- Manufacturer
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Attribute column
Categories
Embedded - Microprocessors
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Weight | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Voltage | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Clock Frequency | Bit Size | Has ADC | DMA Channels | Data Bus Width | PWM Channels | Address Bus Width | Core Architecture | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Timers | Co-Processors/DSP | Number of Cores | Bus Compatibility | Barrel Shifter | Internal Bus Architecture | Security Features | Display & Interface Controllers | SATA | Height | Height Seated (Max) | Length | Width | Thickness | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 AM4378BZDND80 Texas Instruments | 1 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | - | Surface Mount | 491-LFBGA | - | 491 | - | - | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Active | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | - | 1.26V | - | 800MHz | - | AM4378 | 491 | - | - | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 32 | - | - | 32b | - | - | ARM | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | - | Multimedia; NEON™ SIMD | 1 | - | - | - | Crypto Accelerator | TSC, WXGA | - | 1.3mm | - | 17mm | 17mm | 900μm | - | - | ROHS3 Compliant | Lead Free | ||
 MCIMX6L3DVN10AB NXP USA Inc. | 640 |
| Datasheet | 15 Weeks | - | - | - | 432-TFBGA | YES | - | - | - | 162 | 0°C~95°C TJ | Tray | 2002 | i.MX6SL | e1 | - | Active | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | - | 0.5mm | - | 40 | MCIMX6 | - | S-PBGA-B | Not Qualified | - | 1.5V | - | 1.375V | - | - | - | - | - | - | 1.0GHz | - | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | - | 32 | - | - | - | - | 16 | - | YES | YES | 32 | FIXED POINT | YES | 32000 | 1.2V 1.8V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | 1.1mm | 13mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8247VRTIEA NXP USA Inc. | 3209 |
| Datasheet | 12 Weeks | - | - | - | 516-BBGA | YES | - | - | - | 57 | 0°C~105°C TA | Tray | 1994 | MPC82xx | e2 | - | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC8247 | - | S-PBGA-B516 | - | - | 1.575V | 1.53.3V | 1.425V | - | - | - | - | - | - | 400MHz | - | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | - | NO | 30 | - | - | - | 64 | - | - | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | - | 27mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX502CVK8B NXP USA Inc. | 7 |
| Datasheet | 15 Weeks | - | - | - | 416-LFBGA | YES | - | - | - | - | 0°C~70°C TA | Tray | 2008 | i.MX50 | e1 | - | Active | 3 (168 Hours) | 416 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 0.5mm | - | 40 | MCIMX502 | - | S-PBGA-B416 | Not Qualified | - | 1.15V | - | 0.95V | - | - | - | - | - | - | 800MHz | - | MICROPROCESSOR CIRCUIT | ARM® Cortex®-A8 | 800MHz | - | - | - | - | - | - | - | YES | - | - | - | - | 131072 | 1.2V 1.875V 2.775V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | Boot Security, Cryptography, Secure JTAG | LCD | - | - | 1.52mm | 13mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6Q4AVT08AD NXP USA Inc. | 2544 |
| Datasheet | 15 Weeks | - | - | - | 624-FBGA, FCBGA | YES | - | - | - | - | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | e1 | - | Active | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.225V | - | - | - | - | - | - | 852MHz | - | MICROPROCESSOR | ARM® Cortex®-A9 | - | - | - | - | - | - | 16 | - | YES | YES | 64 | FIXED POINT | YES | - | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 4 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | - | 2.16mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
 AM3354ZCZD72 Texas Instruments | 3880 | - | Datasheet | - | - | Copper, Silver, Tin | - | 324-LFBGA | YES | 324 | - | ROM | - | -40°C~90°C TJ | Tray | - | Sitara™ | e1 | yes | Obsolete | 3 (168 Hours) | 324 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.26V | 0.8mm | 720MHz | - | AM3354 | 324 | - | - | - | - | 0.95/1.10.95/1.26V | - | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | 1.2V | 1V | 290kB | - | - | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | - | 32 | - | - | 32b | - | 28 | ARM | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | Yes | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | - | Multimedia; NEON™ SIMD | - | - | - | - | Cryptography, Random Number Generator | LCD, Touchscreen | - | - | 1.4mm | 15mm | - | - | No | No SVHC | ROHS3 Compliant | Lead Free | ||
 P1010NSN5DFB NXP USA Inc. | 8 |
