- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | ROM(word) | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Capacitance | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | DAC Channels | Address Bus Width | Core Architecture | CPU Family | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Speed Grade | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Serial I/Os | Co-Processors/DSP | ROM Programmability | Number of Cores | Bus Compatibility | On Chip Data RAM Width | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 ATSAMA5D27C-D1G-CUR Microchip Technology | 3000 | - | Datasheet | 10 Weeks | - | - | - | 289-TFBGA | YES | - | - | - | - | - | - | -40°C~85°C TA | Tray | - | SAMA5D2 | - | - | Active | 3 (168 Hours) | 289 | - | - | 8542.31.00.01 | - | BOTTOM | BALL | - | 1.8V | 0.8mm | - | - | ATSAMA5D27 | - | S-PBGA-B289 | - | 1.9V | - | 1.7V | - | - | - | - | - | 500MHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 24MHz | 16 | - | - | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | - | YES | 65536 | 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | 9 | Multimedia; NEON™ MPE | - | - | - | 16 | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 51 | - | - | 1.2mm | 14mm | - | - | - | - | Non-RoHS Compliant | - | ||
 P1020NXE2HFB NXP USA Inc. | 465 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | - | Active | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | P1020 | - | S-PBGA-B689 | - | - | 1V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR CIRCUIT | PowerPC e500v2 | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.5V 3.3V | - | 10/100/1000Mbps (3) | 2 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | Security; SEC 3.3 | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | 2.46mm | 31mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX7D5EVM10SC NXP USA Inc. | 11 | - | Datasheet | 18 Weeks | - | - | - | 541-LFBGA | YES | - | - | - | - | - | - | -20°C~105°C TJ | Tray | 2012 | i.MX7D | - | - | Active | 3 (168 Hours) | 541 | - | - | 8542.31.00.01 | - | BOTTOM | BALL | - | 1.1V | 0.75mm | - | - | - | - | S-PBGA-B541 | - | 1.155V | - | 1.045V | - | - | - | - | - | 1.0GHz | - | - | ARM® Cortex®-A7, ARM® Cortex®-M4 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 3.3V | - | 10/100/1000Mbps (2) | 2 Core 32-Bit | No | LPDDR2, LPDDR3, DDR3, DDR3L | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | - | Multimedia; NEON™ MPE | - | - | - | - | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | Keypad, LCD, MIPI | - | - | - | 1.4mm | 19mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX281AVM4B NXP USA Inc. | 760 | - | Datasheet | 15 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | Automotive grade | -40°C~85°C TA | Tray | 2002 | i.MX28 | e1 | - | Active | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.5V | 0.8mm | - | 40 | MCIMX281 | - | S-PBGA-B289 | - | 1.55V | 1.41.8V | 1.35V | - | - | - | - | - | 454MHz | - | MICROPROCESSOR, RISC | ARM926EJ-S | 24MHz | 32 | - | - | - | - | - | - | - | - | YES | YES | AEC-Q100 | - | FIXED POINT | - | YES | - | 1.8V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | Data; DCP | - | - | - | - | Boot Security, Cryptography, Hardware ID | Keypad | - | - | - | 1.37mm | 14mm | - | - | - | - | ROHS3 Compliant | - | ||
MCIMX286DVM4B NXP USA Inc. | 450 |
| Datasheet | 15 Weeks | - | - | - | 289-LFBGA | YES | - | - | - | - | - | - | -20°C~70°C TA | Tray | 2002 | i.MX28 | e1 | - | Active | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | BOTTOM | BALL | - | - | 0.8mm | - | - | MCIMX286 | - | S-PBGA-B289 | - | 1.55V | - | 1.35V | - | - | - | - | - | 454MHz | - | MULTIFUNCTION PERIPHERAL | ARM926EJ-S | 24MHz | - | - | - | - | - | - | - | - | - | YES | - | - | - | - | - | - | 128000 | 1.8V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 4 | Data; DCP | - | - | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | - | Boot Security, Cryptography, Hardware ID | Keypad, LCD, Touchscreen | - | - | - | 1.37mm | 14mm | - | - | - | - | ROHS3 Compliant | - | ||
 AM1808EZCE4 Texas Instruments | 10 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | - | - | 361-LFBGA | YES | 361 | - | - | - | - | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | 1.3V | 0.65mm | 456MHz | - | AM1808 | - | - | - | - | - | - | - | - | 1.35V | 1.25V | 32kB | - | - | MICROPROCESSOR, RISC | ARM926EJ-S | - | 32 | - | - | - | - | - | - | ARM | - | YES | YES | - | - | FIXED POINT | - | YES | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | - | System Control; CP15 | - | 1 | - | - | - | LCD | - | SATA 3Gbps (1) | 1.3mm | - | 13mm | 13mm | 890μm | - | No SVHC | ROHS3 Compliant | Lead Free | ||
