | 3.3V | - | - | - | - | 2-Wire, EBI/EMI, Ethernet, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | 3.6V | 1.65V | 64kB | Internal | - | 64kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | - | 32 | YES | YES | 16b | YES | - | 7 | 26 | ARM | - | - | - | - | - | - | 1.8V 3.3V | - | 8 | 10/100Mbps | 1 Core 32-Bit | No | LPDDR, LPSDR, DDR2, SDR, SRAM | USB 2.0 (3) | AC97, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | - | FLASH | - | - | - | - | - | LCD, Touchscreen | - | - | 1.2mm | 15mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6G2AVM07AB NXP USA Inc. | 15 | - | Datasheet | 15 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6UL | - | - | Active | 3 (168 Hours) | 289 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | - | - | - | - | S-PBGA-B289 | - | - | 1.3V | - | 1.25V | - | - | - | - | - | - | 696MHz | - | MICROPROCESSOR | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | 26 | - | YES | YES | 16 | FIXED POINT | YES | - | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | - | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | - | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | - | - | 1.32mm | 14mm | - | - | - | - | ROHS3 Compliant | - | ||
 OMAPL138BZWTD4 Texas Instruments | 200 | - | Datasheet | - | - | - | Surface Mount | 361-LFBGA | - | 361 | - | 16 | - | - | -40°C~90°C TJ | Tube | - | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1V | 0.8mm | 456MHz | - | OMAPL138 | 361 | - | - | - | - | - | - | 1.35V | - | 1.35V | 950mV | - | - | - | - | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | - | - | - | - | - | 32b | - | - | 4 | - | ARM | YES | YES | - | FLOATING POINT | - | - | 1.8V 3.3V | 3 | - | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | - | - | - | NO | MULTIPLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | - | - | - | - | - | - | No SVHC | ROHS3 Compliant | Lead Free | ||
OMAPL132EZWTA2 Texas Instruments | 19 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | - | Surface Mount | 361-LFBGA | - | 361 | - | - | - | - | -40°C~105°C TJ | Tray | - | OMAP-L1x | e1 | yes | Active | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 200MHz | - | OMAPL132 | 361 | - | - | - | - | - | - | - | - | - | - | - | - | - | 328kB | MICROPROCESSOR CIRCUIT | ARM926EJ-S | - | - | - | - | - | 32b | - | - | - | - | ARM | - | - | - | - | - | - | 1.8V 3.3V | 3 | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 + PHY (1) | AC97, I2C, I2S, McASP, McBSP, MMC/SD/SDIO, SPI, UART | Signal Processing; C674x, System Control; CP15 | - | 1 | - | - | - | - | - | - | 1.4mm | - | 16mm | 16mm | 900μm | - | - | ROHS3 Compliant | Lead Free | ||
 AMIC110BZCZA Texas Instruments | 10000 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | - | - | 324-LFBGA | YES | 324 | - | 64 | 180224 | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 324 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | - | 0.8mm | - | - | AMIC110 | - | - | - | - | 3.6V | - | 3.3V | - | - | - | - | - | - | 300MHz | - | MICROCONTROLLER, RISC | ARM® Cortex®-A8 | - | 26MHz | 32 | YES | YES | - | YES | NO | - | - | - | - | - | - | - | - | - | 1.8V 3.3V | - | - | - | 1 Core 32-Bit | No | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | FLASH | - | - | - | - | - | - | - | 1.4mm | - | 15mm | 15mm | 900μm | - | - | ROHS3 Compliant | Lead Free | ||
 AM3505AZCNC Texas Instruments | 1 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Copper, Silver, Tin | - | 491-LFBGA | YES | 491 | - | 186 | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.2V | 0.65mm | 600MHz | - | AM3505 | 491 | - | - | 1.2V | - | - | - | 1.248V | I2S, USB | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 16 | - | - | 16b | - | - | 12 | - | ARM | YES | YES | - | FLOATING POINT | YES | 65536 | 1.8V 3.3V | 4 | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | - | 1 | - | - | - | Cryptography | LCD | - | 1.3mm | - | 17mm | 17mm | 900μm | - | - | ROHS3 Compliant | Lead Free | ||
