- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Memory Types | Number of I/Os | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Bit Size | Data Bus Width | Number of Timers/Counters | Address Bus Width | Core Architecture | Max Frequency | Boundary Scan | Low Power Mode | External Data Bus Width | Number of Programmable I/O | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | Number of Cores | Bus Compatibility | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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![]() AM4372BZDN80 Texas Instruments | 30000 |
| Datasheet | 8 Weeks | ACTIVE (Last Updated: 6 days ago) | - | - | 491-LFBGA | YES | 491 | - | - | - | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 491 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | - | 1.26V | 0.65mm | - | - | - | AM4372 | - | - | - | - | 1.326V | - | 1.21V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 26MHz | 32 | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | 65536 | 1.8V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | - | Multimedia; NEON™ SIMD | - | - | Crypto Accelerator | TSC, WXGA | 64 | - | 1.3mm | - | 17mm | 17mm | 900μm | - | - | ROHS3 Compliant | - | ||
![]() MCIMX6Y2CVM05AA NXP USA Inc. | 20000 |
| Datasheet | 14 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | - | - | -40°C~105°C TJ | Tray | 2002 | i.MX6 | - | - | Obsolete | 3 (168 Hours) | 289 | 5A992 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | - | 0.8mm | compliant | - | - | - | - | S-PBGA-B289 | - | - | 1.5V | - | 1.275V | - | - | - | - | - | - | 528MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | - | 528MHz | - | - | - | 16 | - | - | YES | - | 16 | - | - | - | - | 1.8V 2.8V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | 1 | Multimedia; NEON™ MPE | - | ETHERNET, I2C, PCI, SPI, UART, USB | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | - | - | 1.32mm | 14mm | - | - | - | - | RoHS Compliant | - | ||
![]() AM3352ZCZD72 Texas Instruments | 5 | - | Datasheet | - | - | Copper, Silver, Tin | - | 324-LFBGA | YES | 324 | - | 1.713814g | Cache, RAM, ROM | - | - | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Obsolete | 3 (168 Hours) | 324 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | 260 | 1.26V | 0.8mm | - | 720MHz | - | AM3352 | 324 | - | - | - | - | - | - | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | 1.89V | 1.71V | 320kB | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | 32b | - | 28 | ARM | - | YES | YES | - | - | FIXED POINT | YES | - | 1.8V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | - | Multimedia; NEON™ SIMD | 1 | - | Cryptography, Random Number Generator | LCD, Touchscreen | - | - | - | - | - | - | - | No | No SVHC | ROHS3 Compliant | Lead Free | ||
![]() MPC8313VRAFFC NXP USA Inc. | 30 | - | Datasheet | 8 Weeks | - | - | - | 516-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | 40 | MPC8313 | - | S-PBGA-B516 | - | - | 1.05V | 11.8/2.53.3V | 0.95V | - | - | - | - | - | - | 333MHz | - | MICROPROCESSOR, RISC | PowerPC e300c3 | - | 133MHz | 32 | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | - | - | - | - | - | - | - | - | 2.55mm | 27mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8313ECVRAFFC NXP USA Inc. | 2 | - | Datasheet | 8 Weeks | - | - | - | 516-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | 40 | MPC8313 | - | S-PBGA-B516 | - | - | 1.05V | 11.8/2.53.3V | 0.95V | - | - | - | - | - | - | 333MHz | - | MICROPROCESSOR | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | 32 | - | - | YES | YES | 32 | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | - | Security; SEC 2.2 | - | - | Cryptography | - | - | - | - | 2.55mm | 27mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() P2020NXE2MHC NXP USA Inc. | 960 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | - | - | 40 | P2020 | - | S-PBGA-B689 | - | - | - | 1.05V | - | - | - | - | - | - | - | 1.2GHz | - | MICROPROCESSOR | PowerPC e500v2 | - | - | 32 | - | - | - | - | - | YES | - | - | - | FLOATING POINT | YES | - | - | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Security; SEC 3.3 | - | - | Cryptography, Random Number Generator | - | - | - | - | 2.46mm | 31mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() AM4377BZDNA100 Texas Instruments | 32 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | - | Surface Mount | 491-LFBGA | - | 491 | - | - | - | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | - | 1.325V | - | - | 1GHz | - | AM4377 | 491 | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | 32b | - | - | ARM | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | - | Multimedia; NEON™ SIMD | 1 | - | Crypto Accelerator | TSC, WXGA | - | - | 1.3mm | - | 17mm | 17mm | 900μm | - | - | ROHS3 Compliant | Lead Free | ||