| Datasheet | 12 Weeks | - | - | - | 425-FBGA | - | - | - | - | - | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | P1010 | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.0GHz | - | - | PowerPC e500v2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 10/100/1000Mbps (3) | 1 Core 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | - | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX6S5DVM10AD NXP USA Inc. | 10 | - | Datasheet | 15 Weeks | - | - | - | 624-LFBGA | YES | - | - | - | 14 | 0°C~95°C TJ | Tray | 2017 | i.MX6S | - | - | Active | 3 (168 Hours) | 624 | - | - | 8542.39.00.01 | BOTTOM | BALL | 260 | - | 0.8mm | - | 40 | - | - | S-PBGA-B624 | - | - | 1.5V | - | 1.35V | - | - | - | - | - | - | 1.0GHz | - | - | ARM® Cortex®-A9 | - | - | - | - | - | - | 26 | - | YES | - | 32 | - | - | 144K | 1.8V 2.5V 2.8V 3.3V | - | 10/100/1000Mbps (1) | 1 Core 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | - | Multimedia; NEON™ SIMD | - | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | - | - | 1.6mm | 21mm | - | - | - | - | ROHS3 Compliant | - | ||
 P4080NXN7MMC NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 1295-BBGA, FCBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 2002 | QorIQ P4 | e1 | - | Active | 3 (168 Hours) | - | 3A991.A.1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | - | 30 | P4080 | - | S-PBGA-B1295 | - | - | 1.05V | - | 0.95V | - | - | - | - | - | - | 1.5GHz | - | MICROPROCESSOR, RISC | PowerPC e500mc | 133.3MHz | - | - | - | - | - | 32 | - | YES | YES | 16 | FIXED POINT | YES | - | 1.8V 2.5V 3.3V | - | 1Gbps (8), 10Gbps (2) | 8 Core 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | - | - | - | - | - | - | - | - | - | - | 3.53mm | 37.5mm | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX257DJM4A NXP USA Inc. | 600 | - | Datasheet | 15 Weeks | - | - | - | 400-LFBGA | YES | - | - | - | - | -20°C~70°C TA | Tray | 2005 | i.MX25 | e1 | - | Active | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | - | 40 | MCIMX257 | - | S-PBGA-B400 | - | - | 1.52V | 1.2/1.51.8/3.3V | 1.38V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | ARM926EJ-S | 24MHz | 32 | - | - | - | - | 26 | - | YES | YES | 16 | FIXED POINT | YES | - | 2.0V 2.5V 2.7V 3.0V 3.3V | - | 10/100Mbps (1) | 1 Core 32-Bit | No | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | - | - | - | - | - | - | - | Keypad, LCD, Touchscreen | - | - | 1.6mm | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
 T1023NSE7PQA NXP USA Inc. | 7 |
| Datasheet | 18 Weeks | - | - | - | 525-FBGA, FCBGA | - | - | - | - | - | 0°C~105°C TA | - | 2014 | QorIQ T1 | - | - | Active | 3 (168 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.4GHz | - | - | PowerPC e5500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | GbE (8) | 2 Core 64-Bit | No | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | - | - | - | - | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | - | SATA 3Gbps (2) | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MPC852TCVR50A NXP USA Inc. | In Stock | - | Datasheet | 12 Weeks | - | - | - | 256-BBGA | YES | - | - | - | - | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC852 | - | S-PBGA-B256 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | 66MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, PCMCIA, SPI, UART | - | Communications; CPM | - | - | - | - | - | - | - | - | 2.54mm | 23mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8377CVRALGA NXP USA Inc. | 334 | - | Datasheet | 12 Weeks | - | - | - | 689-BBGA Exposed Pad | YES | - | - | - | - | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8377 | - | S-PBGA-B689 | - | - | 1.05V | 11.8/2.52.5/3.3V | 0.95V | - | - | - | - | - | - | 667MHz | - | MICROPROCESSOR | PowerPC e300c4s | - | 32 | - | - | - | - | 15 | - | YES | YES | 64 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | - | - | - | - | - | - | - | - | SATA 3Gbps (2) | - | 2.46mm | 31mm | - | - | - | - | ROHS3 Compliant | - | ||
MPC8247CVRMIBA NXP USA Inc. | 1 |
| Datasheet | 12 Weeks | - | - | - | 516-BBGA | YES | - | - | - | - | -40°C~105°C TA | Tray | 1994 | MPC82xx | e2 | - | Active | 3 (168 Hours) | 516 | 3A991.A.2 | TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | - | 30 | MPC8247 | - | S-PBGA-B516 | - | - | 1.575V | 1.53.3V | 1.425V | - | - | - | - | - | - | 266MHz | - | MICROPROCESSOR, RISC | PowerPC G2_LE | 66.67MHz | 32 | - | - | - | - | 32 | - | YES | YES | 64 | FLOATING POINT | YES | - | 3.3V | - | 10/100Mbps (2) | 1 Core 32-Bit | No | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | - | Communications; RISC CPM | - | - | - | - | - | - | - | - | 2.55mm | 27mm | - | - | - | - | ROHS3 Compliant | - | ||