 AM3517AZERA Texas Instruments | 5000 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | - | - | 484-BBGA Exposed Pad | YES | 484 | - | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 484 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.2V | - | 600MHz | - | AM3517 | 484 | - | - | 1.2V | - | - | - | 1.248V | CAN, Ethernet, I2C, SPI, UART, USB | 1.248V | 1.152V | 256kB | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 16 | - | - | 16b | - | - | - | - | ARM | YES | YES | - | FLOATING POINT | YES | 65536 | 1.8V 3.3V | 4 | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | - | 1 | - | - | - | - | LCD | - | 2.48mm | - | 23mm | 23mm | 1.78mm | No | No SVHC | ROHS3 Compliant | Lead Free | ||
AM3505AZER Texas Instruments | 600 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | - | - | 484-BBGA Exposed Pad | YES | 484 | - | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 484 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.2V | - | 600MHz | - | AM3505 | 484 | - | - | 1.2V | - | - | - | 1.248V | I2C, UART | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 16 | - | - | 32b | - | - | - | - | ARM | YES | YES | - | FLOATING POINT | YES | 65536 | 1.8V 3.3V | 4 | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | - | 1 | - | - | - | - | LCD | - | 2.48mm | - | 23mm | 23mm | 1.78mm | - | - | ROHS3 Compliant | Lead Free | ||
 MCIMX6L2EVN10AB NXP USA Inc. | 36 | - | Datasheet | 15 Weeks | - | - | - | 432-TFBGA | YES | - | - | 162 | - | - | -40°C~105°C TA | Tray | 2002 | i.MX6SL | e1 | - | Active | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.5mm | - | 40 | MCIMX6 | - | S-PBGA-B | Not Qualified | - | 1.5V | - | 1.375V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | - | - | - | - | 16 | - | YES | YES | 32 | FIXED POINT | YES | 32000 | 1.2V 1.8V 3.0V | - | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | - | - | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | 1.1mm | 13mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8347VRAGDB NXP USA Inc. | 2581 |
| Datasheet | 12 Weeks | - | - | - | 620-BBGA Exposed Pad | YES | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | - | 40 | MPC8347 | - | S-PBGA-B620 | - | - | 1.26V | 1.2V | 1.14V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | PowerPC e300 | - | 66MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 2.5V 3.3V | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | - | - | - | - | - | - | - | - | - | - | 2.46mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
MCIMX6G1CVM05AB NXP USA Inc. | 12409 |
| Datasheet | 15 Weeks | - | - | - | 289-LFBGA | YES | - | - | 131 | - | - | -40°C~105°C TJ | Tray | 2002 | i.MX6UL | - | - | Active | 3 (168 Hours) | 289 | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B289 | - | - | 1.3V | - | 1.15V | - | - | - | - | - | - | 528MHz | - | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | 16 | - | YES | - | 16 | - | - | 128000 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | - | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LVDS | - | - | 1.32mm | 14mm | - | - | - | - | ROHS3 Compliant | - | ||
 AT91SAM9N12-CUR Microchip Technology | 30 |
| Datasheet | 10 Weeks | - | - | - | 217-LFBGA | YES | 217 | ROM | 105 | - | - | -40°C~85°C TA | Cut Tape (CT) | 1997 | SAM9N | e8 | yes | Active | 3 (168 Hours) | 217 | - | Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5) | - | BOTTOM | BALL | - | - | 0.8mm | 400MHz | - | AT91SAM9N12 | - | - | - | - | - | 11.8/3.33.3V | - | - | EBI/EMI, I2C, SPI, UART, USART, USB | 1.1V | 900mV | 128kB | Internal | - | - | MICROPROCESSOR, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | - | 32 | - | - | - | - | - | - | - | ARM | - | - | - | - | - | - | 1.8V 3.3V | - | - | - | 1 Core 32-Bit | No | LPDDR, LPDDR2, DDR2, SDR, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | - | - | - | - | LCD, Touchscreen | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8280CVVUPEA NXP USA Inc. | 103 | - | Datasheet | 18 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | e1 | - | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | - | 40 | MPC8280 | - | S-PBGA-B480 | - | - | 1.6V | 1.53.3V | 1.45V | - | - | - | - | - | - | 450MHz | - | MICROPROCESSOR, RISC | PowerPC G2_LE | - | - | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 64 | FLOATING POINT | YES | - | 3.3V | - | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | - | ROHS3 Compliant | - | ||