![]() P1022NXN2LFB NXP USA Inc. | 2783 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | -40°C~125°C TA | Tray | 2002 | QorIQ P1 | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | 40 | P1022 | - | S-PBGA-B689 | - | - | 1.05V | - | 0.95V | - | - | - | - | - | - | 1.067GHz | - | MICROPROCESSOR, RISC | PowerPC e500v2 | - | 133MHz | 32 | - | - | - | - | - | YES | YES | - | - | FIXED POINT | YES | - | - | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | - | - | - | - | - | LCD | - | SATA 3Gbps (2) | - | 2.46mm | 31mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MPC8309CVMAGDCA NXP USA Inc. | 43 | - | - | 10 Weeks | - | - | - | 489-LFBGA | YES | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e1 | - | Active | 3 (168 Hours) | 489 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | - | - | 40 | MPC8309 | - | S-PBGA-B489 | - | - | 1.05V | 1V | 0.95V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR, RISC | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DDR2 | USB 2.0 (1) | CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM | - | Communications; QUICC Engine | - | - | - | - | - | - | - | 1.61mm | 19mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX7D3DVK10SC NXP USA Inc. | 5422 |
| Datasheet | 12 Weeks | - | - | - | 488-TFBGA | YES | - | - | - | - | - | - | - | 0°C~95°C TJ | Tray | 2012 | i.MX7D | - | - | Active | 3 (168 Hours) | 488 | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.1V | 0.4mm | - | - | - | - | - | S-PBGA-B488 | - | - | 1.25V | - | 1.045V | - | - | - | - | - | - | 1.0GHz | - | MULTIFUNCTION PERIPHERAL | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | - | - | - | - | 16 | - | - | YES | - | 32 | - | - | - | - | 1.8V 3.3V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | - | Multimedia; NEON™ MPE | - | - | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | - | - | 1.1mm | 12mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() AT91SAM9XE512-CU Microchip Technology | In Stock | - | Datasheet | - | - | - | Surface Mount | 217-LFBGA | - | 217 | 217-LFBGA (15x15) | - | FLASH, ROM | 96 | - | Yes | -40°C~85°C TA | Tray | 1997 | SAM9XE | - | - | Obsolete | 3 (168 Hours) | - | - | - | 85°C | -40°C | - | - | - | - | - | - | - | 180MHz | - | AT91SAM9XE512 | - | - | - | 3.3V | - | - | - | - | 2-Wire, EBI/EMI, Ethernet, I2C, I2S, MMC, SPI, UART, USART, USB | 3.6V | 1.65V | 32kB | Internal | 180MHz | 32kB | - | ARM926EJ-S | Brown-out Detect/Reset, POR, PWM, WDT | - | - | 32b | 6 | - | ARM | 180MHz | - | - | - | 96 | - | - | - | 1.8V 2.5V 3.3V | - | 10/100Mbps | 1 Core 32-Bit | No | SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | - | - | - | - | - | LCD, Touchscreen | - | - | - | - | 15mm | - | - | No | No SVHC | ROHS3 Compliant | - | ||
![]() MPC8314ECVRAGDA NXP USA Inc. | 300 |
| Datasheet | 10 Weeks | - | - | - | 620-BBGA Exposed Pad | YES | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 5A002.A.1 | TIN COPPER/TIN SILVER | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | - | 40 | MPC8314 | - | S-PBGA-B620 | - | - | 1.05V | 13.3V | 0.95V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | PowerPC e300c3 | - | 66.67MHz | 32 | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | - | Security; SEC 3.3 | - | - | Cryptography, Random Number Generator | - | - | - | - | 2.46mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX515DJM8C NXP USA Inc. | In Stock | - | - | 15 Weeks | - | - | - | 529-LFBGA | YES | - | - | - | - | - | - | - | -20°C~85°C TC | Tray | 1997 | i.MX51 | e1 | - | Active | 3 (168 Hours) | 529 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | - | - | 40 | MCIMX515 | - | S-PBGA-B529 | Not Qualified | - | 1.15V | 1.2V | 1.05V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2V 1.875V 2.775V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keypad, LCD | - | - | - | 1.6mm | 19mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() AM1705DPTPA3 Texas Instruments | 34 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | - | Surface Mount | 176-LQFP Exposed Pad | - | 176 | - | - | L1 Cache, RAM, ROM | - | - | - | -40°C~105°C TJ | Tray | - | Sitara™ | e4 | yes | Active | 4 (72 Hours) | 176 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | - | QUAD | GULL WING | 260 | 1.3V | 0.5mm | - | 375MHz | - | AM1705 | - | - | - | 1.2V | - | - | - | - | Ethernet, I2C, SPI, UART, USB | 1.32V | 1.14V | - | - | - | 128kB | MICROPROCESSOR, RISC | ARM926EJ-S | - | - | 32 | 32b | - | - | ARM | - | YES | YES | - | - | FIXED POINT | YES | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | - | System Control; CP15 | 1 | - | - | - | - | - | 1.6mm | - | 24mm | 24mm | 1.4mm | - | - | ROHS3 Compliant | Lead Free | ||