 MPC8548CVJAQGD NXP USA Inc. | 2427 |
| Datasheet | 18 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Active | 3 (168 Hours) | 783 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.1V | 1mm | - | 40 | MPC8548 | - | S-PBGA-B783 | - | 1.155V | 1.11.8/2.52.5/3.3V | 1.045V | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | - | - | - | - | - | 64 | - | - | YES | YES | - | 64 | FLOATING POINT | - | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | - | Signal Processing; SPE | - | - | - | - | - | - | - | - | - | 3.294mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
 MVF51NN151CMK50 NXP USA Inc. | 10 | - | Datasheet | 15 Weeks | - | - | - | 364-LFBGA | YES | - | - | - | 131 | 0 | - | -40°C~85°C TA | Tray | 2002 | Vybrid, VF5xx | e1 | - | Active | 3 (168 Hours) | 364 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.23V | 0.8mm | - | 40 | MVF51NN151 | - | S-PBGA-B364 | Not Qualified | 1.26V | 3.3V | 1.16V | - | - | - | - | - | 500MHz | - | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | - | 16 | YES | YES | - | NO | YES | 16 | - | CORTEX-A5 | - | - | - | 16 | - | - | - | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | - | Multimedia; NEON™ MPE | FLASH | - | - | - | - | DCU, GPU, LCD, VideoADC, VIU | - | - | - | - | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
 AM5716AABCXA Texas Instruments | 10000 | - | Datasheet | 12 Weeks | ACTIVE (Last Updated: 5 days ago) | - | - | 760-BFBGA, FCBGA | YES | 760 | - | - | - | - | Automotive grade | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 760 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | - | 1.15V | 0.8mm | - | - | AM5716 | - | - | - | 1.2V | - | 1.11V | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | - | - | - | - | - | - | - | - | - | YES | YES | - | - | FIXED POINT | - | NO | - | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | - | Multimedia; GPU, IPU, VFP | - | - | - | - | - | - | - | SATA 3Gbps (1) | 2.96mm | - | 23mm | 23mm | 2.39mm | - | - | ROHS3 Compliant | - | ||
 MCIMX6Y2DVM09AB NXP USA Inc. | 3800 | - | Datasheet | 18 Weeks | - | - | - | 289-LFBGA | - | - | - | - | - | - | - | 0°C~95°C TJ | Tray | 2015 | i.MX6 | - | - | Active | 3 (168 Hours) | - | - | - | 8542.39.00.01 | - | - | - | 260 | - | - | - | 40 | - | - | - | - | - | - | - | - | - | - | - | - | 900MHz | - | - | ARM® Cortex®-A7 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.8V 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | - | Multimedia; NEON™ MPE | - | - | - | - | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
P1011NXN2DFB NXP USA Inc. | 419 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | - | - | 689-TEPBGA II (31x31) | - | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | P1011 | - | - | - | - | - | - | - | - | - | - | - | 800MHz | - | - | PowerPC e500v2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6Q6AVT10AC NXP USA Inc. | 1000 | - | Datasheet | 15 Weeks | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | e1 | - | Not For New Designs | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | - | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | MCIMX6 | - | S-PBGA-B624 | - | 1.5V | - | 1.35V | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | - | 16 | - | - | YES | YES | - | 64 | FIXED POINT | - | YES | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
 OMAP3530ECUSA Texas Instruments | 20 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 4 days ago) | Copper, Silver, Tin | Surface Mount | 423-LFBGA, FCBGA | - | 423 | - | L2 Cache, ROM, SRAM | - | - | - | -40°C~105°C TJ | Tray | - | OMAP-35xx | e1 | - | Active | 4 (72 Hours) | 423 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | 260 | - | 0.65mm | 600MHz | - | OMAP3530 | 423 | - | - | - | - | - | 1.35V | I2C, SPI, UART, USB | 1.35V | 985mV | 112kB | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | - | - | - | 32b | - | - | - | ARM | - | - | - | - | - | - | - | - | - | 1.8V 3.0V | 3 | - | 1 Core 32-Bit | Yes | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | - | Signal Processing; C64x+, Multimedia; NEON™ SIMD | - | 1 | - | - | - | LCD | - | - | 1.4mm | - | 16mm | 16mm | 960μm | No | - | ROHS3 Compliant | Lead Free | ||