AM4376BZDND80 Texas Instruments | 42 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | - | Surface Mount | 491-LFBGA | - | 491 | - | - | - | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 1.26V | - | 800MHz | - | AM4376 | 491 | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | 32b | - | - | - | - | ARM | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | 6 | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | - | 1 | - | - | - | Crypto Accelerator | TSC, WXGA | - | 1.3mm | - | 17mm | 17mm | 900μm | - | - | ROHS3 Compliant | Lead Free | ||
 MPC8313CVRADDC NXP USA Inc. | 5000 |
| Datasheet | 8 Weeks | - | - | - | 516-BBGA Exposed Pad | YES | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8313 | - | S-PBGA-B516 | - | - | 1.05V | 11.8/2.53.3V | 0.95V | - | - | - | - | - | - | 267MHz | - | MICROPROCESSOR | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | - | - | - | - | - | - | - | - | - | 2.55mm | 27mm | - | - | - | - | ROHS3 Compliant | - | ||
AM4377BZDND100 Texas Instruments | 10000 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | - | Surface Mount | 491-LFBGA | - | 491 | - | - | - | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 1.325V | - | 1GHz | - | AM4377 | 491 | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | 32b | - | - | - | - | ARM | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | 6 | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | - | 1 | - | - | - | Crypto Accelerator | TSC, WXGA | - | 1.3mm | - | 17mm | 17mm | 900μm | - | - | ROHS3 Compliant | Lead Free | ||
AM4377BZDNA80 Texas Instruments | 27 |
| Datasheet | 12 Weeks | ACTIVE (Last Updated: 3 days ago) | - | Surface Mount | 491-LFBGA | - | 491 | - | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 1.26V | - | 800MHz | - | AM4377 | 491 | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | 32b | - | - | - | - | ARM | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | 6 | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | - | 1 | - | - | - | Crypto Accelerator | TSC, WXGA | - | 1.3mm | - | 17mm | 17mm | 900μm | - | - | ROHS3 Compliant | Lead Free | ||
 AM5718AABCXEA Texas Instruments | 41 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | - | - | 760-BFBGA, FCBGA | YES | 760 | - | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 760 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 1.15V | 0.8mm | - | - | AM5718 | - | - | - | - | 1.2V | - | 1.11V | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | - | 38.4MHz | - | - | - | - | - | - | - | - | - | YES | YES | - | FIXED POINT | NO | 524288 | 1.8V 3.3V | 10 | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | - | - | - | - | - | - | HDMI | SATA 3Gbps (1) | 2.96mm | - | 23mm | 23mm | 2.39mm | - | - | ROHS3 Compliant | - | ||
 LS1046ASE8T1A NXP USA Inc. | 2721 | - | Datasheet | 18 Weeks | - | - | - | 780-FBGA, FCBGA | YES | - | - | 76 | - | - | 0°C~105°C | Tray | 2016 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 780 | - | - | - | BOTTOM | BALL | 250 | 1V | 0.8mm | - | 30 | - | - | S-PBGA-B780 | - | - | 1.03V | - | 0.97V | - | - | - | - | - | - | 1.8GHz | - | - | ARM® Cortex®-A72 | - | - | - | - | - | - | - | - | - | 14 | - | YES | - | 64 | - | - | - | - | - | - | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | - | DDR4 | USB 3.0 (3) + PHY | - | - | - | - | I2C, PCI, SPI, UART, USB | - | - | Secure Boot, TrustZone® | - | SATA 6Gbps (1) | - | 2.61mm | 23mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6DP5EYM1AA NXP USA Inc. | 335 |
| Datasheet | 15 Weeks | - | - | - | 624-LFBGA, FCBGA | YES | - | - | - | - | - | -20°C~105°C TJ | Tray | 2002 | i.MX6DP | - | - | Active | 3 (168 Hours) | 624 | 5A992 | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | NOT SPECIFIED | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.35V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | 26 | - | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | - | 10/100/1000Mbps (1) | 2 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | - | - | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | - | 1.6mm | 21mm | - | - | - | - | ROHS3 Compliant | - |