![]() MPC8548ECVJAQGD NXP USA Inc. | In Stock | - | Datasheet | 18 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Active | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Silver (Sn/Ag) | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1.1V | 1mm | - | - | - | MPC8548 | - | S-PBGA-B783 | - | - | 1.155V | 1.11.8/2.52.5/3.3V | 1.045V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | 133MHz | 32 | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | - | Signal Processing; SPE, Security; SEC | - | - | Cryptography, Random Number Generator | - | - | - | - | 3.38mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX6L8DVN10AB NXP USA Inc. | 300 | - | Datasheet | 12 Weeks | - | - | - | 432-TFBGA | YES | - | - | - | - | 162 | Commercial grade | - | 0°C~95°C TJ | Tray | 2002 | i.MX6SL | e1 | - | Active | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.5mm | - | - | 40 | MCIMX6 | - | S-PBGA-B | Not Qualified | - | 1.5V | - | 1.375V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | 32 | - | - | 16 | - | - | YES | YES | 32 | - | FIXED POINT | YES | 32000 | 1.2V 1.8V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | - | 1.1mm | 13mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX27LMOP4A NXP USA Inc. | 7600 | - | Datasheet | - | - | - | - | 473-LFBGA | YES | - | - | - | - | - | - | - | -40°C~85°C TA | Tray | 2004 | i.MX27 | e1 | - | Not For New Designs | 3 (168 Hours) | 473 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | - | - | 40 | MCIMX27 | - | S-PBGA-B473 | - | - | 1.52V | - | 1.38V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | ARM926EJ-S | - | 26MHz | 32 | - | - | 26 | - | - | YES | YES | 16 | - | FIXED POINT | YES | - | 2.0V 2.5V 2.7V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | DDR | USB 2.0 + PHY (3) | 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART | - | Security; SAHARAH2 | - | - | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | Keypad, LCD | - | - | - | 1.54mm | 19mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() MCIMX6Q6AVT08AD NXP USA Inc. | 2873 | - | Datasheet | 15 Weeks | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | e1 | - | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | - | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.225V | - | - | - | - | - | - | 852MHz | - | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | 16 | - | - | YES | YES | 64 | - | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
![]() AM3357ZCZD27 Texas Instruments | In Stock | - | Datasheet | - | - | Copper, Silver, Tin | - | 324-LFBGA | YES | 324 | - | - | - | - | - | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Obsolete | 3 (168 Hours) | 324 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | - | 275MHz | NOT SPECIFIED | AM3357 | 324 | - | Not Qualified | 950mV | - | 0.95/1.10.95/1.26V | - | 1.15V | CAN, I2C, SPI, UART | - | - | 64kB | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | 32b | - | 28 | ARM | - | YES | YES | - | - | FIXED POINT | YES | - | 1.8V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | - | Multimedia; NEON™ SIMD | - | - | Cryptography, Random Number Generator | LCD, Touchscreen | - | - | - | 1.4mm | 15mm | - | - | - | - | ROHS3 Compliant | Lead Free | ||
![]() AM3352BZCED60 Texas Instruments | 15 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | Copper, Silver, Tin | - | 298-LFBGA | YES | 298 | - | - | ROM | - | - | - | -40°C~90°C TJ | Tube | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 298 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | BOTTOM | BALL | 260 | 1.1V | - | - | 600MHz | NOT SPECIFIED | AM3352 | - | - | Not Qualified | 1.1V | - | - | - | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | - | - | 64kB | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | 32 | 32b | 10 | - | ARM | - | YES | YES | - | - | FIXED POINT | YES | - | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | - | Multimedia; NEON™ SIMD | 1 | - | Cryptography, Random Number Generator | LCD, Touchscreen | - | - | 1.3mm | - | 13mm | 13mm | 890μm | - | - | ROHS3 Compliant | Lead Free |