OMAPL138EZCED4 Texas Instruments | 1981 | - | Datasheet | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Copper, Silver, Tin | - | 361-LFBGA | YES | 361 | - | - | - | - | - | -40°C~90°C TJ | Tray | - | OMAP-L1x | e1 | yes | Active | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 3pF | BOTTOM | BALL | 260 | 1.3V | 0.65mm | 456MHz | - | OMAPL138 | 361 | - | - | - | - | - | - | - | - | - | - | - | 328kB | MICROPROCESSOR CIRCUIT | ARM926EJ-S | - | - | - | - | 32b | - | - | - | ARM | - | - | - | - | - | - | 456 MHz | - | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | - | Signal Processing; C674x, System Control; CP15 | - | 1 | I2C; SPI; UART; USB | - | Boot Security, Cryptography | LCD | - | SATA 3Gbps (1) | 1.3mm | - | 13mm | 13mm | 890μm | - | - | ROHS3 Compliant | Lead Free | ||
 FS32V234CMN1VUB NXP USA Inc. | 15 |
| Datasheet | 22 Weeks | - | - | - | 621-FBGA, FCBGA | YES | - | - | - | - | - | - | -40°C~105°C TA | Tray | 2015 | - | - | - | Active | 3 (168 Hours) | 621 | 5A992 | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1V | 0.65mm | - | 40 | - | - | S-PBGA-B621 | - | 1.05V | - | 0.95V | - | - | - | - | - | 1GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A53, ARM® Cortex®-M4 | - | 64 | - | - | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | - | YES | - | 1V 1.8V 3.3V | - | 1Gbps | 4 Core 64-Bit/1 Core 32-Bit | Yes | DDR3, DDR3L, LPDDR2 | - | I2C, SPI, PCI, UART | - | Multimedia; NEON™ MPE | - | - | - | - | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | - | - | - | 2.44mm | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
 LS1020AXN7KQB NXP USA Inc. | 2755 | - | Datasheet | 18 Weeks | - | - | - | 525-FBGA, FCBGA | YES | - | - | - | - | - | - | -40°C~105°C | Tray | 2002 | QorIQ® Layerscape | - | - | Active | 3 (168 Hours) | 525 | 3A991.A.1 | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1V | 0.8mm | - | 40 | - | - | S-PBGA-B525 | - | 1.03V | - | 0.97V | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 133.3MHz | 32 | - | - | - | - | - | 16 | - | - | YES | YES | - | 32 | FLOATING POINT | - | YES | - | - | - | GbE (3) | 2 Core 32-Bit | - | DDR3L, DDR4 | USB 2.0 (1), USB 3.0 + PHY | - | - | Multimedia; NEON™ SIMD | - | - | - | - | Secure Boot, TrustZone® | - | - | SATA 3Gbps (1) | - | 2.07mm | 19mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8314EVRAGDA NXP USA Inc. | 104 |
| Datasheet | 10 Weeks | - | - | - | 620-BBGA Exposed Pad | YES | - | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8314 | - | S-PBGA-B620 | - | 1.05V | 13.3V | 0.95V | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | - | - | - | - | YES | YES | - | - | FLOATING POINT | - | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | - | Security; SEC 3.3 | - | - | - | - | Cryptography, Random Number Generator | - | - | - | - | 2.46mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8270CZUUPEA NXP USA Inc. | 2825 | - | Datasheet | 18 Weeks | - | - | - | 480-LBGA Exposed Pad | YES | - | - | - | - | - | - | -40°C~105°C TA | Tray | 1997 | MPC82xx | e0 | - | Active | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | - | BOTTOM | BALL | 260 | 1.5V | 1.27mm | - | 40 | MPC8270 | - | S-PBGA-B480 | - | 1.6V | 1.53.3V | 1.45V | - | - | - | - | - | 450MHz | - | MICROPROCESSOR, RISC | PowerPC G2_LE | 450MHz | 32 | - | - | - | - | - | 32 | - | - | YES | NO | - | 64 | FLOATING POINT | - | YES | - | 3.3V | - | 10/100Mbps (3) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | 1.65mm | 37.5mm | - | - | - | - | Non-RoHS Compliant | - | ||
AM5716AABCXEA Texas Instruments | 10 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | - | - | 760-BFBGA, FCBGA | YES | 760 | - | - | - | - | Automotive grade | -40°C~105°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 760 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | BOTTOM | BALL | - | 1.15V | 0.8mm | - | - | AM5716 | - | - | - | 1.2V | - | 1.11V | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | - | - | - | - | - | - | - | - | - | YES | YES | - | - | FIXED POINT | - | NO | - | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | No | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | - | Multimedia; GPU, IPU, VFP | - | - | - | - | - | - | - | SATA 3Gbps (1) | 2.96mm | - | 23mm | 23mm | 2.39mm | - | - | ROHS3 Compliant | - | ||
MCIMX6QP6AVT1AB NXP USA Inc. | 600 | - | Datasheet | 15 Weeks | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6QP | - | - | Active | 3 (168 Hours) | 624 | - | - | 8542.31.00.01 | - | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | 1.5V | - | 1.35V | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | - | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | - | - | ROHS3 Compliant | - |