 OMAPL137DZKB4 Texas Instruments | 40 |
| Datasheet | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Copper, Silver, Tin | Surface Mount | 256-BGA | - | 256 | - | Cache, SRAM | 28 | 0°C~90°C TJ | Tray | - | OMAP-L1x | e1 | yes | Active | 3 (168 Hours) | 256 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.3V | - | 456MHz | - | OMAPL137 | - | - | - | 1.32V | - | - | - | - | SPI, USB | 1.35V | 1.14V | 64kB | External | - | 128kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | - | - | - | - | 16b | - | - | ARM | YES | YES | - | FLOATING POINT | YES | - | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | No | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | 3 | Signal Processing; C674x, System Control; CP15 | 1 | - | NO | SINGLE | - | LCD | - | 2.05mm | - | 17mm | 17mm | 1.36mm | - | - | ROHS3 Compliant | Lead Free | ||
 MPC8315EVRAGDA NXP USA Inc. | 570 |
| Datasheet | 10 Weeks | - | - | - | 620-BBGA Exposed Pad | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | - | Active | 3 (168 Hours) | 620 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | - | 40 | MPC8315 | - | S-PBGA-B620 | - | - | 1.05V | 11.8/2.53.3V | 0.95V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FLOATING POINT | YES | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (2) | 1 Core 32-Bit | No | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, PCI, SPI, TDM | - | Security; SEC 3.3 | - | - | - | - | Cryptography, Random Number Generator | - | SATA 3Gbps (2) | - | 2.46mm | 29mm | - | - | - | - | ROHS3 Compliant | - | ||
 MPC8548VJAUJD NXP USA Inc. | 2542 | - | Datasheet | 18 Weeks | - | - | - | 783-BBGA, FCBGA | YES | - | - | - | - | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | - | Active | 3 (168 Hours) | 783 | - | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | - | - | 1mm | - | - | MPC8548 | - | S-PBGA-B783 | - | - | - | 1.11.8/2.52.5/3.3V | - | - | - | - | - | - | - | 1.333GHz | - | MICROPROCESSOR, RISC | PowerPC e500 | - | 32 | - | - | - | - | - | - | - | - | - | - | - | - | 1.8V 2.5V 3.3V | - | 10/100/1000Mbps (4) | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | - | DUART, I2C, PCI, RapidIO | - | Signal Processing; SPE | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | - | ||
 MCIMX27VJP4A NXP USA Inc. | 184 |
| Datasheet | 15 Weeks | - | - | - | 404-LFBGA | YES | - | - | - | - | -20°C~85°C TA | Tray | 2004 | i.MX27 | e1 | - | Not For New Designs | 3 (168 Hours) | 404 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.65mm | - | 40 | MCIMX27 | - | S-PBGA-B404 | Not Qualified | - | 1.52V | - | 1.38V | - | - | - | - | - | - | 400MHz | - | MICROPROCESSOR | ARM926EJ-S | 26MHz | 32 | - | - | - | - | 26 | - | YES | YES | 16 | FIXED POINT | YES | - | 2.0V 2.5V 2.7V 3.0V | - | 10/100Mbps (1) | 1 Core 32-Bit | Yes | DDR | USB 2.0 + PHY (3) | 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART | - | Security; SAHARAH2 | - | - | - | - | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | Keypad, LCD | - | - | 1.4mm | 17mm | - | - | - | - | ROHS3 Compliant | - | ||
 AM1806BZWT3 Texas Instruments | 399 | - | Datasheet | - | - | Copper, Silver, Tin | Surface Mount | 361-LFBGA | - | 361 | 789.392471mg | L1 Cache, RAM, ROM | - | 0°C~90°C TJ | Tray | - | Sitara™ | e1 | - | Obsolete | 3 (168 Hours) | 361 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 375MHz | - | AM1806 | 361 | - | - | 1.2V | - | - | - | 1.32V | Ethernet, I2C, SPI, UART, USB | 1.32V | 1.14V | - | - | - | 128kB | MICROPROCESSOR, RISC | ARM926EJ-S | - | 32 | - | - | 32b | - | 23 | ARM | YES | YES | - | FIXED POINT | YES | - | 1.8V 3.3V | 3 | - | 1 Core 32-Bit | No | LPDDR, DDR2 | USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | - | System Control; CP15 | 1 | - | - | - | - | LCD | - | - | - | - | - | - | - | - | ROHS3 Compliant | Lead Free | ||
MPC852TVR50A NXP USA Inc. | 3355 | - | Datasheet | 12 Weeks | - | - | - | 256-BBGA | YES | - | - | - | - | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | - | Last Time Buy | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | - | 30 | MPC852 | - | S-PBGA-B256 | - | - | 1.9V | 1.83.3V | 1.7V | - | - | - | - | - | - | 50MHz | - | MICROPROCESSOR, RISC | - | 66MHz | 32 | - | - | - | - | 32 | - | YES | YES | 32 | FIXED POINT | YES | - | 3.3V | - | 10Mbps (1) | 1 Core 32-Bit | No | DRAM | - | HDLC/SDLC, PCMCIA, SPI, UART | - | Communications; CPM | - | - | - | - | - | - | - | - | 2.54mm | 23mm | - | - | - | - | ROHS3 Compliant | - |